Abstract: A method of converting a land grid array (LGA) module to a ball grid array (BGA) module by removing and oxidizing portions of the LGA conductive pad features on the upper surface of the LGA module. A BGA solder ball is deposited on the remaining portion of the conductive feature of the LGA module, with subsequent reflowing of the BGA solder ball. By modifying the LGA module to support a BGA structure, excessive heat generated by components placed on the modified LGA pad can be conducted through the BGA structure and into the element on which the LGA module is attached, such as a PCB.

Abstract: A package for an integrated circuit that is attached to a rigid substrate by the flip-chip method has a heat spreader that is attached to the IC by a thermally conductive, compliant adhesive and that is attached to the package substrate by a set of rigid posts of adhesive, the result of which is that the heat spreader is more closely parallel to the substrate than was the case for a stiffener bonded to the substrate by a thin film extending over a large area.

Abstract: An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.

Abstract: A package for an integrated circuit that is attached to a rigid substrate by the flip-chip method has a heat spreader that is attached to the IC by a thermally conductive, compliant adhesive and that is attached to the package substrate by a set of rigid posts of adhesive, the result of which is that the heat spreader is more closely parallel to the substrate than was the case for a stiffener bonded to the substrate by a thin film extending over a large area.

Abstract: An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.

Abstract: An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a to contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.

Abstract: An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.

Abstract: An electronic package assembly wherein a low profile package is soldered to an organic (e.g., epoxy resin) substrate (e.g., printed circuit board), the projecting conductive leads of the package and the solder which substantially covers these leads (and respective conductors on the substrate) having been substantially covered with encapsulant material (e.g., polymer resin) to provide reinforcement for the solder-lead connections. The encapsulant material is dispensed about the solder and lead joints following solder reflow and solidification so as to substantially surround the solder and any portions of the leads not covered with solder. The invention has particular useful with thin, small outline package (TSOP) structures which occupy a minimum of height on the substrate surface.