Abstract: Examples techniques to determine print material subscription plans for image rendering devices are described. In an example, data indicative of print material consumption by an image rendering device for a period of time is received at a server. Based on the received data, a print material subscription plan is determined for the image rendering device. Signals to enable provision of a notification corresponding to first print material subscription plan are transmitted to the image rendering device.

Abstract: Examples techniques to determine print material subscription plans for image rendering devices are described. In an example, data indicative of print material consumption by an image rendering device for a period of time is received at a server. Based on the received data, a print material subscription plan is determined for the image rendering device. Signals to enable provision of a notification corresponding to first print material subscription plan are transmitted to the image rendering device.

Abstract: A fluid ejection device is described. In an example, a device includes a substrate having a chamber formed thereon to contain a fluid. A metal layer includes a resistor under the chamber having a surface thermally coupled to the chamber. At least one layer is deposited on the metal layer. A polysilicon layer is under the metal layer comprising a polysilicon structure under the resistor to change topography of the resistor such that the surface is uneven.

Abstract: An integrated circuit including a first EPROM, a second EPROM, and a circuit. The first EPROM is configured to provide a first state and a second state. The second EPROM is configured to provide a third state and a fourth state. The circuit is configured to select the first EPROM and the second EPROM individually and in parallel with each other.

Abstract: A fluid ejection device is described. In an example, a device includes a substrate having a chamber formed thereon to Ncontain a fluid. A metal layer includes a resistor under the chamber having a surface thermally coupled to the chamber. At least one layer is deposited on the metal layer. A polysilicon layer is under the metal layer comprising a polysilicon structure under the resistor to change topography of the resistor such that the surface is uneven.

Abstract: A fluid ejection device is described. In an example, a device includes a substrate having a chamber formed thereon to contain a fluid. A metal layer includes a resistor under the chamber having a surface thermally coupled to the chamber. At least one layer is deposited on the metal layer. A polysilicon layer is under the metal layer comprising a polysilicon structure under the resistor to change topography of the resistor such that the surface is uneven.

Abstract: An integrated circuit including a first EPROM, a second EPROM, and a circuit. The first EPROM is configured to provide a first state and a second state. The second EPROM is configured to provide a third state and a fourth state. The circuit is configured to select the first EPROM and the second EPROM individually and in parallel with each other.

Abstract: An integrated circuit including a first EPROM, a second EPROM, and a circuit. The first EPROM is configured to provide a first state and a second state. The second EPROM is configured to provide a third state and a fourth state. The circuit is configured to select the first EPROM and the second EPROM individually and in parallel with each other.

Abstract: A fluid ejection device is described. In an example, a device includes a substrate having a chamber formed thereon to contain a fluid. A metal layer includes a resistor under the chamber having a surface thermally coupled to the chamber. At least one layer is deposited on the metal layer. A polysilicon layer is under the metal layer comprising a polysilicon structure under the resistor to change topography of the resistor such that the surface is uneven.

Abstract: The present disclosure describes a compound slot, and systems and methods of forming the compound slot. An example of a compound slot includes a wafer, where the compound slot includes a trench along a long axis of the compound slot and on a top surface of the wafer, where the trench passes through an initial portion of a total depth of the wafer. A number of openings pass through a remaining portion of the total depth of the wafer, where at least a retained portion of a bottom of the trench is present around a perimeter of each of the number of openings.

Abstract: The present disclosure describes a compound slot, and systems and methods of forming the compound slot. An example of a compound slot includes a wafer, where the compound slot includes a trench along a long axis of the compound slot and on a top surface of the wafer, where the trench passes through an initial portion of a total depth of the wafer. A number of openings pass through a remaining portion of the total depth of the wafer, where at least a retained portion of a bottom of the trench is present around a perimeter of each of the number of openings.

Abstract: The present disclosure describes a compound slot, and systems and methods of forming the compound slot. An example of a compound slot includes a wafer, where the compound slot includes a trench along a long axis of the compound slot and on a top surface of the wafer, where the trench passes through an initial portion of a total depth of the wafer. A number of openings pass through a remaining portion of the total depth of the wafer, where at least a retained portion of a bottom of the trench is present around a perimeter of each of the number of openings.

Abstract: An integrated circuit including a first EPROM, a second EPROM, and a circuit. The first EPROM is configured to provide a first state and a second state. The second EPROM is configured to provide a third state and a fourth state. The circuit is configured to select the first EPROM and the second EPROM individually and in parallel with each other.

Abstract: A print head circuit of an inkjet printer comprising a plurality of row heating elements arranged in a plurality of rows, a plurality of column heating elements arranged in a plurality of columns, and a plurality of lateral bipolar junction transistors (BJTs), each lateral BJT is connected in between and in series with a corresponding one of the plurality of row heating elements and a corresponding one of the plurality of column heating elements, the plurality of lateral BJTs have common bases, wherein the plurality of row heating elements and the plurality of column heating elements are selectively energized to heat ink in the inkjet printer in a desired pattern for printing media, and wherein each of the plurality of lateral BJTs operates to allow the corresponding row and column heating elements that are connected in series with the lateral BJT to be energized.

Abstract: A print head circuit of an inkjet printer comprising a plurality of row heating elements arranged in a plurality of rows, a plurality of column heating elements arranged in a plurality of columns, and a plurality of lateral bipolar junction transistors (BJTs), each lateral BJT is connected in between and in series with a corresponding one of the plurality of row heating elements and a corresponding one of the plurality of column heating elements, the plurality of lateral BJTs have common bases, wherein the plurality of row heating elements and the plurality of column heating elements are selectively energized to heat ink in the inkjet printer in a desired pattern for printing media, and wherein each of the plurality of lateral BJTs operates to allow the corresponding row and column heating elements that are connected in series with the lateral BJT to be energized.