Patents by Inventor Benjamin Ian Hsia
Benjamin Ian Hsia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240088317Abstract: Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Inventors: RICHARD HAMILTON SEWELL, DAVID FREDRIC JOEL KAVULAK, LEWIS ABRA, THOMAS P. PASS, TAESEOK KIM, MATTHIEU MOORS, BENJAMIN IAN HSIA, GABRIEL HARLEY
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Patent number: 11862745Abstract: Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.Type: GrantFiled: January 13, 2020Date of Patent: January 2, 2024Assignee: Maxeon Solar Pte. Ltd.Inventors: Richard Hamilton Sewell, David Fredric Joel Kavulak, Lewis Abra, Thomas P. Pass, Taeseok Kim, Matthieu Moors, Benjamin Ian Hsia, Gabriel Harley
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Publication number: 20230070805Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. For example, a method of fabricating a solar cell involves forming a plurality of alternating N-type and P-type semiconductor regions in or above a substrate. The method also involves forming a paste between adjacent ones of the alternating N-type and P-type semiconductor regions. The method also involves curing the paste to form non-conductive material regions in alignment with locations between the alternating N-type and P-type semiconductor regions. The method also involves adhering a metal foil to the alternating N-type and P-type semiconductor regions. The method also involves laser ablating through the metal foil in alignment with the locations between the alternating N-type and P-type semiconductor regions to isolate regions of remaining metal foil in alignment with the alternating N-type and P-type semiconductor regions.Type: ApplicationFiled: November 3, 2022Publication date: March 9, 2023Inventors: Benjamin Ian Hsia, GABRIEL HARLEY, TAESEOK KIM, RICHARD HAMILTON SEWELL, SUNG DUG KIM
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Patent number: 10672924Abstract: Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.Type: GrantFiled: January 2, 2019Date of Patent: June 2, 2020Assignees: SunPower Corporation, Total Marketing ServicesInventors: Robert Woehl, Richard Hamilton Sewell, Mohamed A. Elbandrawy, Taeseok Kim, Thomas P. Pass, Benjamin Ian Hsia, David Fredric Joel Kavulak, Nils-Peter Harder
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Publication number: 20200152813Abstract: Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.Type: ApplicationFiled: January 13, 2020Publication date: May 14, 2020Inventors: Richard Hamilton Sewell, David Fredric Joel Kavulak, Lewis Abra, Thomas P. Pass, Taeseok Kim, Matthieu Moors, Benjamin Ian Hsia, Gabriel Harley
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Patent number: 10535790Abstract: Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.Type: GrantFiled: June 25, 2015Date of Patent: January 14, 2020Assignees: SunPower Corporation, Total Marketing ServicesInventors: Richard Hamilton Sewell, David Fredric Joel Kavulak, Lewis Abra, Thomas P. Pass, Taeseok Kim, Matthieu Moors, Benjamin Ian Hsia, Gabriel Harley
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Publication number: 20190140116Abstract: Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.Type: ApplicationFiled: January 2, 2019Publication date: May 9, 2019Inventors: Robert Woehl, Richard Hamilton Sewell, Mohamed A. Elbandrawy, Taeseok Kim, Thomas P. Pass, Benjamin Ian Hsia, David Fredric Joel Kavulak, Nils-Peter Harder
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Patent number: 10177260Abstract: Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.Type: GrantFiled: March 8, 2017Date of Patent: January 8, 2019Assignees: SunPower Corporation, Total Marketing ServicesInventors: Robert Woehl, Richard Hamilton Sewell, Mohamed A. Elbandrawy, Taeseok Kim, Thomas P. Pass, Benjamin Ian Hsia, David Fredric Joel Kavulak, Nils-Peter Harder
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Patent number: 9911874Abstract: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a contact finger coupled to the semiconductor region via a plurality of weld regions with at least one of the weld regions being a partial weld.Type: GrantFiled: May 30, 2014Date of Patent: March 6, 2018Assignee: SunPower CorporationInventors: Gabriel Harley, Taeseok Kim, Benjamin Ian Hsia
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Patent number: 9871150Abstract: Methods of fabricating a solar cell including metallization techniques and resulting solar cells, are described. In an example, a first and second semiconductor regions can be formed in or above a substrate, where a separation region is disposed between the first and second semiconductor regions. A protective region can be formed over the separation region. A first metal layer can be formed over the substrate, where the protective region prevents and/or inhibits damage to the separation region during the formation of the first metal layer. Conductive contacts can be formed over the first and second semiconductor regions.Type: GrantFiled: July 1, 2016Date of Patent: January 16, 2018Assignee: SunPower CorporationInventors: Benjamin Ian Hsia, David Aaron Randolph Barkhouse, Todd Richards Johnson, Michael Cudzinovic
