Patents by Inventor Barnie A. Wallace, Jr.

Barnie A. Wallace, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6015600
    Abstract: An article (2) in which at least part of a surface (8) of a polymeric element has an embossed pattern (6). The article may be either heat-recoverable or non-heat-recoverable. If the article is heat-recoverable, when heated the article recovers and the embossed surface becomes substantially smooth. The change in surface texture can be used to indicate that sufficient heat has been applied to the article to achieve adequate recovery and/or to adequately melt an attached adhesive layer (10). In another embodiment, the article (2) is in the form of a patch (14) which can be used to secure the opposing longitudinal edges of heat-recoverable article which is in the form of a wraparound sheet.
    Type: Grant
    Filed: August 26, 1997
    Date of Patent: January 18, 2000
    Inventors: Walter J. Greuel, Jr., George Pieslak, Efrain Renteria, Stanley Simpson, Jan L. Vansant, Barnie A. Wallace, Jr.
  • Patent number: 5660660
    Abstract: An article (2) in which at least part of a surface (8) of a polymeric element has an embossed pattern (6). The article may be either heat-recoverable or non-heat-recoverable. If the article is heat-recoverable, when heated the article recovers and the embossed surface becomes substantially smooth. The change in surface texture can be used to indicate that sufficient heat has been applied to the article to achieve adequate recovery and/or to adequately melt an attached adhesive layer (10). In another embodiment, the article (2) is in the form of a patch (14) which can be used to secure the opposing longitudinal edges of heat-recoverable article which is in the form of a wraparound sheet.
    Type: Grant
    Filed: October 25, 1994
    Date of Patent: August 26, 1997
    Assignee: Raychem Corporation
    Inventors: Walter J. Greuel, Jr., George Pieslak, Efrain Renteria, Stanley Simpson, Jan L. Vansant, Barnie A. Wallace, Jr.
  • Patent number: 4586971
    Abstract: A method of covering a substrate which comprises(1) overlappingly wrapping a heat-shrinkable polymeric closure member in sheet form around an elongate substrate;(2) placing a crosslinked polymeric patch member over the exposed edge and outwardly disposed adjacent portions of the sheet in the area of the overlap;(3) interposing between the closure and patch members a layer of a hot melt adhesive; (4) heating the said hot melt adhesive to its tack temperature and pressing the patch member against the closure member, thereby bonding them together; and(5) heating the closure member to cause shrinkage thereof into circumferential contact with the substrate to conform generally to the shape of the substrate causing the patch member to stretch by at least 5% in the direction of shrinkagethe method being carried out under conditions such that (a) said patch member remains bonded to said closure member throughout at at least the major portion of its length in the overlap area; and (b) at least part of said patch membe
    Type: Grant
    Filed: May 16, 1984
    Date of Patent: May 6, 1986
    Assignee: Raychem Corporation
    Inventor: Barnie A. Wallace, Jr.
  • Patent number: 4533419
    Abstract: A patch closure system for joining heat recoverable sheet material, especially for covering a substrate where the joined material is to be recovered around the substrate, comprises a layer of adhesive on one surface, a part of which is a pressure-sensitive adhesive and the remainder of which is a heat-activatable adhesive. The pressure-sensitive adhesive layer is of such an area and is placed such that, when the patch is placed over the overlap between the edges of the heat recoverable sheet material, the patch will continue to cover the overlap when the sheet material is recovered, even if the heat-activatable adhesive layer has not been used to attach the patch to the sheet material.
    Type: Grant
    Filed: September 15, 1984
    Date of Patent: August 6, 1985
    Assignee: Raychem Corporation
    Inventors: George Pieslak, Barnie A. Wallace, Jr.
  • Patent number: 4424246
    Abstract: A patch closure system for joining heat recoverable sheet material, especially for covering a substrate where the joined material is to be recovered around the substrate, comprises a layer of adhesive on one surface, a part of which is a pressure-sensitive adhesive and the remainder of which is a heat-activatable adhesive. The pressure-sensitive adhesive layer is of such an area and is placed such that, when the patch is placed over the overlap between the edges of the heat recoverable sheet material, the patch will continue to cover the overlap when the sheet material is recovered, even if the heat-activatable adhesive layer has not been used to attach the patch to the sheet material.
    Type: Grant
    Filed: November 2, 1981
    Date of Patent: January 3, 1984
    Assignee: Raychem Corporation
    Inventors: George Pieslak, Barnie A. Wallace, Jr.