Abstract: A thermal abatement system is provided, including: a thermal abatement reactor; an inlet in fluid communication with the reactor; a process chamber in fluid communication with the inlet; a first sheathing fluid source in fluid communication with the inlet; a first flow control device, adapted to regulate a flow of a first sheathing fluid from the first sheathing fluid source; and a controller, in signal communication with the first flow control device, adapted to regulate the sheathing fluid by operating the first flow control device; wherein the inlet is adapted to receive an effluent stream from the process chamber and the first sheathing fluid from the first sheathing fluid source, to sheathe the effluent stream with the first sheathing fluid to form a sheathed effluent stream, and to introduce the sheathed effluent stream into the reactor.

Abstract: A method of developing an integrated abatement system is provided, including the steps: a) determining whether an integrated abatement system meets a destruction removal efficiency standard wherein the determination includes the steps: i) operating an electronic device manufacturing process tool using a best known method, whereby effluent containing a target species is produced; ii) abating the target species to form abated effluent, using an abatement system which is coupled to the process tool; and iii) calculating a destruction removal efficiency for the target species; and b) modifying the abatement system by altering at least one of a design parameter and an operating parameter of the abatement system to improve the destruction removal efficiency. Numerous other aspects are provided.

Abstract: A method of operating an electronic device manufacturing system is provided which includes the steps of receiving information with an interface, wherein the information relates to an abatement system, and shutting down a process tool and an abatement tool in response to the information.

Abstract: In a first aspect, a first abatement apparatus is provided. The first abatement apparatus includes (1) an oxidation unit adapted to receive an effluent stream from a semiconductor device manufacturing chamber; (2) a first water scrubber unit adapted to receive the effluent stream from the oxidation unit; and (3) a catalysis unit adapted to receive the effluent stream from the first water scrubber unit. Numerous other aspects are provided.

Abstract: An apparatus and method are provided for treating pollutants in a gaseous stream. The apparatus comprises tubular inlets for mixing a gas stream with other oxidative and inert gases for mixture within a reaction chamber. The reaction chamber is heated by heating elements and has orifices through which cool or heated air enters into the central reaction chamber. A process is also provided whereby additional gases are added to the gaseous stream preferably within the temperature range of 650 C.-950° C. which minimizes or alleviates the production of NOx.