Abstract: A printed circuit board (PCB) and a system utilizing the same is presented for use in monitoring a solder joint between the PCB and a package. The PCB comprises at least one slotted pad and at least one health monitoring circuit (HMC). The slotted pad comprises a first pad connected to a ground of the PCB, and a separate second pad, both pads of the slotted pad being configured for being joined via a single solder joint to a single pad of the package. The first and second pads are connected to the HMC, the HMC comprising: a test oscillator configured for generating a known current flowing via the second pad, the solder joint, and the first pad; and a measuring unit for measuring a voltage between the first and second pads of the PCB, thereby enabling calculation of the solder joint's resistance.

Abstract: An apparatus and process for pulverization of polymeric material having a multi-component screw disposed within an elongated cylindrical housing. The multi-component screw has an independently rotatable extrusion portion and an independently rotatable pulverization portion. A cooling means is provided to maintain the fine powder material produced during the pulverization process at a desired temperature. In one embodiment of this invention, a second multi-component screw having an independently rotatable extrusion portion and an independently rotatable pulverization portion is disposed within the elongated cylindrical housing.

Abstract: An apparatus and process for pulverization of polymeric material having a multi-component screw disposed within an elongated cylindrical housing. The multi-component screw has an independently rotatable extrusion portion and an independently rotatable pulverization portion. A cooling means is provided to maintain the fine powder material produced during the pulverization process at a desired temperature. In one embodiment of this invention, a second multi-component screw having an independently rotatable extrusion portion and an independently rotatable pulverization portion is disposed within the elongated cylindrical housing.

Abstract: A process for recycling rubber, elastomers, and thermoset materials in which the material to be recycled is pulverized in a manner which maintains the chemical composition of the material, producing a powder. The powder is introduced into a mold which is heated to a temperature of at least about 200.degree. C. and a compression force of at least about 10 tons is applied to the powder for a period of at least one hour, resulting in formation of a single piece of the rubber, elastomeric, or thermoset material, with no change in chemical structure.