Patents by Inventor Benjamin H. Wood, III

Benjamin H. Wood, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DRIP IRRIGATION TUBE FITTING TOOL
    Publication number: 20110016682
    Abstract: The present invention provides a tool for securing fittings for fluid delivery systems, such as drip irrigation systems, and assisting in the assembly of such systems. Specifically, the tool is a device sized and shaped to fit comfortably within the hand of an adult, having a channel therein to accept and secure fittings, which can then be easily be inserted into fluid delivery tubing.
    Type: Application
    Filed: July 21, 2010
    Publication date: January 27, 2011
    Inventor: Benjamin H. Wood, III
  • Method of making a fluid ejection head for a fluid ejection device
    Patent number: 7480994
    Abstract: A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable adhesive disposed on the substrate, and a cover coupled with the substrate via the electromagnetic radiation-curable adhesive, wherein the cover includes an opening configured to pass fluids ejected from the fluid ejection die, and wherein the cover is made at least partially of a material transparent to electromagnetic radiation.
    Type: Grant
    Filed: February 16, 2007
    Date of Patent: January 27, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Benjamin H. Wood, III, Joseph E. Scheffelin, Noah Lassar, Mohammad Akhavain
  • Fluid ejection head assembly
    Patent number: 7188925
    Abstract: A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable adhesive disposed on the substrate, and a cover coupled with the substrate via the electromagnetic radiation-curable adhesive, wherein the cover includes an opening configured to pass fluids ejected from the fluid ejection die, and wherein the cover is made at least partially of a material transparent to electromagnetic radiation.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: March 13, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Benjamin H. Wood, III, Joseph E. Scheffelin, Noah Lassar, Mohammad Akhavain