Patents by Inventor BENJAMIN CHENG WANG

BENJAMIN CHENG WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatus for thermal based substrate processing with variable temperature capability
    Patent number: 8920564
    Abstract: A substrate support may include a body; an inner ring disposed about the body; an outer ring disposed about the inner ring forming a first opening therebetween; a first seal ring disposed above the first opening; a shadow ring disposed above the inner ring, extending inward from the outer ring and forming a second opening between the shadow and outer rings; a second seal ring disposed above the second opening; a space at least partially defined by the body and the inner, outer, first, second, and shadow rings; a first gap defined between a processing surface of a substrate when present and the shadow ring; and a plurality of second gaps fluidly coupled to the space; wherein the first gap and the plurality of second gaps are configured such that, when a substrate is present, a gas provided to the space flows out of the space through the first gap.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: December 30, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Gwo-Chuan Tzu, Xiaoxiong Yuan, Amit Khandelwal, Benjamin Cheng Wang, Avgerinos V. Gelatos, Kai Wu, Michael P. Karazim, Jing Lin, Olkan Cuvalci
  • METHODS AND APPARATUS FOR THERMAL BASED SUBSTRATE PROCESSING WITH VARIABLE TEMPERATURE CAPABILITY
    Publication number: 20120003388
    Abstract: A substrate support may include a body; an inner ring disposed about the body; an outer ring disposed about the inner ring forming a first opening therebetween; a first seal ring disposed above the first opening; a shadow ring disposed above the inner ring, extending inward from the outer ring and forming a second opening between the shadow and outer rings; a second seal ring disposed above the second opening; a space at least partially defined by the body and the inner, outer, first, second, and shadow rings; a first gap defined between a processing surface of a substrate when present and the shadow ring; and a plurality of second gaps fluidly coupled to the space; wherein the first gap and the plurality of second gaps are configured such that, when a substrate is present, a gas provided to the space flows out of the space through the first gap.
    Type: Application
    Filed: June 27, 2011
    Publication date: January 5, 2012
    Applicant: APPLIED MATERIALS, INC.
    Inventors: GWO-CHUAN TZU, XIAOXIONG YUAN, AMIT KHANDELWAL, BENJAMIN CHENG WANG, AVGERINOS V. GELATOS, KAI WU, MICHAEL P. KARAZIM, JING LIN, OLKAN CUVALCI