Abstract: The present disclosure relates to a brain-computer interface system and method. In an example, a brain-computer interface system includes a data processing unit, a data transceiver unit, and a sensing or stimulation unit. The system also includes a first communication path between the data transceiver unit and the sensing or stimulation unit including a first downlink channel for transmitting power and data from the data transceiver unit to the data sensing unit and a first uplink channel for transmitting data from the sensing or stimulation unit to the data transceiver unit. The system may additionally include a second communication path between the data processing unit and the data transceiver unit including a second downlink channel for transmitting power and data from the data processing unit to the data transceiver unit and a second uplink channel for transmitting data from the data transceiver unit to the data processing unit.

Abstract: The embodiments disclose a silicon substrate with a group III-V material and a method for fabricating a group III-V material on a silicon substrate. The method involves providing a silicon substrate. A first layer formed atop the silicon substrate, is subsequently patterned to expose the underlying silicon substrate. A group III-V material layer is formed over the patterned first layer and also on the exposed silicon substrate. The group III-V material layer is subjected to chemical mechanical polishing (CMP) to expose the first layer resulting in the formation of a plurality of areas suitable for growing a device layer on the silicon substrate.

Abstract: An embodiment of the instant invention is an optical illumination system for illuminating the mask of an exposure apparatus for transferring the image of the pattern on the mask onto the semiconductor wafer, the optical illumination system comprising: illumination means (illumination means 45 of FIG. 3) comprised of a plurality of light sources for emitting light beams along beam paths; and a lens system (lenses 55 and 57 of FIG. 3) for focusing the light beams to the wafer, the lens system comprising at least one lens element positioned in the beams paths. Preferably, the light sources are individually addressable point like sources, and the optical illumination system further comprising a light control means for operating each of the light sources independently of the others.