Abstract: Some embodiments of an apparatus and system are described for a crossflow blower motor. An apparatus may comprise one or more motors operative to control a crossflow blower. The one or more motors may comprise one or more stator assemblies having a stator coil and a bent stator. The one or more motors may be configured to control a crossflow blower arranged to generate a flow of air in a direction substantially perpendicular to an axis of rotation of the crossflow blower. Other embodiments are described.

Abstract: Some embodiments of an apparatus and system are described for a crossflow blower motor. An apparatus may comprise one or more motors operative to control a crossflow blower. The one or more motors may comprise one or more stator assemblies having a stator coil and a bent stator. The one or more motors may be configured to control a crossflow blower arranged to generate a flow of air in a direction substantially perpendicular to an axis of rotation of the crossflow blower. Other embodiments are described.

Abstract: Some embodiments of an apparatus and system are described for a crossflow blower motor. An apparatus may comprise one or more motors operative to control a crossflow blower. The one or more motors may comprise one or more stator assemblies having a stator coil and a bent stator. The one or more motors may be configured to control a crossflow blower arranged to generate a flow of air in a direction substantially perpendicular to an axis of rotation of the crossflow blower. Other embodiments are described.

Abstract: A computing device including fastening features. The computing device may include an upper shell comprising an upper boss protruding from the upper shell, the upper boss defining a cavity. The computing device may include a lower shell comprising a lower boss protruding from the lower shell. The computing device may include a threaded insert including an insert portion received at the cavity of the upper boss. The threaded insert may include a flange portion wider than the insert portion, and a lateral movement reduction feature. The computing device may include a fastener received through the lower boss and through the threaded insert to fasten the upper shell and lower shell to each other.

Abstract: A computing device including fastening features. The computing device may include an upper shell comprising an upper boss protruding from the upper shell, the upper boss defining a cavity. The computing device may include a lower shell comprising a lower boss protruding from the lower shell. The computing device may include a threaded insert including an insert portion received at the cavity of the upper boss. The threaded insert may include a flange portion wider than the insert portion, and a lateral movement reduction feature. The computing device may include a fastener received through the lower boss and through the threaded insert to fasten the upper shell and lower shell to each other.

Abstract: A heat sink (and method of forming a heat sink) is provided that includes a core having a central axis and a plurality of cooling fins arranged about the core. Each fin has a base and a tip. The fins may be shaped to capture a tangential component of air from the fan. At least one portion (such as upper portion) of the fins may be bent. A lower portion of each fin may also be bent.

Abstract: Some embodiments of an apparatus and system are described for a crossflow blower motor. An apparatus may comprise one or more motors operative to control a crossflow blower. The one or more motors may comprise one or more stator assemblies having a stator coil and a bent stator. The one or more motors may be configured to control a crossflow blower arranged to generate a flow of air in a direction substantially perpendicular to an axis of rotation of the crossflow blower. Other embodiments are described.

Abstract: A heat sink (and method of forming a heat sink) is provided that includes a core having a central axis and a plurality of cooling fins arranged about the core. Each fin has a base and a tip. The fins may be shaped to capture a tangential component of air from the fan. At least one portion (such as upper portion) of the fins may be bent. A lower portion of each fin may also be bent.

Abstract: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.

Abstract: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.

Abstract: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.

Abstract: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.

Abstract: Non-prismatic radial folded fin heat sinks include fin arrays comprised of folded fins joined to a thermally conductive central core. The fin arrays can have either a constant or variable bend radius. The non-prismatic radial folded fins can be made by stamping patterns into sheet metal prior to folding the sheet metal in opposite directions at various intervals to form outer and inner folds. By arranging the fins in a non-prismatic radial pattern around the central core, airflow generated by an overhead fan is better utilized, thus improving the cooling effect of the device.

Abstract: A heat sink (and method of forming a heat sink) is provided that includes a core having a central axis and a plurality of cooling fins arranged about the core. Each fin has a base and a tip. The fins may be shaped to capture a tangential component of air from the fan. At least one portion (such as upper portion) of the fins may be bent. A lower portion of each fin may also be bent.

Abstract: Non-prismatic radial folded fin heat sinks include fin arrays comprised of folded fins joined to a thermally conductive central core. The fin arrays can have either a constant or variable bend radius. The non-prismatic radial folded fins can be made by stamping patterns into sheet metal prior to folding the sheet metal in opposite directions at various intervals to form outer and inner folds. By arranging the fins in a non-prismatic radial pattern around the central core, airflow generated by an overhead fan is better utilized, thus improving the cooling effect of the device.

Abstract: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.