Patents by Inventor Beat Beutler

Beat Beutler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9839975
    Abstract: Methods for configuring laser machining machines (1) include control (2), whereby different types laser machining processes (A, B, C, D) can be executed using the laser machine (1), these processes being respectively controlled by the control apparatus (2) using process parameters. The processes of different types are categorized in a classification (20), in which a respective set of process parameters (21A-24A; 21B-24B; 21C-24C; 22D-24D), that are used during the execution of the respective process (A, B, C, D), is assigned to each process. During a determination and/or changing of a first process parameter (21A-24A) of a first process (A), a process parameter (S1-S6; 21B-24B; 21C-24C; 22D-24D) of a different process (B, C, D) that is contained within classification (20), is automatically determined and/or changed according to a stored rule, as a function of the first process parameter.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: December 12, 2017
    Assignee: BYSTRONIC LASER AG
    Inventor: Beat Beutler
  • Patent number: 9296067
    Abstract: Laser processing machines (LM), in particular laser cutting machines with long-wave laser radiation (in particular CO2 laser), including at least one laser processing head (1), having interior (2) and nozzle (3) with nozzle orifice (4) for allowing a primary beam (5), in particular a focused laser working beam, to pass through and onto a work piece (6) and to align a gas current enveloping the beam, and an alignment device (15) with several sensors (13) for centering the primary beam (5), in particular a focused laser working beam, and the nozzle orifice (4) relative to each other. At least one conversion unit (9), in particular a conversion edge, is provided in the area of the nozzle orifice (4) for converting the primary beam (5) contacting it or impacting on it into one or more secondary electromagnetic heat beams (10) along at least one propagation direction (10A) in direction of the sensors (13).
    Type: Grant
    Filed: July 26, 2013
    Date of Patent: March 29, 2016
    Assignee: Bystronic Laser AG
    Inventors: Daniel Cathry, Beat Beutler, Sven Rauschenbach
  • Patent number: 9067281
    Abstract: The laser cutting system for cutting a workpiece with a laser beam along a cutting line at a variable cutting speed includes a movable machining head for placing the laser beam on the respective workpiece, a user interface for specifying the respective cutting line and for specifying a minimum path accuracy of the laser beam, and a control device for controlling a movement of the machining head along the cutting line relative to the respective workpiece and for controlling a plurality of process variables of a cutting process. A second subset of the process variables comprises exclusively one or more process variables which have no influence on the power of the laser beam available for cutting. At least one process variable of the second subset can be controlled by way of the control device as a function of at least one variable control parameter.
    Type: Grant
    Filed: September 9, 2009
    Date of Patent: June 30, 2015
    Assignee: BYSTRONIC LASER AG
    Inventor: Beat Beutler
  • Publication number: 20150165549
    Abstract: Methods for configuring laser machining machines (1) include control (2), whereby different types laser machining processes (A, B, C, D) can be executed using the laser machine (1), these processes being respectively controlled by the control apparatus (2) using process parameters. The processes of different types are categorised in a classification (20), in which a respective set of process parameters (21A-24A; 21B-24B; 21C-24C; 22D-24D), that are used during the execution of the respective process (A, B, C, D), is assigned to each process. During a determination and/or changing of a first process parameter (21A-24A) of a first process (A), a process parameter (S1-S6; 21B-24B; 21C-24C; 22D-24D) of a different process (B, C, D) that is contained within classification (20), is automatically determined and/or changed according to a stored rule, as a function of the first process parameter.
    Type: Application
    Filed: December 12, 2014
    Publication date: June 18, 2015
    Inventor: Beat Beutler
  • Publication number: 20140014632
    Abstract: Laser processing machines (LM), in particular laser cutting machines with long-wave laser radiation (in particular CO2 laser), including at least one laser processing head (1), having interior (2) and nozzle (3) with nozzle orifice (4) for allowing a primary beam (5), in particular a focused laser working beam, to pass through and onto a work piece (6) and to align a gas current enveloping the beam, and an alignment device (15) with several sensors (13) for centering the primary beam (5), in particular a focused laser working beam, and the nozzle orifice (4) relative to each other. At least one conversion unit (9), in particular a conversion edge, is provided in the area of the nozzle orifice (4) for converting the primary beam (5) contacting it or impacting on it into one or more secondary electromagnetic heat beams (10) along at least one propagation direction (10A) in direction of the sensors (13).
    Type: Application
    Filed: July 26, 2013
    Publication date: January 16, 2014
    Inventors: Daniel Cathry, Beat Beutler, Sven Rauschenbach
  • Publication number: 20110220623
    Abstract: The laser cutting system (1) for cutting a workpiece (3) with a laser beam (5) along a cutting line (L1, L2) at a variable cutting speed (v) comprises a movable machining head (10) for placing the laser beam (5) on the respective workpiece (3), a user interface (45) for specifying the respective cutting line (L1, L2) and for specifying a minimum path accuracy (?B) of the laser beam (5), and a control device (20) for controlling a movement of the machining head (10) along the cutting line (L1, L2) relative to the respective workpiece and for controlling a plurality of process variables (LL, Tp, ?T, DF, D0, ModL, ?B, DS, DD, AG, PG) of a cutting process, wherein said movement during the cutting process can produce a cutting path (B1, B2) of the laser beam along the cutting line (L1, L2).
    Type: Application
    Filed: September 9, 2009
    Publication date: September 15, 2011
    Applicant: BYSTRONIC LASER AG
    Inventor: Beat Beutler
  • Patent number: 6189566
    Abstract: A liquid distributor for column packings is provided for the supplying of a liquid medium which includes a material or a material mixture and which tends to the development of inhomogeneities, for example, as a result of a segregation or of a polymerization. The distributor comprises at least one submember with a row of output points for the liquid medium, with at least one of the output points assuming a last output position in the submember with respect to the flow direction of the medium. In the last output point or output points, a flow director is arranged in or at the submember through which a through-flow of the medium can be effected in regions at which a stagnation of the flow would be present without the flow director.
    Type: Grant
    Filed: October 12, 1999
    Date of Patent: February 20, 2001
    Assignee: Sulzer Chemtech AG
    Inventor: Beat Beutler