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Publication number: 20180006170Abstract: Methods of fabricating a solar cell including metallization techniques and resulting solar cells, are described. In an example, a first and second semiconductor regions can be formed in or above a substrate, where a separation region is disposed between the first and second semiconductor regions. A protective region can be formed over the separation region. A first metal layer can be formed over the substrate, where the protective region prevents and/or inhibits damage to the separation region during the formation of the first metal layer. Conductive contacts can be formed over the first and second semiconductor regions.Type: ApplicationFiled: July 1, 2016Publication date: January 4, 2018Inventors: Benjamin Ian Hsia, David Aaron Randolph Barkhouse, Todd Richards Johnson, Michael Cudzinovic
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Patent number: 9831377Abstract: Die-cutting approaches for foil-based metallization of solar cells, and the resulting solar cells are disclosed herein. Die-cutting approaches for foil-based metallization of solar cells include forming a plurality of semiconductor regions in or above a substrate and forming a patterned damage buffer in alignment with locations between the plurality of semiconductor regions. Additionally, a metal layer comprising a metal seed layer and/or metal foil is formed over the patterned damage buffer. The metal layer is cut by a cutting die at locations between the plurality of semiconductor regions by applying a mechanical force to the cutting die.Type: GrantFiled: February 29, 2016Date of Patent: November 28, 2017Assignee: SunPower CorporationInventors: Richard Hamilton Sewell, Benjamin Ian Hsia
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Publication number: 20170250305Abstract: Die-cutting approaches for foil-based metallization of solar cells, and the resulting solar cells are disclosed herein. Die-cutting approaches for foil-based metallization of solar cells include forming a plurality of semiconductor regions in or above a substrate and forming a patterned damage buffer in alignment with locations between the plurality of semiconductor regions. Additionally, a metal layer comprising a metal seed layer and/or metal foil is formed over the patterned damage buffer. The metal layer is cut by a cutting die at locations between the plurality of semiconductor regions by applying a mechanical force to the cutting die.Type: ApplicationFiled: February 29, 2016Publication date: August 31, 2017Inventors: Richard Hamilton Sewell, Benjamin Ian Hsia
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Publication number: 20170179308Abstract: Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.Type: ApplicationFiled: March 8, 2017Publication date: June 22, 2017Inventors: Robert Woehl, Richard Hamilton Sewell, Mohamed A. Elbandrawy, Taeseok Kim, Thomas P. Pass, Benjamin Ian Hsia, David Fredric Joel Kavulak, Nils-Peter Harder
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Publication number: 20170125612Abstract: Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.Type: ApplicationFiled: October 29, 2015Publication date: May 4, 2017Inventors: Robert Woehl, Richard Hamilton Sewell, Mohamed A. Elbandrawy, Taeseok Kim, Thomas P. Pass, Benjamin Ian Hsia, David Fredric Joel Kavulak, Nils-Peter Harder
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Patent number: 9620655Abstract: Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.Type: GrantFiled: October 29, 2015Date of Patent: April 11, 2017Assignees: SunPower Corporation, Total Marketing ServicesInventors: Robert Woehl, Richard Hamilton Sewell, Mohamed A. Elbandrawy, Taeseok Kim, Thomas P. Pass, Benjamin Ian Hsia, David Fredric Joel Kavulak, Nils-Peter Harder
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Publication number: 20160380132Abstract: Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.Type: ApplicationFiled: June 25, 2015Publication date: December 29, 2016Inventors: Richard Hamilton Sewell, David Fredric Joel Kavulak, Lewis Abra, Thomas P. Pass, Taeseok Kim, Matthieu Moors, Benjamin Ian Hsia, Gabriel Harley
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Publication number: 20160163901Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. For example, a method of fabricating a solar cell involves forming a plurality of alternating N-type and P-type semiconductor regions in or above a substrate. The method also involves forming a paste between adjacent ones of the alternating N-type and P-type semiconductor regions. The method also involves curing the paste to form non-conductive material regions in alignment with locations between the alternating N-type and P-type semiconductor regions. The method also involves adhering a metal foil to the alternating N-type and P-type semiconductor regions. The method also involves laser ablating through the metal foil in alignment with the locations between the alternating N-type and P-type semiconductor regions to isolate regions of remaining metal foil in alignment with the alternating N-type and P-type semiconductor regions.Type: ApplicationFiled: December 8, 2014Publication date: June 9, 2016Inventors: Benjamin Ian Hsia, Gabriel Harley, Taeseok Kim, Richard Hamilton Sewell, Sung Dug Kim
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Publication number: 20150349154Abstract: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a contact finger coupled to the semiconductor region via a plurality of weld regions with at least one of the weld regions being a partial weld.Type: ApplicationFiled: May 30, 2014Publication date: December 3, 2015Inventors: Gabriel Harley, Taeseok Kim, Benjamin Ian Hsia