Patents by Inventor Benjamin H. Bloom

Benjamin H. Bloom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Headphones
    Patent number: 11985462
    Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
    Type: Grant
    Filed: August 1, 2022
    Date of Patent: May 14, 2024
    Assignee: APPLE INC.
    Inventors: Edward Siahaan, Daniel R. Bloom, Lee M. Panecki, Phillip Qian, Benjamin A. Shaffer, Christopher J. Stringer, Eugene A. Whang, David H. Narajowski, Scott Y. Oshita, Dustin A. Hatfield, Zachary G. Segraves, Sean J. Docherty
  • Folded envelopes, unitary blanks for forming folded envelopes and methods for manufacturing folded one-piece envelopes
    Patent number: 5626281
    Abstract: An envelope is formed from a scored blank. The blank is folded to form the envelope and comprises a sheet with score lines forming the boundary of a central portion which comprises a front of the envelope. A closure flap is hingedly connected to the remainder of the envelope along one of the score lines. A safety flap, also connected to the envelope along one of the score lines, is under the closure flap.
    Type: Grant
    Filed: January 26, 1994
    Date of Patent: May 6, 1997
    Inventor: Benjamin H. Bloom