Abstract: Various exemplary methods and devices for actuating surgical instruments are provided. In general, a surgical device can include one or more actuation shafts configured to facilitate actuation of the device. In an exemplary embodiment, the device can include four actuation shafts, two actuation shafts to facilitate articulation of the device, one actuation shaft to facilitate opening and closing of jaws at a distal end of the device, and one actuation shaft to facilitate moving a cutting element of the device. In an exemplary embodiment, each of the one or more actuation shafts can include a distal elongate member and a proximal elongate member having a proximal end attached to a distal end of the distal elongate member. The proximal elongate member can be rigid, and the distal elongate member can be flexible.

Abstract: A modular headlamp assembly includes a low beam headlamp module, a high beam headlamp module, and front turn/parking lamp module. The low beam headlamp module and the high beam headlamp module are supported by a reflector carrier. Each of the high and low beam headlamp modules includes a heat sink and mounting assembly with a heat sink portion bisecting a reflector member. The headlamp includes a lens with a wire heating element embedded therein and a wire heating element circuit board affixed to the lens. A thermistor is affixed to the lens for sensing when the lens reaches a predetermined condition and a micro-controller is provided for activating or deactivating the wire heating element based on the predetermined condition sensed by the thermistor.

Abstract: A modular headlamp assembly includes a low beam headlamp module, a high beam headlamp module, and front turn/parking lamp module. The low beam headlamp module and the high beam headlamp module are supported by a reflector carrier. Each of the high and low beam headlamp modules includes a heat sink and mounting assembly with a heat sink portion bisecting a reflector member. The headlamp includes a lens with a wire heating element embedded therein and a wire heating element circuit board affixed to the lens. A thermistor is affixed to the lens for sensing when the lens reaches a predetermined condition and a micro-controller is provided for activating or deactivating the wire heating element based on the predetermined condition sensed by the thermistor.

Abstract: The present invention provides a razor with more than one shaving aid element placed in close proximity to one another on the cover of the razor. The provision of more than one shaving aid element in such manner provides a number of advantages such as: delivery of increased volume of shaving aid at the local area; simplification of manufacturing process during razor assembly; provision of different shaving aids in different shaving aid elements. A preferred shape of the shaving aid elements is cylindrical. The cylindrical shape also enhances the function of the razor by providing smoother shaving aid motion. The shaving aid element may be extruded and stored in spools for use in the razor assembly.

Abstract: A method of affixing a shaving aid element to a razor is disclosed, which includes the step of extruding the shaving aid element to form a strand of shaving aid material. The strand is then rolled onto a continuous spool for storage. During assembly, the strand is fed to an ultrasonic welder and cutter for cutting the strand into a predetermined length and for welding the shaving aid element to a razor. The strand may be cold worked to increase it ductility and to alter its shape prior to being cut and welded.

Abstract: An electrical contact and method for making an electrical contact allows a flat contact (404) to be formed early in the process of making an electronic device. The flat contact (404) is level with the remainder of the substrate (116) in which it is formed. The flat contact (404) does not interfere with any required subsequent process steps. The flat contact can be reflowed to form a ball contact (302) which protrudes above the top of the substrate (120) to which it is attached.

Abstract: A plurality of inserts (12) formed on a first substrate (11). A plurality of sockets (14) formed on a second substrate (13). Each socket of the plurality of sockets (14) on the second substrate (13) has a corresponding insert from the plurality of inserts (12) which physically aligns for coupling. At least one of the first (11) or second (13) substrates must be a semiconductor substrate. This arrangement allows for electrically connecting a semiconductor device or structure to another device for testing, burn-in, or final assembly.

Abstract: A semiconductor package for an electrical component which has a metal or metal alloy leadframe with first and second surface, which leadframe is adapted to have an electrical component connected thereto. The leadframe is bonded by means of a polymer to a copper or copper alloy base member. The leadframe is also bonded by means of a polymer to a copper or copper alloy cap member. The cap and base members have coated to their inside surfaces a metal or metal alloy. The coating improves the polymer bond between the leadframe and the base and cap members. The surface area of the base member is increased to transfer more heat from the silicon chip in the semiconductor package and to reduce the thermal stresses between the silicon chip and the base member.

Abstract: A one step metallization is disclosed for applying a layer of gold or gold alloy to the back of a silicon substrate to facilitate bonding that substrate to a metallized package member. The gold is applied to the substrate, for example by evaporation, while the substrate is maintained at a temperature between about 200.degree. C. and about 360.degree. C. Following the deposition the substrate is quickly cooled to room temperature. The thickness of the gold layer and the deposition temperature are adjusted to insure that the silicon diffusion profile is contained within the gold film during deposition. This insures good adhesion of the gold to the silicon substrate and provides a pure gold surface layer necessary for optimum bonding of the semiconductor substrate to a metallized package portion.

Abstract: A low cost two step process for attaching conductive leads and heat dissipating elements and for encapsulating a ceramic non-linear resistor pellet is described. Low temperature soldering techniques are utilized to assemble the device. Low temperature soldering is made feasible by the treatment of the attaching surfaces of the pellet with a dilute solution of acid for reducing the oxide surface to a pure metal in preparation for soldering.

Abstract: A brazing operation, using a silver-copper alloy preform in a temperature range of from 800.degree. C. to 1100.degree. C., is employed to attach either radial or axial conductive leads to ceramic non-linear resistors or capacitors, thereby eliminating the necessity of titanium-silver vacuum deposition or conductive cermet application prior to lead attachment. Glass encapsulation may be accomplished simultaneous with the brazing operation to further reduce cost.

Abstract: A method for making an integrated circuit package includes the steps of fabricating lead frames from a copper-zinc-silicon beta brass alloy and soldering the leads thereof to semi-conductor chips by use of the shape memory and reverse shape memory characteristic of the alloy. The composition of the lead frame material and the choice and sequence of fabrication steps may be varied.