Patents by Inventor Beau Barry

Beau Barry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STRUCTURE AND METHOD FOR COUPLING SIGNALS TO AND/OR FROM STACKED SEMICONDUCTOR DIES
    Publication number: 20110063023
    Abstract: Signals are coupled to and from stacked semiconductor dies through first and second sets of external terminals. The external terminals in the second set are connected to respective conductive paths extending through each of the dies. Signals are coupled to and from the first die through the first set of external terminals. Signals are also coupled to and from the second die through the conductive paths in the first die and the second set of external terminals. The external terminals in first and second sets of each of a plurality of pairs are connected to an electrical circuit through respective multiplexers. The multiplexers in each of the dies are controlled by respective control circuits that sense whether a die in the first set is active. The multiplexers connect the external terminals in either the first set or the second set depending on whether the bonding pad in the first set is active.
    Type: Application
    Filed: November 17, 2010
    Publication date: March 17, 2011
    Applicant: Micron Technology, Inc.
    Inventors: Joshua Alzheimer, Beau Barry
  • Structure and method for coupling signals to and/or from stacked semiconductor dies
    Patent number: 7847626
    Abstract: Signals are coupled to and from stacked semiconductor dies through first and second sets of external terminals. The external terminals in the second set are connected to respective conductive paths extending through each of the dies. Signals are coupled to and from the first die through the first set of external terminals. Signals are also coupled to and from the second die through the conductive paths in the first die and the second set of external terminals. The external terminals in first and second sets of each of a plurality of pairs are connected to an electrical circuit through respective multiplexers. The multiplexers in each of the dies are controlled by respective control circuits that sense whether a die in the first set is active. The multiplexers connect the external terminals in either the first set or the second set depending on whether the bonding pad in the first set is active.
    Type: Grant
    Filed: March 4, 2008
    Date of Patent: December 7, 2010
    Assignee: Micron Technology, Inc.
    Inventors: Joshua Alzheimer, Beau Barry
  • Structure and method for coupling signals to and/or from stacked semiconductor dies
    Publication number: 20090224822
    Abstract: Signals are coupled to and from stacked semiconductor dies through first and second sets of external terminals. The external terminals in the second set are connected to respective conductive paths extending through each of the dies. Signals are coupled to and from the first die through the first set of external terminals. Signals are also coupled to and from the second die through the conductive paths in the first die and the second set of external terminals. The external terminals in first and second sets of each of a plurality of pairs are connected to an electrical circuit through respective multiplexers. The multiplexers in each of the dies are controlled by respective control circuits that sense whether a die in the first set is active. The multiplexers connect the external terminals in either the first set or the second set depending on whether the bonding pad in the first set is active.
    Type: Application
    Filed: March 4, 2008
    Publication date: September 10, 2009
    Applicant: Micron Technology, Inc.
    Inventors: Joshua Alzheimer, Beau Barry