Patents by Inventor Benjamin M. Curtin
Benjamin M. Curtin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240159068Abstract: A docking station for a medical device is described. In some examples, the docking station includes a frame and a base plate coupled to the frame. At least a portion of the base plate is coupled to a lower portion of the frame. In some examples, an electronic connector of the docking station is configured to couple to the medical device and to provide power to the medical device when the medical device is docked to the docking station. In some examples, a docking mechanism is coupled to an upper portion of the frame and configured to retain the medical device.Type: ApplicationFiled: January 25, 2024Publication date: May 16, 2024Applicant: Physio-Control, Inc.Inventors: Barry D. Curtin, Alexander Hamilton, Kristina Edmonson, David Andrews, Christopher G. Alviar, Neal Stanley Clark, Benjamin Danziger, Christopher William Egbert, Jason Fouts, Matthew Malone, Joshua Berndt, Brigitta M. Suwandana, Jeremy Edward Brummett
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Patent number: 11971575Abstract: Absolute temperature measurements of integrated photonic devices can be accomplished with integrated bandgap temperature sensors located adjacent the photonic devices. In various embodiments, the temperature of the active region within a diode structure of a photonic device is measured with an integrated bandgap temperature sensor that includes one or more diode junctions either in the semiconductor device layer beneath the active region or laterally adjacent to the photonic device, or in a diode structure formed above the semiconductor device layer and adjacent the diode structure of the photonic device.Type: GrantFiled: December 19, 2022Date of Patent: April 30, 2024Assignee: OpenLight Photonics, Inc.Inventors: John Parker, Benjamin M. Curtin
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Patent number: 11920361Abstract: A docking station for a medical device is described. In some examples, the docking station includes a frame and a base plate coupled to the frame. At least a portion of the base plate is coupled to a lower portion of the frame. In some examples, an electronic connector of the docking station is configured to couple to the medical device and to provide power to the medical device when the medical device is docked to the docking station. In some examples, a docking mechanism is coupled to an upper portion of the frame and configured to retain the medical device.Type: GrantFiled: March 26, 2021Date of Patent: March 5, 2024Assignee: PHYSIO-CONTROL, INC.Inventors: Barry D. Curtin, Alexander Hamilton, Kristina Edmonson, David Andrews, Christopher G. Alviar, Neal Stanley Clark, Benjamin Danziger, Christopher William Egbert, Jason Fouts, Matthew Malone, Joshua Berndt, Brigitta M. Suwandana, Jeremy Edward Brummett
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Patent number: 11699677Abstract: Described herein is a die-to-wafer bonding process that utilizes micro-transfer printing to transfer die from a source wafer onto an intermediate handle wafer. The resulting intermediate handle wafer structure can then be bonded die-down onto the target wafer, followed by removal of only the intermediate handle wafer, leaving the die in place bonded to the target wafer.Type: GrantFiled: June 30, 2020Date of Patent: July 11, 2023Assignee: OpenLight Photonics, Inc.Inventors: Roberto Marcoccia, Benjamin M. Curtin
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Publication number: 20230117058Abstract: Absolute temperature measurements of integrated photonic devices can be accomplished with integrated bandgap temperature sensors located adjacent the photonic devices. In various embodiments, the temperature of the active region within a diode structure of a photonic device is measured with an integrated bandgap temperature sensor that includes one or more diode junctions either in the semiconductor device layer beneath the active region or laterally adjacent to the photonic device, or in a diode structure formed above the semiconductor device layer and adjacent the diode structure of the photonic device.Type: ApplicationFiled: December 19, 2022Publication date: April 20, 2023Inventors: John Parker, Benjamin M. Curtin
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Patent number: 11536899Abstract: Absolute temperature measurements of integrated photonic devices can be accomplished with integrated bandgap temperature sensors located adjacent the photonic devices. In various embodiments, the temperature of the active region within a diode structure of a photonic device is measured with an integrated bandgap temperature sensor that includes one or more diode junctions either in the semiconductor device layer beneath the active region or laterally adjacent to the photonic device, or in a diode structure formed above the semiconductor device layer and adjacent the diode structure of the photonic device.Type: GrantFiled: June 30, 2020Date of Patent: December 27, 2022Assignee: OpenLight Photonics, Inc.Inventors: John Parker, Benjamin M. Curtin
