Patents by Inventor Bengt Ahl
Bengt Ahl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6777791Abstract: A laterally diffused metal oxide semiconductor (LDMOS) power package includes a conductive mounting flange mounted on a heat sink and electrically connected to a dielectric substrate of a printed circuit board. A plurality of transistors are mounted on the top surface of the mounting flange. Each of the transistors has an input terminal, an output terminal, and a ground terminal, with the ground terminal of each transistor being electrically coupled to the top surface of the mounting flange. A plurality of parallel ground signal return paths are provided to electrically couple the top surface of the mounting flange to the dielectric substrate, thereby reducing resistance and inductance in the ground signal path and increasing the efficiency of the power package.Type: GrantFiled: April 10, 2002Date of Patent: August 17, 2004Assignee: Infineon Technologies AGInventors: Larry Leighton, Tom Moller, Bengt Ahl, Henrik Hoyer
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Patent number: 6583673Abstract: A multistage power amplifier circuit with superior isolation between gain stages provides alternative common lead currents paths from the individual gain stage elements to obtain improved stability and operational performance.Type: GrantFiled: February 26, 2001Date of Patent: June 24, 2003Assignee: Infineon Technologies AGInventors: Bengt Ahl, Prasanth Perugupalli, Larry Leighton
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Patent number: 6580316Abstract: The present invention relates to a power transistor module for radio frequency applications, particularly for use in an amplifier stage in a radio base station or a ground transmitter for TV or radio, wherein said power transistor module comprises a support, a power transistor chip arranged thereon, outer electrical connections projecting from the module, and inner electrical connections connected between said transistor chip and said outer connections, where at least one of said outer electrical connections is comprised of a first conductor pattern arranged on a flexible foil. The invention further comprises a power amplifier comprising said power transistor module, a method for fabrication of a power amplifier, wherein said module is electrically connected to a circuit board mounted at a heat sink and is mounted at said heat sink, and finally a power amplifier manufactured according to the method.Type: GrantFiled: December 14, 2000Date of Patent: June 17, 2003Assignee: Telefonaktiebolaget LM Ericsson (publ)Inventors: Lars-Anders Olofsson, Bengt Ahl
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Patent number: 6501159Abstract: The present invention relates to a power transistor module for radio frequency applications, particularly for use in an amplifier stage in a radio base station or in a ground transmitter for TV or radio, wherein said power transistor module comprises a support plate, a power transistor chip arranged thereon, outer electrical connections projecting from the module for external connection and inner electrical connections connected between said transistor chip and said outer connections, at least one of said inner electrical connections comprising a first conductor pattern arranged on a flexible foil. The invention further comprises a power amplifier comprising said module, a method in the fabrication of said module, a method in the fabrication of a power amplifier, where said module is electrically connected to a circuit board mounted at a heat sink and to be mounted at said heat sink, and finally to a power amplifier manufactured according to the method.Type: GrantFiled: December 14, 2000Date of Patent: December 31, 2002Assignee: Telefonaktiebolaget L M EricssonInventors: Lars-Anders Olofsson, Bengt Ahl
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Publication number: 20020140071Abstract: A laterally diffused metal oxide semiconductor (LDMOS) power package includes a conductive mounting flange mounted on a heat sink and electrically connected to a dielectric substrate of a printed circuit board. A plurality of transistors are mounted on the top surface of the mounting flange. Each of the transistors has an input terminal, an output terminal, and a ground terminal, with the ground terminal of each transistor being electrically coupled to the top surface of the mounting flange. A plurality of parallel ground signal return paths are provided to electrically couple the top surface of the mounting flange to the dielectric substrate, thereby reducing resistance and inductance in the ground signal path and increasing the efficiency of the power package.Type: ApplicationFiled: April 10, 2002Publication date: October 3, 2002Inventors: Larry Leighton, Tom Moller, Bengt Ahl, Henrik Hoyer
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Publication number: 20020118068Abstract: A multistage power amplifier circuit with superior isolation between gain stages provides alternative common lead currents paths from the individual gain stage elements to obtain improved stability and operational performance.Type: ApplicationFiled: February 26, 2001Publication date: August 29, 2002Applicant: Ericsson Inc.Inventors: Bengt Ahl, Prasanth Perugupalli, Larry Leighton
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Patent number: 6392298Abstract: A packaged integrated circuit device includes a substrate including a first circuit component mounted thereon, a first conductor extending from the first circuit component, and a dielectric lid. The dielectric lid includes a component mounting surface, a second circuit component mounted on the component mounting surface, and a second conductor extending from the second circuit component. The dielectric lid is adapted to engage with the substrate such that the first circuit component is in electrical communication with the second circuit component. The second circuit component may comprises an impedance matching circuit. The circuit device may also include fastening means for securing the lid to the substrate. The fastening means may comprise an adhesive, solder, or a spring biased member.Type: GrantFiled: February 28, 2000Date of Patent: May 21, 2002Assignee: Ericsson Inc.Inventors: Larry Leighton, Bengt Ahl, Thomas Moller, Henrik I. Hoyer
