Abstract: A ternary content addressable memory (TCAM) cell circuit formed in a TCAM memory cell array having cells arranged in rows and columns can include a first storage circuit with first and second data path, a second storage circuit with a third and fourth data path, and a compare circuit. No more than four conductive lines in a column wise direction have a direct electrical connection to the TCAM cell. Such conductive lines can include a first bit line coupled to the first data path and the third data path and a second bit line coupled to the second data path and the fourth data path.

Abstract: A ternary content addressable memory (TCAM) cell circuit formed in a TCAM memory cell array having cells arranged in rows and columns can include a first storage circuit with first and second data path, a second storage circuit with a third and fourth data path, and a compare circuit. No more than four conductive lines in a column wise direction have a direct electrical connection to the TCAM cell. Such conductive lines can include a first bit line coupled to the first data path and the third data path and a second bit line coupled to the second data path and the fourth data path.

Abstract: A memory/logic cell layout structure includes a pair of memory/logic cells formed on a substrate. Each memory/logic cell (102, 104) can include a pair of memory areas to store data (106-0/106-1, 106-2/106-3), and a logic portion (108-0, 108-1) that receives the data stored therein. Memory areas and the logic portions of each memory/logic cell can be arranged on the substrate in a shape of an L, U, S, T, or Z to form a pair of interlocking memory/logic cells.

Abstract: In one embodiment, a shared contact structure electrically connects a gate, a diffusion region, and another diffusion region. The shared contact structure may comprise a trench that exposes the gate, the diffusion region, and the other diffusion region. The trench may be filled with a metal to form electrical connections. The trench may be formed in a dielectric layer using a self-aligned etch step, for example.

Abstract: In one embodiment, an electrically conductive trench in an integrated circuit allows for the formation of capacitors between the trench and other portions of the integrated circuit. For example, a capacitor may be formed between the trench and an electrically conductive line. Among other advantages, the capacitor provides a relatively large capacitance while occupying a relatively small area.

Abstract: A memory/logic cell layout structure includes a pair of memory/logic cells formed on a substrate. Each memory/logic cell (102, 104) can include a pair of memory areas to store data (106-0/106-1, 106-2/106-3), and a logic portion (108-0, 108-1) that receives the data stored therein. Memory areas and the logic portions of each memory/logic cell can be arranged on the substrate in a shape of an L, U, S, T, or Z to form a pair of interlocking memory/logic cells.