Patents by Inventor Benjamin M. Lee

Benjamin M. Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11923269
    Abstract: An optical module includes an optoelectronic assembly and a heat spreader. The optoelectronic assembly includes a flat, rigid substrate, an array of electrical contacts positioned on a first portion of the substrate, and an optoelectronics assemblage that is electrically connected to the array of contacts and is positioned apart from the array of electrical contacts. The heat spreader is comprised of a thermally conductive material and comprises a second portion that is structurally connected to the first portion and a third portion that is thermally connected to the optoelectronics assemblage.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: March 5, 2024
    Assignee: International Business Machines Corporation
    Inventors: Mark D. Schultz, Fuad Elias Doany, Benjamin Giles Lee, Daniel M. Kuchta, Christian Wilhelmus Baks
  • Patent number: 5909860
    Abstract: In order to control the deployment of secondary deployment structures in a deployment system that includes both a primary and a secondary deployment, an improved deployment sequencer utilizes the rotational motion of primary deployment structures. In particular, the rotational motion serves to control the retention and release of the secondary deployment structures during the primary deployment. Still more specifically, the deployment sequencer restrains the deployment of the secondary deployment structures until the primary deployment structures have deployed or rotated far enough so that collisions between the secondary deployment structures are avoided.
    Type: Grant
    Filed: February 26, 1998
    Date of Patent: June 8, 1999
    Assignee: Hughes Electronics Corporation
    Inventor: Benjamin M. Lee