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Publication number: 20010038310Abstract: The present invention relates to a power transistor module for radio frequency applications, particularly for use in an amplifier stage in a radio base station or a ground transmitter for TV or radio, wherein said power transistor module comprises a support, a power transistor chip arranged thereon, outer electrical connections projecting from the module, and inner electrical connections connected between said transistor chip and said outer connections, where at least one of said outer electrical connections is comprised of a first conductor pattern arranged on a flexible foil. The invention further comprises a power amplifier comprising said power transistor module, a method for fabrication of a power amplifier, wherein said module is electrically connected to a circuit board mounted at a heat sink and is mounted at said heat sink, and finally a power amplifier manufactured according to the method. FIG. 3 suggested for publication.Type: ApplicationFiled: December 14, 2000Publication date: November 8, 2001Inventors: Lars-Anders Olofsson, Bengt Ahl
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Publication number: 20010004115Abstract: The present invention relates to a power transistor module for radio frequency applications, particularly for use in an amplifier stage in a radio base station or in a ground transmitter for TV or radio, wherein said power transistor module comprises a support plate, a power transistor chip arranged thereon, outer electrical connections projecting from the module for external connection and inner electrical connections connected between said transistor chip and said outer connections, at least one of said inner electrical connections comprising a first conductor pattern arranged on a flexible foil. The invention further comprises a power amplifier comprising said module, a method in the fabrication of said module, a method in the fabrication of a power amplifier, where said module is electrically connected to a circuit board mounted at a heat sink and to be mounted at said heat sink, and finally to a power amplifier manufactured according to the method.Type: ApplicationFiled: December 14, 2000Publication date: June 21, 2001Inventors: Lars-Anders Olofsson, Bengt Ahl
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Patent number: 6181006Abstract: An electrical assembly includes an IC package having a thermally conductive mounting flange in contact with a heat sink. A thermally conductive casing is secured to the heat sink, the casing at least partially enclosing the IC package. A resilient retaining member is disposed between the casing and IC package, the retaining member applying sufficient force on the IC package so as to maintain good thermal contact between the mounting flange and heat sink.Type: GrantFiled: May 28, 1998Date of Patent: January 30, 2001Assignee: Ericsson Inc.Inventors: Bengt Ahl, Larry C. Leighton, Thomas W. Moller
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Patent number: 6160710Abstract: A thermally conductive mounting flange of an IC package is placed directly on a heat sink surface between respective sections of single layer PC board attached to the heat sink, such that electrical leads extending from opposing sides of the package are positioned over corresponding conductive areas formed on the surface of the respective adjacent PC board section. The leads are electrically coupled with the conductive areas by respective tie-down screws fastened through dielectric isolating washers. The screws are tightened sufficiently against the isolating washers so as to press the respective package leads into solid electrical contact with the conductive areas. Portions of the respective leads and conductive areas surrounding the tie-down screws are cut-away to prevent electrical contact, in order to avoid shorting the leads and/or conductive areas to the heat sink via the tie-down screws.Type: GrantFiled: April 3, 1998Date of Patent: December 12, 2000Assignee: Ericsson Inc.Inventors: Bengt Ahl, Larry C. Leighton, Thomas W. Moller
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Patent number: 5933327Abstract: A thermally conductive mounting flange of an IC package is placed directly on a heat sink surface between respective sections of single layer PC board attached to the heat sink, such that electrical leads extending from opposing sides of the package are positioned over corresponding conductive areas formed on the surface of the respective adjacent PC board section. The respective package leads are each connected to the corresponding PC board areas by one or more flexible bond wires. In addition to electrically connecting the package leads to the respective PC board sections, the bond wires collectively secure the package to the heat sink in a manner allowing for relative lateral movement between the respective flange and heat sink surfaces in response to thermal stresses.Type: GrantFiled: April 3, 1998Date of Patent: August 3, 1999Assignee: Ericsson, Inc.Inventors: Larry C. Leighton, Thomas W. Moller, Bengt Ahl
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Patent number: 5869897Abstract: A top surface of a protective cover of an IC component package is provided with a centered-protrusion, e.g., such as a cylindrical peg, that extends above the cover. A retaining-spring is formed by twisting a resilient (e.g., metal) metal strip into a ribbon-like shape having opposing ends that extend from a curvelinear bottom surface. The bottom surface of the retaining-spring is provided with an opening configured to mate with the centered protrusion on the package cover, such that the opposing ends of the retaining-spring extend away from the package cover at substantially the same, albeit reverse angles. In order to mount the IC package to a heat sink, the bottom surface of the retaining-spring may be compressively mated onto the package cover at the same time the package is inserted between two substantially parallel walls protruding from the heat sink surface, wherein the walls are distanced from each other.Type: GrantFiled: October 22, 1997Date of Patent: February 9, 1999Assignee: Ericcson, Inc.Inventors: Larry C. Leighton, Thomas W. Moller, Bengt Ahl