Abstract: Methods and systems for measuring the orientation of a wafer at or near an X-ray scatterometry measurement location are described herein. In one aspect, an X-ray scatterometry based metrology system includes a wafer orientation measurement system that measures wafer orientation based on a single measurement without intervening stage moves. In some embodiments, an orientation measurement spot is coincident with an X-ray measurement spot. In some embodiments, an X-ray scatterometry measurement and a wafer orientation measurement are performed simultaneously. In another aspect, signals detected by a wafer orientation measurement system are filtered temporally, spatially, or both, to improve tracking. In another aspect, a wafer orientation measurement system is calibrated to identify the orientation of the wafer with respect to an incident X-ray beam. In another aspect, a wafer under measurement is positioned based on the measured orientation in a closed loop or open loop manner.

Abstract: A collection system of a semiconductor metrology tool includes a chuck to support a target from which an optical beam is reflected and a spectrometer to receive the reflected optical beam. The collection system also includes a plurality of aperture masks arranged in a rotatable sequence about an axis parallel to an optical axis. Each aperture mask of the plurality of aperture masks is rotatable into and out of the reflected optical beam between the chuck and the spectrometer to selectively mask the reflected optical beam.

Abstract: Methods and systems for measuring the orientation of a wafer at or near an X-ray scatterometry measurement location are described herein. In one aspect, an X-ray scatterometry based metrology system includes a wafer orientation measurement system that measures wafer orientation based on a single measurement without intervening stage moves. In some embodiments, an orientation measurement spot is coincident with an X-ray measurement spot. In some embodiments, an X-ray scatterometry measurement and a wafer orientation measurement are performed simultaneously. In another aspect, signals detected by a wafer orientation measurement system are filtered temporally, spatially, or both, to improve tracking. In another aspect, a wafer orientation measurement system is calibrated to identify the orientation of the wafer with respect to an incident X-ray beam. In another aspect, a wafer under measurement is positioned based on the measured orientation in a closed loop or open loop manner.

Abstract: Methods and systems for performing semiconductor measurements based on hyperspectral imaging are presented herein. A hyperspectral imaging system images a wafer over a large field of view with high pixel density over a broad range of wavelengths. Image signals collected from a measurement area are detected at a number of pixels. The detected image signals from each pixel are spectrally analyzed separately. In some embodiments, the illumination and collection optics of a hyperspectral imaging system include fiber optical elements to direct illumination light from the illumination source to the measurement area on the surface of the specimen under measurement and fiber optical elements to image the measurement area. In another aspect, a fiber optics collector includes an image pixel mapper that couples a two dimensional array of collection fiber optical elements into a one dimensional array of pixels at the spectrometer and the hyperspectral detector.

Abstract: A laser beam is directed through a transmissive axicon telescope or a reflective axicon telescope such as in a magneto-optic Kerr effect metrology system. With the transmissive axicon telescope, a Gaussian beam profile is directed through a first axicon lens and a second axicon lens. The first axicon lens and second axicon lens transfer the Gaussian beam profile of the laser beam to a hollowed laser ring. The laser beam with a hollowed laser ring can be directed through a Schwarzschild reflective objective. With the reflective axicon telescope, the laser beam is directed through two conical mirrors that are fully reflective. One of the conical mirrors defines a central hole that the laser beam passes through.

Abstract: A collection system of a semiconductor metrology tool includes a chuck to support a target from which an optical beam is reflected and a spectrometer to receive the reflected optical beam. The collection system also includes a plurality of aperture masks arranged in a rotatable sequence about an axis parallel to an optical axis. Each aperture mask of the plurality of aperture masks is rotatable into and out of the reflected optical beam between the chuck and the spectrometer to selectively mask the reflected optical beam.

Abstract: A lens system includes a curved primary mirror and an aspheric secondary mirror. The aspheric secondary mirror has a diameter smaller than that of the primary mirror and shares an optical axis with the primary mirror. The aspheric secondary mirror and the primary mirror are rotationally symmetric with respect to the optical axis. A support member, which may be transparent over an operating wavelength of the lens system, is disposed on the aspheric secondary mirror.

Abstract: Methods and systems for performing semiconductor measurements based on hyperspectral imaging are presented herein. A hyperspectral imaging system images a wafer over a large field of view with high pixel density over a broad range of wavelengths. Image signals collected from a measurement area are detected at a number of pixels. The detected image signals from each pixel are spectrally analyzed separately. In some embodiments, the illumination and collection optics of a hyperspectral imaging system include fiber optical elements to direct illumination light from the illumination source to the measurement area on the surface of the specimen under measurement and fiber optical elements to image the measurement area. In another aspect, a fiber optics collector includes an image pixel mapper that couples a two dimensional array of collection fiber optical elements into a one dimensional array of pixels at the spectrometer and the hyperspectral detector.

