Abstract: A method of forming a patterned photoresist layer having a hydrophobic surface is provided. The method includes forming a photoresist layer on a substrate and image patterning. The photoresist layer may comprise a polymeric material. The imaged photoresist layer may then undergo a two-stage post-exposure bake. A surface treatment may be performed on the photoresist layer in between the two-stage post-exposure bake. The surface treatment may include applying a siloxane solution on a partially post-exposure baked photoresist layer. The post-exposure baked photoresist layer may then be developed to form the patterned photoresist layer. The method may be used to form a hydrophobic photoimageable nozzle plate of a micro-fluid ejection head having improved mechanical properties and stable hydrophobic properties.

Abstract: A method of forming a patterned photoresist layer having a hydrophobic surface is provided. The method includes forming a photoresist layer on a substrate and image patterning. The photoresist layer may comprise a polymeric material. The imaged photoresist layer may then undergo a two-stage post-exposure bake. A surface treatment may be performed on the photoresist layer in between the two-stage post-exposure bake. The surface treatment may include applying a siloxane solution on a partially post-exposure baked photoresist layer. The post-exposure baked photoresist layer may then be developed to form the patterned photoresist layer. The method may be used to form a hydrophobic photoimageable nozzle plate of a micro-fluid ejection head having improved mechanical properties and stable hydrophobic properties.

Abstract: A method of forming a patterned photoresist layer having a hydrophobic surface is provided. The method includes forming a photoresist layer on a substrate and image patterning. The photoresist layer may comprise a polymeric material. The imaged photoresist layer may then undergo a two-stage post-exposure bake. A surface treatment may be performed on the photoresist layer in between the two-stage post-exposure bake. The surface treatment may include applying a siloxane solution on a partially post-exposure baked photoresist layer. The post-exposure baked photoresist layer may then be developed to form the patterned photoresist layer. The method may be used to form a hydrophobic photoimageable nozzle plate of a micro-fluid ejection head having improved mechanical properties and stable hydrophobic properties.

Abstract: Environmentally friendly thick film layers for a micro-fluid ejection head and micro-fluid ejection heads are disclosed. The environmentally friendly thick film layer includes a negative photoresist layer derived from a composition comprising a multi-functional epoxy compound, a low molecular weight polymeric difunctional epoxy compound, a monomeric difunctional epoxy compound, a methide-based photoacid generator that does not contain antimony, a chromophore and an aryl ketone solvent. Optionally the photoresist layer contains an adhesion enhancer. The negative photoresist layer is environmentally friendly and provides good resolution, well defined critical dimensions, straight side walls, and a large processing window.

Abstract: Environmentally friendly thick film layers for a micro-fluid ejection head and micro-fluid ejection heads are disclosed. The environmentally friendly thick film layer includes a negative photoresist layer derived from a composition comprising a multi-functional epoxy compound, a low molecular weight polymeric difunctional epoxy compound, a monomeric difunctional epoxy compound, a methide-based photoacid generator that does not contain antimony, a chromophore and an aryl ketone solvent. Optionally the photoresist layer contains an adhesion enhancer. The negative photoresist layer is environmentally friendly and provides good resolution, well defined critical dimensions, straight side walls, and a large processing window.

Abstract: The present disclosure relates to the use of radiation cured coatings that may be used in a device within an image forming apparatus. The coating composition may include a reactive oligomer capable of radiation curing having a number average molecular weight (Mn) of greater than 1500. A reactive diluent may then be combined with the reactive oligomer, which diluent is also capable of radiation curing and which has a Mn of less than or equal to 1500. The reactive diluent may be present at a level of less than fifty percent by weight of the coating composition. The coating composition may be present at a solids level of 90-100%.

Abstract: The present disclosure relates to the use of radiation cured coatings that may be used in a device within an image forming apparatus. The coating composition may include a reactive oligomer capable of radiation curing having a number average molecular weight (Mn) of greater than 1500. A reactive diluent may then be combined with the reactive oligomer, which diluent is also capable of radiation curing and which has a Mn of less than or equal to 1500. The reactive diluent may be present at a level of less than fifty percent by weight of the coating composition. The coating composition may be present at a solids level of 90-100%.

Abstract: A radiation cured coating may be applied to a device in an image forming apparatus. The coating may be textured using an embossing method wherein radiation is passed through an embossing device to react a chemical component of the coating. The coating may also be textured by providing multiple coating layers exhibiting differential shrinkage upon exposure to radiation and reacting.