Patents by Inventor Bengt Philippsen

Bengt Philippsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bond pad structure and method for producing same
    Patent number: 8169084
    Abstract: It is described a bond pad structure and a method for producing the same, the bond pad structure (1), comprising: a substrate (3) having a surface (17) to be electrically contacted; a first isolator layer (5) contacting the surface (17) of the substrate in a first region (a); a first metal layer (9) contacting the surface (17) of the substrate (3) in a second region (b) adjacent the first region (a) and partly overlapping the first isolator layer (5); a second isolator layer (11) at least partly overlapping the first isolator layer (5) and the first metal layer (9); a second metal layer (13) at least partly overlapping the second isolator layer (11) in the second region (b); wherein a maximum thickness (U) of the second metal layer (13) perpendicular to the surface (17) of the substrate (3) is smaller than a maximum thickness (t0) of the first isolator layer (5) perpendicular to the surface (17) of the substrate (3).
    Type: Grant
    Filed: November 12, 2007
    Date of Patent: May 1, 2012
    Assignee: NXP B.V.
    Inventors: Bengt Philippsen, Hans-Joerg Klammer
  • BOND PAD STRUCTURE AND METHOD FOR PRODUCING SAME
    Publication number: 20100032848
    Abstract: It is described a bond pad structure and a method for producing the same, the bond pad structure (1), comprising: a substrate (3) having a surface (17) to be electrically contacted; a first isolator layer (5) contacting the surface (17) of the substrate in a first region (a); a first metal layer (9) contacting the surface (17) of the substrate (3) in a second region (b) adjacent the first region (a) and partly overlapping the first isolator layer (5); a second isolator layer (11) at least partly overlapping the first isolator layer (5) and the first metal layer (9); a second metal layer (13) at least partly overlapping the second isolator layer (11) in the second region (b); wherein a maximum thickness (U) of the second metal layer (13) perpendicular to the surface (17) of the substrate (3) is smaller than a maximum thickness (t0) of the first isolator layer (5) perpendicular to the surface (17) of the substrate (3).
    Type: Application
    Filed: November 12, 2007
    Publication date: February 11, 2010
    Applicant: NXP, B.V.
    Inventors: Bengt Philippsen, Hans-Joerg Klammer