Patents by Inventor Beatrice Bonvalot
Beatrice Bonvalot has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8508952Abstract: An electrical device that is electrically and mechanically connectable to another electrical device includes a face equipped with contact pads. An adhesive layer is on the face equipped with the contact pads. The adhesive layer is composed of a substance with adhesive properties. A plurality of openings through the adhesive are layer over each contact pad, and small metal sticks which have been grown electrolessly or electrochemically are in the areas where the openings have been created to form a plurality of conductive paths over each contact pad, the volume of which is defined by the openings.Type: GrantFiled: March 1, 2010Date of Patent: August 13, 2013Assignee: Gemalto S.A.Inventor: Beatrice Bonvalot
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Patent number: 8429813Abstract: A method of manufacturing an electrical device that is electrically and mechanically connectable to another electrical device is presented. The electrical device includes a face equipped with contact pads. The method includes applying an adhesive layer on the face equipped with contact pads. The adhesive layer is composed of a substance with adhesive properties. The method further includes creating a plurality of openings through the adhesive layer over each contact pad, and growing, electrolessly or electrochemically, small metal sticks in the areas where the openings have been created to form a plurality of conductive paths over each contact pad, the volume of which is defined by the openings.Type: GrantFiled: August 2, 2002Date of Patent: April 30, 2013Assignee: Gemalto SAInventor: Beatrice Bonvalot
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Patent number: 8415774Abstract: A protected electrical device having at least one electrical sub-assembly (1) to be protected comprises on at least one (11) of upper and lower surfaces (11, 12), at least a screening layer (2) against the electromagnetic (EM) and radiofrequency (RF) fields emitted by the electrical sub-assembly (1). The screening layer (2) comprises at least a first layer made of soft magnetic material with a high relative permeability (µr) larger than 500. The screening layer (2) is placed on substantially the whole surface of said at least one (11) of the upper and lower surfaces (11, 12), except on predetermined regions (1a) of limited area, the electrical connections (8, 9) with external devices being located on at least some of the predetermined regions of limited area.Type: GrantFiled: April 27, 2005Date of Patent: April 9, 2013Assignee: Commissariat a l'Energie Atomique et aux Energies AlternativesInventors: Myriam Pannetier, Claude Fermon, Béatrice Bonvalot
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Patent number: 8138566Abstract: A chip for a chip-incorporating portable article having a card format, such as for smartcards. The chip includes a silicon substrate layer having integrated circuits in its active face defining a central processor unit and memories. The chip also includes physical means for providing physical protection against the action of electromagnetic radiation in the infrared range of wavelength longer than 1 ?m.Type: GrantFiled: October 8, 1999Date of Patent: March 20, 2012Assignee: Gemalto SAInventors: Robert A. Leydier, Béatrice Bonvalot
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Publication number: 20110068441Abstract: A protected electrical device having at least one electrical sub-assembly (1) to be protected comprises on at least one (11) of upper and lower surfaces (11, 12), at least a screening layer (2) against the electromagnetic (EM) and radiofrequency (RF) fields emitted by the electrical sub-assembly (1). The screening layer (2) comprises at least a first layer made of soft magnetic material with a high relative permeability (µr) larger than 500. The screening layer (2) is placed on substantially the whole surface of said at least one (11) of the upper and lower surfaces (11, 12), except on predetermined regions (1a) of limited area, the electrical connections (8, 9) with external devices being located on at least some of the predetermined regions of limited area.Type: ApplicationFiled: April 27, 2005Publication date: March 24, 2011Inventors: Myriam Pannetier, Claude Fermon, Beatrice Bonvalot
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Publication number: 20100157555Abstract: A method of manufacturing an electrical device that is electrically and mechanically connectable to another electrical device is presented. The electrical device includes a face equipped with contact pads. The method includes applying an adhesive layer on the face equipped with contact pads. The adhesive layer is composed of a substance with adhesive properties. The method further includes creating a plurality of openings through the adhesive layer over each contact pad, and growing electrolessly or electrochemically, small metal sticks in the areas where the openings have been created to form a plurality of conductive paths over each contact pad, the volume of which is defined by the openings.Type: ApplicationFiled: March 1, 2010Publication date: June 24, 2010Inventor: Beatrice BONVALOT
