Abstract: Eyewear including a multi-layered display having an adhesive bonding the layers together at an offset distance inward from an outer edge of the layers. The display has an image display layer, such as an optical waveguide in one example, and a pair of layers encompassing the image display layer and which may comprise optically transparent substrates, such as glass. A respective adhesive is positioned the offset distance inward from the outer edge of the display layer between the image display layer and each of the pair of layers to reduce stress in the display. Each of the adhesives may be a continuous bead such that there is no adhesive between the pair of layers and the image display layer at the outer edges. In one example, the offset distance may be at least double the thickness of the image display layer to reduce stress in the image display layer.

Abstract: Eyewear including a multi-layered display having an adhesive bonding the layers together at an offset distance inward from an outer edge of the layers. The display has an image display layer, such as an optical waveguide in one example, and a pair of layers encompassing the image display layer and which may comprise optically transparent substrates, such as glass. A respective adhesive is positioned the offset distance inward from the outer edge of the display layer between the image display layer and each of the pair of layers to reduce stress in the display. Each of the adhesives may be a continuous bead such that there is no adhesive between the pair of layers and the image display layer at the outer edges. In one example, the offset distance may be at least double the thickness of the image display layer to reduce stress in the image display layer.

Abstract: Eyewear including a multi-layered display having an adhesive bonding the layers together at an offset distance inward from an outer edge of the layers. The display has an image display layer, such as an optical waveguide in one example, and a pair of layers encompassing the image display layer and which may comprise optically transparent substrates, such as glass. A respective adhesive is positioned the offset distance inward from the outer edge of the display layer between the image display layer and each of the pair of layers to reduce stress in the display. Each of the adhesives may be a continuous bead such that there is no adhesive between the pair of layers and the image display layer at the outer edges. In one example, the offset distance may be at least double the thickness of the image display layer to reduce stress in the image display layer.

Abstract: Eyewear including a multi-layered display having an adhesive bonding the layers together at an offset distance inward from an outer edge of the layers. The display has an image display layer, such as an optical waveguide in one example, and a pair of layers encompassing the image display layer and which may comprise optically transparent substrates, such as glass. A respective adhesive is positioned the offset distance inward from the outer edge of the display layer between the image display layer and each of the pair of layers to reduce stress in the display. Each of the adhesives may be a continuous bead such that there is no adhesive between the pair of layers and the image display layer at the outer edges. In one example, the offset distance may be at least double the thickness of the image display layer to reduce stress in the image display layer.

Abstract: Cutting a wafer having devices, such as glass optical waveguides, into die by cutting into both sides of the wafer to reduce or eliminate micro-cracks and defects in the die. The wafer can be cut by simultaneously cutting the wafer from both sides using separate lasers at a controlled depth. The wafer can also be sequentially cut by cutting into one side of the wafer, flipping the wafer, and then cutting into the other side of the wafer. A processor controls the power of each laser to select the depth of each cut, such that each cut may be 50% into the wafer, or other depths such as 30% for one cut and 70% for the other cut. The wafer may be cut into the bottom surface of the wafer first, and then cut into the top surface of the wafer having the optical waveguides.

Abstract: A semiconductor chip (26) is attached to a leadframe (20, 30, 40). The leadframe (20, 30, 40) has an opening (24) or a cavity (34, 44) for receiving the semiconductor chip (26). The opening (24) or the cavity (34, 44) and the semiconductor chip (26) have corresponding shapes. The opening (24) or the cavity (34, 44) is made such that they are smaller than the size of the semiconductor chip (26) at room temperature. The opening (24) or the cavity (34, 44) is expanded and the semiconductor chip (26) is placed in the opening (24) or the cavity (34, 44). Subsequent to placing the semiconductor chip (26) in the opening (24) or the cavity (34, 44), the leadframe (20, 30, 40) is cooled so that an edge (25) of the leadframe grips a corresponding edge (29) of the semiconductor chip (26).

Abstract: A plastic package (10) with a heat sink (11, 27, 28, 32) has a stress relief wall (18, 21, 33) formed on its upper surface. A semiconductor die (12) is mounted on the heat sink (11, 27, 28, 32) such that the top of a semiconductor die (12) is below the level of the top of the wall (18, 21, 33), and the wall (18, 21, 33) absorbs stresses which otherwise would be applied to the semiconductor die (12). The package (10) is simple to fabricate and assemble, and provides a mold lock (23, 24, 31) which serves to hold the plastic material (13) tightly to the heat sink (11, 27, 28, 32). Extra die bond material (26) can be used to increase heat flow without compromising other characteristics of the package (10).