Abstract: In some embodiments, a collection system of a semiconductor metrology tool includes a chuck to support a target from which an optical beam is reflected and an aperture mask to provide an adjustable aperture for the reflected optical beam. The aperture mask includes a plurality of opaque plates with adjustable positions. The collection system also includes a spectrometer to receive the reflected optical beam. The aperture mask is situated between the chuck and the spectrometer along the optical axis.

Abstract: Methods and systems for measuring a specimen while actively stabilizing an optical measurement beam subject to changes in polarization by a rotating polarizer element are described herein. Movement of a focused measurement beam spot induced by a rotating polarizer element is compensated by actively controlling the position of an optical element in the beam path based on measurements of the focused measurement beam spot. Both feedback and feedforward control schemes may be employed to reduce beam position error. In one aspect, a measurement system includes a rotating optical polarizer, a beam position sensor, and an active beam compensating element in the illumination beam path, the collection beam path, or both. Beam position errors are detected by the beam position sensor, and control commands are communicated to the active beam compensating element to reduce the measured beam position errors.

Abstract: A lens system includes a curved primary mirror and an aspheric secondary mirror. The aspheric secondary mirror has a diameter smaller than that of the primary mirror and shares an optical axis with the primary mirror. The aspheric secondary mirror and the primary mirror are rotationally symmetric with respect to the optical axis. A support member, which may be transparent over an operating wavelength of the lens system, is disposed on the aspheric secondary mirror.

Abstract: Methods and systems for measuring a specimen while actively stabilizing an optical measurement beam subject to changes in polarization by a rotating polarizer element are described herein. Movement of a focused measurement beam spot induced by a rotating polarizer element is compensated by actively controlling the position of an optical element in the beam path based on measurements of the focused measurement beam spot. Both feedback and feedforward control schemes may be employed to reduce beam position error. In one aspect, a measurement system includes a rotating optical polarizer, a beam position sensor, and an active beam compensating element in the illumination beam path, the collection beam path, or both. Beam position errors are detected by the beam position sensor, and control commands are communicated to the active beam compensating element to reduce the measured beam position errors.

Abstract: In some embodiments, a collection system of a semiconductor metrology tool includes a chuck to support a target from which an optical beam is reflected and an aperture mask to provide an adjustable aperture for the reflected optical beam. The aperture mask includes a plurality of opaque plates with adjustable positions. The collection system also includes a spectrometer to receive the reflected optical beam. The aperture mask is situated between the chuck and the spectrometer along the optical axis.

Abstract: An inspection system is provided that can include a reflectometer having a light source for projecting light, and a light splitter for receiving the light projected by the light source, transforming at least one aspect of the light, and projecting the light once transformed. The reflectometer further has an off-axis unobscured objective lens through which the light transformed by the light splitter passes to contact a fabricated component, and has a detector for detecting a result of the transformed light contacting the fabricated component. The inspection system can additionally, or alternatively, include an ellipsometer having a light source similar to the reflectometer, and further a polarizing element to polarize the light of the light splitter. The polarized light passes through an off-axis unobscured objective lens to contact a fabricated component, and a detector detects a result of the polarized light contacting the fabricated component.

Abstract: A camera alignment system that can enable alignment in at least one of three planes and about an axis of at least one of the planes. An alignment mount can mate to a camera and lens. The alignment mount can comprise a mechanism to adjust the camera relative to the lens to that an image plane of the camera aligns with an image plane of the lens in a predetermined orientation. One predetermined orientation can be that the image plane of the camera being parallel to the image plane of the lens.

Abstract: An optical instrument using a plurality of lasers of different colors with parallel, closely spaced beams to stimulate scattering and fluorescence from fluorescent biological particulate matter, including cells and large molecules. A large numerical aperture objective lens collects fluorescent light while maintaining spatial separation of light stimulated by the different sources. The collected light is imaged into a plurality of fibers, one fiber associated with each optical source, which conducts light to a plurality of arrays of detectors, with each array associated with light from one of the fibers and one of the lasers. A detector array has up to ten detectors arranged to separate and measure colors within relatively narrow bands by decimation of light arriving in a fiber.

Abstract: A camera alignment system that can enable alignment in at least one of three planes and about an axis of at least one of the planes. An alignment mount can mate to a camera and lens. The alignment mount can comprise a mechanism to adjust the camera relative to the lens to that an image plane of the camera aligns with an image plane of the lens in a predetermined orientation. One predetermined orientation can be that the image plane of the camera being parallel to the image plane of the lens.

Abstract: An optical instrument using a plurality of lasers of different colors with parallel, closely spaced beams to stimulate scattering and fluorescence from fluorescent biological particulate matter, including cells and large molecules. A large numerical aperture objective lens collects fluorescent light while maintaining spatial separation of light stimulated by the different sources. The collected light is imaged into a plurality of fibers, one fiber associated with each optical source, which conducts light to a plurality of arrays of detectors, with each array associated with light from one of the fibers and one of the lasers. A detector array has up to ten detectors arranged to separate and measure colors within relatively narrow bands by decimation of light arriving in a fiber.