Abstract: A wafer inspection system and a wafer inspection equipment thereof are provided. The wafer inspection system includes a susceptor device, probe card, and bridge module. The susceptor device includes a susceptor unit for placing a wafer under test. The probe card includes a probing portion and conducting portion. The conducting portion is disposed at the periphery of the probing portion and has a contact surface. The bridge module includes transmission units extended upward, positioned adjacent to a wafer placement area, and coupled to the susceptor unit. When the probing portion comes into contact with a testing point of the wafer, the contact surface of the conducting portion gets coupled to the transmission units to transmit a test signal to the probe card via the transmission units and conducting portion and thus form a test loop. Thus, the test loop path can be shortened and the accuracy of signal transmission and inspection can be enhanced.

Abstract: The invention discloses a wafer testing device of flip chip VCSEL for testing a wafer having a plurality of light emitting units. The wafer testing device of flip chip VCSEL comprises a wafer testing carrier and a flexible conductive layer. The wafer testing carrier has a first surface. A plurality of testing portions are disposed on the first surface. The flexible conductive layer, detachably disposed on the first surface, are conductive in vertical direction and insulated in horizontal direction. Wherein the wafer is disposed on the flexible conductive layer, and each light emitting unit is electrically connected with one of the testing portions in vertical direction through the flexible conductive layer while testing the wafer.

Abstract: A wafer inspection system and a wafer inspection equipment thereof are provided. The wafer inspection system includes a susceptor device, probe card, and bridge module. The susceptor device includes a susceptor unit for placing a wafer under test. The probe card includes a probing portion and conducting portion. The conducting portion is disposed at the periphery of the probing portion and has a contact surface. The bridge module includes transmission units extended upward, positioned adjacent to a wafer placement area, and coupled to the susceptor unit. When the probing portion comes into contact with a testing point of the wafer, the contact surface of the conducting portion gets coupled to the transmission units to transmit a test signal to the probe card via the transmission units and conducting portion and thus form a test loop. Thus, the test loop path can be shortened and the accuracy of signal transmission and inspection can be enhanced.

Abstract: The invention discloses a wafer testing device of flip chip VCSEL for testing a wafer having a plurality of light emitting units. The wafer testing device of flip chip VCSEL comprises a wafer testing carrier and a flexible conductive layer. The wafer testing carrier has a first surface. A plurality of testing portions are disposed on the first surface. The flexible conductive layer, detachably disposed on the first surface, are conductive in vertical direction and insulated in horizontal direction. Wherein the wafer is disposed on the flexible conductive layer, and each light emitting unit is electrically connected with one of the testing portions in vertical direction through the flexible conductive layer while testing the wafer.

Abstract: The disclosure discloses a heating furnace including a housing, a first rack, a chamber, and at least one fan. The first rack is disposed in the housing. The chamber is disposed in the housing and located at a side of the first rack. The chamber includes an inlet, a first sidewall, and a second sidewall. The first sidewall is adjacent to the first rack. The first sidewall has a plurality of vents. The first sidewall and the second sidewall are disposed to face each other. A width is spaced between the first sidewall and the second sidewall, and the width is larger than or equal to 200 mm. The fan is disposed in the housing for generating an airflow to the inlet.

Abstract: A temperature control equipment is capable of controlling a tested object to a predetermined temperature. The temperature control equipment includes a thermal conducting plate, a temperature regulating module, a carrier plate, and a thermoelectric cooling module. The temperature regulating module is thermally connected to the thermal conducting plate for regulating the thermal conducting plate to a reference temperature. The carrier plate is used to accommodate the tested object. The thermoelectric cooling module is thermally connected between the thermal conducting plate and the carrier plate for controlling the tested object to the predetermined temperature via the carrier plate based on the reference temperature.

Abstract: The disclosure discloses a heating furnace including a housing, a first rack, a chamber, and at least one fan. The first rack is disposed in the housing. The chamber is disposed in the housing and located at a side of the first rack. The chamber includes an inlet, a first sidewall, and a second sidewall. The first sidewall is adjacent to the first rack. The first sidewall has a plurality of vents. The first sidewall and the second sidewall are disposed to face each other. A width is spaced between the first sidewall and the second sidewall, and the width is larger than or equal to 200 mm. The fan is disposed in the housing for generating an airflow to the inlet.

Abstract: A wide range of temperature control equipment for controlling a tested object to a predetermined temperature is provided. The wide range of temperature control equipment includes a thermal conducting plate, a temperature regulating module, a carrier plate, and a thermoelectric cooling module. The temperature regulating module is thermally connected to the thermal conducting plate for regulating the thermal conducting plate to a reference temperature. The carrier plate is used to accommodate the tested object. The thermoelectric cooling module is thermally connected between the thermal conducting plate and the carrier plate for controlling the tested object to the predetermined temperature via the carrier plate based on the reference temperature.

Abstract: The present invention provides a measuring system to determine the quality of the heat pipe, comprising a heat pipe comprising a first end connected to a first temperature sensor and a second end connected to a second temperature sensor, a heater being connected to said first end and being connected to a multi-function heater controller; a multi-function heater controller being electrically connected to said heater and said one of the first or second temperature sensor, a thermal-electric cooler (TEC) module being connected to said second end; and a TEC controller being electrically connected to said TEC module and said one of the first or second temperature sensor, wherein said TEC controller comprises a proportional-integral-derivative controller, and said multi-function heater controller comprises both constant heating power and constant temperature control modes.

Abstract: The present invention provides a thermoelectric cooler module structure comprising a first conductive pad, a second conductive pad, and a third conductive pad, wherein a first thermoelectric pellet and a second thermoelectric pellet are formed on said first conductive pad separately to connect said first conductive pad and said second conductive pad, said first conductive pad and said third conductive pad, and an isolation layer formed between said first thermoelectric pellet and said second thermoelectric pellet on said first conductive pad.

Abstract: An essential oil diffusor assembly is disclosed.

Abstract: A bi-directionally load current driving circuit is disclosed.

Abstract: An overcurrent protection device includes a feedback control circuit for outputting a control signal in accordance with a feedback signal that corresponds to an output current signal outputted at an output node of a target circuit, that is received from a feedback output end of the target circuit, and that is to be provided to a control input end of the target circuit so as to cause the feedback signal to reach a preset value. A current limiting circuit, connected to the output node for magnitude control of the output current signal, enables a connection control circuit to connect the feedback control circuit to the control input end when the output current signal is less than a predetermined current value, and enables the connection control circuit to isolate the feedback control circuit from the control input end when the output current signal is not less than the predetermined current value.

Abstract: A predistortion circuit includes a first splitter for splitting an input signal into primary and secondary electrical paths, a first combiner for combining a main signal on the primary electrical path and a predistorted signal on the second electrical path into a single signal for modulating a nonlinear device with predictable distortion characteristics, a distortion signal generator for receiving a branch signal from the first splitter and for producing first and second intermodulation products, a second splitter for receiving the first intermodulation products and for outputting two sets of the first intermodulation products, a third splitter for receiving the second intermodulation products and for outputting two sets of the second intermodulation products, an even-order signal processing unit for processing one set of the first intermodulation products and one set of the second intermodulation products to generate even-order intermodulation products, an odd-order signal processing unit for processing the