Abstract: UV-hardenable and thermally hardenable epoxy resins for the underfilling process in electrical and electronic components are provided. A new casting resin component has an increased storage stability at room temperature of at least 6 months and improved characteristics for the underfilling process including faster hardening and lower viscosity. Filler material with a maximum grain size of 20 &mgr;m and a siloxane component are provided in addition to the casting resin formulation.

Abstract: A one-component epoxy resin for coverage of bare chips and for underfilling of flip chips is disclosed. Two polyol components are combined in the inventive epoxy resin which decidedly improve the properties of the resin with respect to coefficient of expansion, shrinkage stress, substrate adhesion, and reactivity.

Abstract: UV-hardenable and thermally hardenable epoxy resins for the underfilling process in electrical and electronic components are provided. A new casting resin component has an increased storage stability at room temperature of at least 6 months and improved characteristics for the underfilling process including faster hardening and lower viscosity. Filler material with a maximum grain size of 20 .mu.m and a siloxane component are provided in addition to the casting resin formulation.

Abstract: An electrooptical module includes a converter and at least one optical wave guide having an end optically coupled to the converter through a coupling gap. The coupling gap is filled with a first light-permeable material. A second light-impermeable material protects an electrical circuit disposed in the immediate vicinity of the converter from outside light. The second material is equivalent in its basic chemical composition to the first material, but is modified in its optical properties for the sake of impermeability to light. At least one bonding wire serving to trigger the converter passes through the first and second materials.

Abstract: A radiation-curable reaction resin system, comprising a homogeneous solution of a thermoplastic and a reaction resin, whereby the proportion of the thermoplastic in the solution is approximately 3 to about 50% by weight. The reaction resin system has a stable shelf life. Further, the reaction resin system can be cured by radiation to form a shaped material, comprising a continuous and a discontinuous phase and which exhibits thermoplastic-like behavior.

Abstract: Assembly of semiconductor chips is accomplished using an acrylate-based adhesive which can be cured rapidly by UV light and which gives an adhesive bond that is resistant to soldering by can be readily removed by solvents after soldering. During assembly, the back sides of the semiconductor chips are bonded to a temporary carrier by the adhesive and adjusted to the proper mirror image position on the carrier before the adhesive is cured. The chip array is then soldered on a component and the temporary carrier is removed from the chips by a solvent.

Abstract: A drop coating compound in particular, for unhoused electrical and electronic circuits and components. The compound includes highly filled ultraviolet-curable epoxy resin compounds having improved properties with respect to their use and in comparison to previously used, predominantly two-component, thermally curable resins.