Abstract: A method of forming a conductive trace that includes steps of A) selecting a substrate, B) providing a jet dispenser, C) selecting a conductive ink, D) measuring the ink's viscosity (Vm), E) using Vm to select one of criteria (i)-(iv), F) applying the selected criteria to the dispenser, and G) applying the ink onto the substrate; and drying, curing, or annealing the ink to form the conductive trace having ?4B adhesion. The criteria (i)-(iv) include: (i) (Vm) >2.0 Pa-s, then (1) add a fluid—repeat D)-E) or (2) repeat C)-E); (ii) 2.0 Pa-s?Vm>0.35 Pa-s, use needle diameter ?3.0 mm & nozzle diameter (d) ?0.15 mm with ratio of nozzle length (L) to nozzle diameter (d) ?30; (iii) Vm<0.25 Pa-s, use a needle diameter ?1.0 mm and <3.0 mm & nozzle diameter ?0.15 mm with L/d ?30; or (iv) 0.25 Pa-s?Vm?0.35 Pa-s, use criteria (ii) or (iii).

Abstract: A method of forming a conductive trace that includes selecting a substrate, jet dispenser, and conductive ink; measuring the ink's viscosity (Vm); using Vm to select one of criteria (i)-(iv): applying the selected criteria to the dispenser; applying the ink onto the substrate; and drying, curing, or annealing the ink to form the conductive trace having ?4B adhesion. The criteria (i)-(iv) including: (i) (Vm)>2.0 Pa-s, then (1) add a fluid—repeat D)-E) or (2) repeat C)-E); (ii) 2.0 Pa-s?Vm>0.35 Pa-s, use needle diameter ?3.0 mm & nozzle diameter (d)?0.15 mm with ratio of nozzle length (L) to nozzle diameter (d)?30; (iii) Vm<0.25 Pa-s, use a needle diameter ?1.0 mm and <3.0 mm & nozzle diameter ?0.15 mm with L/d?30; or (iv) 0.25 Pa-s?Vm?0.35 Pa-s, use criteria (ii) or (iii).

Abstract: An inductor that includes an electrically conductive construct, wherein the electrically conductive construct includes a first layer having a predetermined geometry, wherein the first layer includes at least one conductive material such as a metal; and a second layer oriented parallel to the first layer, wherein the second layer includes at least one soft ferrite, and wherein the second layer is configured in a co-planar arrangement with the first layer.

Abstract: A method of forming a conductive trace that includes selecting a substrate, jet dispenser, and conductive ink; measuring the ink's viscosity (Vm); using Vm to select one of criteria (i)-(iv): applying the selected criteria to the dispenser; applying the ink onto the substrate; and drying, curing, or annealing the ink to form the conductive trace having ?4B adhesion. The criteria (i)-(iv) including: (i) (Vm)>2.0 Pa-s, then (1) add a fluid—repeat D)-E) or (2) repeat C)-E); (ii) 2.0 Pa-s?Vm>0.35 Pa-s, use needle diameter?3.0 mm & nozzle diameter (d)?0.15 mm with ratio of nozzle length (L) to nozzle diameter (d)?30; (iii) Vm<0.25 Pa-s, use a needle diameter?1.0 mm and <3.0 mm & nozzle diameter?0.15 mm with L/d?30; or (iv) 0.25 Pa-s?Vm?0.35 Pa-s, use criteria (ii) or (iii).

Abstract: An ultrasonic transmitter and ultrasonic receiver include a piezoelectric layer and at least one conductive layer comprising metal nanoparticles. The metal nanoparticles may be a silver nanoparticle, copper nanoparticle, gold nanoparticle, palladium nanoparticle, nickel nanoparticle, and the mixture thereof. Use of metal nanoparticles as a conductive layer provides for ultrasonic transmitters or receivers with smooth, dense, and highly conductive electrodes, thus resulting in reduced ultrasonic energy loss and improved image quality.

Abstract: A method of connecting a wire to a conductive trace formed on a substrate having a predetermined softening point and the functional layered composite formed therefrom. The method comprises applying a conductive ink onto the substrate; curing, drying, or sintering the conductive ink to form the conductive trace with at least one connection pad; applying an activated rosin-type flux and solder to the connection pad and to one end of a metallic wire; placing the end of the wire in contact with the connection pad; applying a source of heat to the wire; melting the solder material to form an interconnection between the wire and the connection pad; removing the source of heat; and allowing the interconnection to cool before moving the wire. The melting point of the solder is either below the softening point of the substrate or above the softening point by about 20° C. or less.

Abstract: Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.