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Patent number: 7656630Abstract: For protecting a circuit (1) against a mechanical or electromagnetic attack, an active protection device attached to the circuit comprises: —at least one generator (13, 14) for generating a magnetic field, —at least one magnetic sensor S1, S2, S3, S4 for measuring a value of the magnetic field, —an integrity circuit connected to the at least one magnetic sensor S1, S2, S3, S4 and to the circuit (1). The integrity circuit activates a reaction procedure in the circuit if the measured value of the magnetic field made by the magnetic sensor is out of a values domain, the values domain being correlated to the generated magnetic field.Type: GrantFiled: July 11, 2005Date of Patent: February 2, 2010Assignees: Commissariat a l'Energie Atomique, Axalto SAInventors: Béatrice Bonvalot, Claude Fermon, Myriam Pannetier
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Publication number: 20080088996Abstract: For protecting a circuit 1 against a mechanical or electromagnetic attack, an active protection device attached to the circuit comprises: at least one generator 13, 14 for generating a magnetic field, at least one magnetic sensor S1, S2, S3, S4 for measuring a value of the magnetic field, an integrity circuit connected to the at least one magnetic sensor S1, S2, S3, S4 and to the circuit 1. The integrity circuit activates a reaction procedure in the circuit if the measured value of the magnetic field made by the magnetic sensor is out of a values domain, the values domain being correlated to the generated magnetic field.Type: ApplicationFiled: July 11, 2005Publication date: April 17, 2008Inventors: Beatrice Bonvalot, Myriam Pannetier, Claude Fermon
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Patent number: 7282104Abstract: A sealing-object (4) is fixed to a base-object (10). The sealing-object comprises a through-hole (5). The objects are fixed to each other in the following manner. In a preparation step, a fixing layer (1, 2, 3) is provided between the base-object and the sealing-object. In addition an evacuation device (6) equipped with an evacuation channel (7) is placed onto the sealing-object. The through-hole of the sealing object has a first extremity opening out on the evacuation channel and a second extremity opening out on the fixing layer. In a fixing step, the fixing layer is heated which causes the fixing layer to release gas. The gas is at least partially evacuated via the through-hole of the sealing-object and the evacuation channel of the evacuation device.Type: GrantFiled: November 6, 2002Date of Patent: October 16, 2007Assignee: Axalto SAInventors: Beatrice Bonvalot, Sylvie Barbe, Laurent Le Moullec, Robert Leydier
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Patent number: 7282424Abstract: A plurality of assemblies is manufactured. Each assembly comprises a sealing slice that is fixed to a base slice. The plurality of assemblies is manufactured in the following manner. In a preparation step, a stack is formed. The stack comprises a plurality of pre-assemblies. Each pre-assembly comprises a base slice, a sealing slice and a fixing layer provided between the base slice and the sealing slice. The stack further comprises at least one supple buffer layer. The supple buffer layer has a mechanical rigidity, which is substantially less than that of the base slices and that of the sealing slices. The supple buffer layer thus enables to compensate for variations in thickness of the base slices and of the sealing slices. In a fixing step, the stack is pressed which causes the sealing slice of each pre-assembly to be fixed to the base-slice of the pre-assembly.Type: GrantFiled: November 6, 2002Date of Patent: October 16, 2007Assignee: Axalto SAInventors: Béatrice Bonvalot, Sylvie Barbe, Laurent Le Moullec, Robert Leydier
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Publication number: 20060094155Abstract: A method of manufacturing a wafer assembly involves a chip wafer onto which a cover wafer is deposited, the chip wafer includes an active face and an inactive face, the active face includes chip elements, the cover wafer being provided with a chip-element-receiving cavity located above a chip element, the method involves the following steps: a cover-wafer-depositing step, in which a cover wafer is deposited on the active face so as to obtain a wafer assembly, the cover wafer being provided with plurality of chip-receiving cavities, a chip-receiving cavity being located above a chip element, the cover wafer being made of an organic material, and a wafer assembly thinning step, in which the inactive face of the chip wafer is thinned.Type: ApplicationFiled: September 17, 2003Publication date: May 4, 2006Inventors: Joseph Leibenguth, Beatrice Bonvalot, Benoit Thevenot, Laurent Lemoullec, Frederie Depoutot, Yves Reignoux
