Abstract: A method includes receiving an input specifying a recognition target. The method further includes selecting a plurality of models of an initial recognition layer based on the recognition target, and selecting a plurality of models of a final recognition layer based on the recognition target. The method includes obtaining sensor data from two or more sensors of a plurality of sensors, providing the sensor data to the plurality of models of the initial recognition layer to obtain an initial set of identifications, providing sensor data to the plurality of models of the final recognition layer to obtain a final set of identifications, and outputting an identification from at least one of the initial set of identifications or the final set of identifications.

Abstract: A method and device for measuring a signal of a die to be placed within a package is disclosed. At least one die as a Device Under Test (DUT) is mounted on a substrate and a chip-type measurement instrument is mounted on the substrate, or embedded into the substrate, wherein the instrument analyzes and/or processes the signal of the DUT and may provide stimulus signal to the DUT. The substrate having the DUT and the measurement instrument is mounted on a circuit board that has plural electrodes to be connected to the signal paths of the DUT and the instrument. An electrode is coupled to a standard interface port to provide the signal of the chip-type instrument to an external instrument.

Abstract: A method and device for measuring a signal of a die to be placed within a package is disclosed. At least one die as a Device Under Test (DUT) is mounted on a substrate and a chip-type measurement instrument is mounted on the substrate, or embedded into the substrate, wherein the instrument analyzes and/or processes the signal of the DUT and may provide stimulus signal to the DUT. The substrate having the DUT and the measurement instrument is mounted on a circuit board that has plural electrodes to be connected to the signal paths of the DUT and the instrument. An electrode is coupled to a standard interface port to provide the signal of the chip-type instrument to an external instrument.