Abstract: A via resistor structure and method are provided for implementing a resistor and for trimming a resistance value of the resistor. A resistive material selectively is deposited adjacent to a pad connecting to a via where a resistor is to be defined. A trimmed path is formed in the resistive material for selectively changing the resistance value of the resistor.

Abstract: An apparatus and method for simulation and testing of electronic systems using a single model that has the composite behavioral information of multiple parts. The single model allows the designer to simulate using one model that captures the anticipated extremes (best case behavior to worst case behavior) across a collection of devices from different vendors.

Abstract: An electronic assembly and system and method implementing the same are disclosed herein. The electronic assembly includes an IC carrier package having circuitry contained within a housing unit. The IC carrier package includes a connector interface for electrically coupling the IC carrier package circuitry to a printed circuit board. The connector interface is further characterized as having a graduated step surface contour with one or more electrical contacts disposed on at least two graduated step connector surfaces of the connector interface. The electronic assembly further includes a multilayer printed circuit board having a mounting site cavity for mounting the IC carrier package. The mounting site cavity includes having at least two seating surfaces offset in a graduated step manner for receivably seating the at least two graduated step connector surfaces of the IC carrier package connector interface.

Abstract: A high frequency connector utilizes flex strip signal/reference conductor pairs extending in channels formed in a dielectric connector body between terminations at connector ends. The flex strips are formed as signal and reference conductor traces separated by a flexible dielectric wherein the impedance can be influenced by the width of the signal and reference traces and the thickness and selected material of the dielectric separating the adjoining conductor traces. Design of the flex strip assemblies is used to vary the capacitance which enables the connector impedance to match the impedance of the circuits and/or cables connected to the connector and mitigate any discontinuities among the sequence of circuit paths. The close proximity of signal and reference traces within the pair and the separation of signal lines in the connector body reduces cross talk by minimizing mutual inductance between signal lines.