Abstract: A primer layer comprising a polyvinyl butyral resin enhances adhesion of silver nanoparticle inks onto plastic substrates. The primer layer comprises a polyvinyl butyral (PVB) resin having a polyvinyl alcohol content between about 18 wt. % to about 21 wt. %. The PVB resin may also have a glass transition temperature greater than about 70° C. Optionally, the PVB primer layer may further be enhanced by cross-linking using a melamine-formaldehyde resin. Conductive traces formed on plastic substrates having the PVB primer layer exhibit an acceptable cross-hatch adhesion rating with little to no degradation of adhesion being observed after exposure to 4-days salt mist aging or 1-day high humidity aging.

Abstract: An alkoxysilane comprising a functional group is used as an additive in the silver nanoparticle ink, and as an adhesion promoter (or primer layer) on the surface of the substrate in order to enhance the adhesion of silver nanoparticle inks on temperature-sensitive plastic substrates. The combination of the functionalized alkoxysilane both in the ink and on the substrate's surface provides enhanced adhesion after annealing the ink at a low temperature. The adhesion of the annealed films improves from a 0B-3B level to 4B-5B when tested according to ASTM D3359. No degradation of adhesion and no change of color are observed after aging the annealed films in a humidity chamber.

Abstract: A method of fabricating highly conductive (low resistive) features with silver nanoparticle inks at low processing temperature including room temperature is provided, The method includes 1) printing a silver nanoparticle ink to form a conductive feature on a substrate; 2) drying/annealing the printed feature at a temperature compatible with the substrate; 3) treating the annealed feature in a humidity environment; and 4) optionally drying the treated conductive feature. The silver nanoparticle conductive features exhibit a decrease in resistivity from about a factor of 2 up to about a few orders of magnitude after exposure to the humidity treatment.

Abstract: Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate, a first layer on the substrate, a rapidly solidified layer on the first layer and a conductive layer positioned on the rapidly solidified layer. The rapidly solidified layer includes a metastable phase.

Abstract: Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.

Abstract: An electrical device (1) in which an element (7) composed of a conductive polymer composition is positioned in contact with the first surface of a metal electrode (3), the first surface having a center line average roughness Ra and a reflection density RD, the product Ra times RD being at least 0.06 &mgr;m, with an adhesion promoting layer positioned between the first surface of the metal electrode and the polymer element. The conductive polymer composition preferably exhibits PTC behavior. In other aspects, electrical devices using more than one adhesion promoting layer (11), and electrical devices using an adhesion promoting layer in combination with a crosslinking agent (9) are provided. Other embodiments include electrical devices with metal electrodes made by pulse plating processes, and metal electrodes made by electrodeposition under diffusion-limited conditions. The electrical devices may be circuit protection devices and have improved electrical and physical properties.

Abstract: An electrical device in which an element composed of a conductive polymer composition is positioned in contact with the first surface of a metal electrode, the first surface having a center line average roughness Ra and a reflection density RD, the product Ra times RD being at least 0.06 &mgr;m, with an adhesion promoting layer positioned between the first surface of the metal electrode and the polymer element. The conductive polymer composition preferably exhibits PTC behavior. In other aspects, electrical devices using more than one adhesion promoting layer, and electrical devices using an adhesion promoting layer in combination with a crosslinking agent are provided. Other embodiments include electrical devices with metal electrodes made by pulse plating processes, and metal electrodes made by electrodeposition under diffusion-limited conditions. The electrical devices may be circuit protection devices and have improved electrical and physical properties.

Abstract: A sealing system for an acoustic touchscreen includes an elongate gel body between the touchscreen and the bezel of a housing onto which the touchscreen is mounted. The elongate gel body forms a seal around the perimeter of the touch-sensitive area of the touchscreen. A stop element controls and limits the amount of compression of the elongate gel body. The resulting seal is highly effective in protecting the unexposed parts of the touchscreen (i.e., areas other than the touch-sensitive area) from contaminants, especially liquid contaminants, at the cost of an acceptably low loss in acoustic signal strength.

Abstract: A gel material is expanded by first subjecting mixture of a gel precursor material and heat-expandable microspheres to a curing regimen which cures the precursor material into a gel material without expanding the microspheres and then heating to expand the gel material containing the microspheres. In this manner, an intermediate product in the form of a gel which is more handleable than the typically syrupy precursor material is produced. This intermediate product can be manipulated and placed at the intended application location and then expanded.

Abstract: A touch sensor system, including a substrate, capable of propagating surface acoustic waves; and a reflective array formed on said substrate, said reflective array having a plurality of reflective elements, each reflective element reflecting a portion of an incident surface acoustic wave. The reflective array is formed of an organic matrix. The organic matrix is preferably chemically bonded to the substrate, and is preferably a thermoset resin. The resulting reflective arrays are preferably stable under changes in moisture between 0% and 60% RH at temperatures between about 0.degree.-50.degree. C. The organic matrix can also be used in a humidity or chemical sensor.