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Publication number: 20050061431Abstract: A sealing-object (4) is fixed to a base-object (10). The sealing-object comprises a through-hole (5). The objects are fixed to each other in the following manner. In a preparation step, a fixing layer (1, 2, 3) is provided between the base-object and the sealing-object. In addition an evacuation device (6) equipped with an evacuation channel (7) is placed onto the sealing-object. The through-hole of the sealing object has a first extremity opening out on the evacuation channel and a second extremity opening out on the fixing layer. In a fixing step, the fixing layer is heated which causes the fixing layer to release gas. The gas is at least partially evacuated via the through-hole of the sealing-object and the evacuation channel of the evacuation device.Type: ApplicationFiled: November 6, 2002Publication date: March 24, 2005Inventors: Beatrice Bonvalot, Sylvie Barbe, Laurent Le Moullec, Robert Leydier
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Publication number: 20050034303Abstract: A method of manufacturing an electrical device that is electrically and mechanically connectable to another electrical device, the electrical device having a face equipped with contact pads, wherein the method includes: a layer-application step in which an adhesive layer is applied on the face equipped with contact pads, the adhesive layer being composed of a substance with adhesive properties; an opening-creation step in which an opening is created through the adhesive layer at the level of a contact pad; an opening-filing step in which the opening is filled with a conductive material so that the opening is substantially filled with the conductive material so as to form a conductive path the volume of which is defined by the opening.Type: ApplicationFiled: August 2, 2002Publication date: February 17, 2005Applicant: Schlumberger SystemesInventor: Beatrice Bonvalot
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Publication number: 20050009247Abstract: A plurality of assemblies is manufactured. Each assembly comprises a sealing slice that is fixed to a base slice. The plurality of assemblies is manufactured in the following manner. In a preparation step, a stack is formed. The stack comprises a plurality of pre-assemblies. Each pre-assembly comprises a base slice, a sealing slice and a fixing layer provided between the base slice and the sealing slice. The stack further comprises at least one supple buffer layer. The supple buffer layer has a mechanical rigidity, which is substantially less than that of the base slices and that of the sealing slices. The supple buffer layer thus enables to compensate for variations in thickness of the base slices and of the sealing slices. In a fixing step, the stack is pressed which causes the sealing slice of each pre-assembly to be fixed to the base-slice of the pre-assembly.Type: ApplicationFiled: November 6, 2002Publication date: January 13, 2005Inventors: Beatrice Bonvalot, Sylvie Barbe, Robert Leydier, Laurent Le Moullec
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Patent number: 6695214Abstract: An integrated circuit device (2) designed to be incorporated in a portable object with memory, in particular of card format. The integrated circuit device (2) comprises at least a capacitor (8) for attenuating-the amplitude of current peaks (Idd) consumed by the integrated circuit device (2). The attenuation of such current peaks is particularly useful for attenuating electric signatures in smart cards.Type: GrantFiled: December 7, 2000Date of Patent: February 24, 2004Assignee: Schlumberger, SystémesInventors: Robert Leydier, Béatrice Bonvalot, Eric Servel
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Patent number: 6576991Abstract: An integrated circuit device is disclosed. The device includes an active film having a semiconducting material and an integrated circuit disposed on an active face of the active film. The integrated circuit includes a plurality of circuit elements. In addition, the device includes an additional film fixed to the active face of the active film, the additional film at least partially covering said integrated circuit, and an anti-fraud mechanism disposed within the additional film, the anti-fraud mechanism being positioned to align with one of the plurality of circuit elements. In some aspects, the additional film includes a protective sub-film and a sealing sub-film, wherein the protective sub-film is sealed to the active face of the active film by the sealing sub-film.Type: GrantFiled: January 28, 2002Date of Patent: June 10, 2003Assignee: Schlumberger SystemsInventors: Béatrice Bonvalot, Robert Leydier
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Patent number: 6433439Abstract: A secure integrated circuit device comprising, firstly, an active layer (10) made up of a semiconductor material and of circuits integrated into the semiconductor material and having contact tabs (15) on its active face (11) and, secondly, an additional layer (20). The active layer (10) is bonded to the additional layer (20) by an intermediate layer (30) applied to the surface of the active face (11) of the active layer (10). The face (12) of the active layer (10) opposite from its active face (11) is thinned.Type: GrantFiled: July 26, 2000Date of Patent: August 13, 2002Assignee: Schlumberger SystemesInventors: Beatrice Bonvalot, Robert Leydier