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Patent number: 11499923Abstract: Photonic errors in a photonic integrated circuit can be imaged using an on-chip light source integrated in a photonic layer of the circuit. The on-chip light source can generate light at wavelengths that propagates through one or more substrate layers to an image sensor sensitive to the wavelength range. The on-chip light source can be tunable and provide different power settings that can be utilized to detect different types of optical errors in the photonic integrated circuit.Type: GrantFiled: September 30, 2020Date of Patent: November 15, 2022Assignee: OpenLight Photonics, Inc.Inventor: Benjamin M. Curtin
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Patent number: 11428646Abstract: Optical fabrication monitor structures can be included in a design fabricated on a wafer from a mask or fabrication reticle. A first set of components can be formed in an initial fabrication cycle, where the first set includes functional components and monitor structures. A second set of components can be formed by subsequent fabrication processes that can potentially cause errors or damage to the first set of components. The monitor structures can be implemented during fabrication (e.g., in a cleanroom) to detect fabrication errors without pulling or scrapping the wafer.Type: GrantFiled: August 28, 2020Date of Patent: August 30, 2022Assignee: OpenLight Photonics, Inc.Inventors: Erik Johan Norberg, Rui Liang, Benjamin M. Curtin, Jared Bauters
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Publication number: 20220099590Abstract: Photonic errors in a photonic integrated circuit can be imaged using an on-chip light source integrated in a photonic layer of the circuit. The on-chip light source can generate light at wavelengths that propagates through one or more substrate layers to an image sensor sensitive to the wavelength range. The on-chip light source can be tunable and provide different power settings that can be utilized to detect different types of optical errors in the photonic integrated circuit.Type: ApplicationFiled: September 30, 2020Publication date: March 31, 2022Inventor: Benjamin M. Curtin
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Publication number: 20220065798Abstract: Optical fabrication monitor structures can be included in a design fabricated on a wafer from a mask or fabrication reticle. A first set of components can be formed in an initial fabrication cycle, where the first set includes functional components and monitor structures. A second set of components can be formed by subsequent fabrication processes that can potentially cause errors or damage to the first set of components. The monitor structures can be implemented during fabrication (e.g., in a cleanroom) to detect fabrication errors without pulling or scrapping the wafer.Type: ApplicationFiled: August 28, 2020Publication date: March 3, 2022Inventors: Erik Johan Norberg, Rui Liang, Benjamin M. Curtin, Jared Bauters
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Publication number: 20210407959Abstract: Described herein is a die-to-wafer bonding process that utilizes micro-transfer printing to transfer die from a source wafer onto an intermediate handle wafer. The resulting intermediate handle wafer structure can then be bonded die-down onto the target wafer, followed by removal of only the intermediate handle wafer, leaving the die in place bonded to the target wafer.Type: ApplicationFiled: June 30, 2020Publication date: December 30, 2021Inventors: Roberto Marcoccia, Benjamin M. Curtin
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Publication number: 20210405291Abstract: Absolute temperature measurements of integrated photonic devices can be accomplished with integrated bandgap temperature sensors located adjacent the photonic devices. In various embodiments, the temperature of the active region within a diode structure of a photonic device is measured with an integrated bandgap temperature sensor that includes one or more diode junctions either in the semiconductor device layer beneath the active region or laterally adjacent to the photonic device, or in a diode structure formed above the semiconductor device layer and adjacent the diode structure of the photonic device.Type: ApplicationFiled: June 30, 2020Publication date: December 30, 2021Inventors: John Parker, Benjamin M. Curtin