Patents by Inventor Benjamin P. Bayer
Benjamin P. Bayer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8101093Abstract: The invention provides methods of polishing a noble metal-containing substrate with one of two chemical-mechanical polishing compositions. The first chemical-mechanical polishing composition comprises (a) an abrasive comprising ?-alumina, (b) about 0.05 to about 50 mmol/kg of ions of calcium, strontium, barium, or mixtures thereof, and (c) a liquid carrier comprising water. The second chemical-mechanical polishing composition comprises (a) an abrasive selected from the group consisting of ?-alumina, ?-alumina, ?-alumina, ?-alumina, diamond, boron carbide, silicon carbide, tungsten carbide, titanium nitride, and mixtures thereof, (b) about 0.05 to about 3.5 mmol/kg of ions of calcium, strontium, barium, magnesium, zinc, or mixtures thereof, and (c) a liquid carrier comprising water.Type: GrantFiled: February 26, 2009Date of Patent: January 24, 2012Assignee: Cabot Microelectronics CorporationInventors: Francesco de Rege Thesauro, Kevin J. Moeggenborg, Vlasta Brusic, Benjamin P. Bayer
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Patent number: 7563383Abstract: The invention provides a method of polishing a substrate comprising contacting a substrate comprising a noble metal on a surface of the substrate with a chemical-mechanical polishing system comprising (a) a polishing component selected from the group consisting of an abrasive, a polishing pad, and a combination thereof, (b) an oxidizing agent, (c) an ethylene-oxide containing polymer, and (d) a liquid carrier, and abrading at least a portion of the noble metal with the chemical-mechanical polishing system to polish the substrate.Type: GrantFiled: October 12, 2004Date of Patent: July 21, 2009Assignee: Cabot Mircroelectronics CorporationInventors: Francesco de Rege Thesauro, Benjamin P. Bayer
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Publication number: 20090152240Abstract: The invention provides methods of polishing a noble metal-containing substrate with one of two chemical-mechanical polishing compositions. The first chemical-mechanical polishing composition comprises (a) an abrasive comprising ?-alumina, (b) about 0.05 to about 50 mmol/kg of ions of calcium, strontium, barium, or mixtures thereof, and (c) a liquid carrier comprising water. The second chemical-mechanical polishing composition comprises (a) an abrasive selected from the group consisting of ?-alumina, ?-alumina, ?-alumina, ?-alumina, diamond, boron carbide, silicon carbide, tungsten carbide, titanium nitride, and mixtures thereof, (b) about 0.05 to about 3.5 mmol/kg of ions of calcium, strontium, barium, magnesium, zinc, or mixtures thereof, and (c) a liquid carrier comprising water.Type: ApplicationFiled: February 26, 2009Publication date: June 18, 2009Applicant: Cabot Microelectronics CorporationInventors: Francesco de Rege Thesauro, Kevin J. Moeggenborg, Vlasta Brusic, Benjamin P. Bayer
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Patent number: 7288021Abstract: The invention provides a method for polishing a substrate comprising a metal in an oxidized form, the method comprising the steps of: (a) providing a substrate comprising a metal in an oxidized form, (b) contacting a portion of the substrate with a chemical-mechanical polishing system comprising: (i) a polishing component, (ii) a reducing agent, and (iii) a liquid carrier, and (c) abrading at least a portion of the metal in an oxidized form to polish the substrate. The reducing agent can be selected from the group consisting of 3-hydroxy-4-pyrones, ?-hydroxy-?-butyrolactones, ascorbic acid, borane, borohydrides, dialkylamine boranes, formaldehyde, formic acid, hydrogen, hydroquinones, hydroxylamine, hypophosphorous acid, phosphorous acid, a metal or metal ions in an oxidation state having a standard redox potential that is less than the standard redox potential of the metal in an oxidized form, trihydroxybenzenes, solvated electrons, sulfurous acid, salts thereof, and mixtures thereof.Type: GrantFiled: January 7, 2004Date of Patent: October 30, 2007Assignee: Cabot Microelectronics CorporationInventors: Francesco De Rege Thesauro, Vlasta Brusic, Benjamin P. Bayer
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Patent number: 7160807Abstract: The invention provides a method of polishing a substrate comprising (i) contacting a substrate comprising a noble metal layer with a chemical-mechanical polishing system comprising (a) a polishing component, (b) an oxidizing agent, and (c) a liquid carrier, and (ii) abrading at least a portion of the noble metal layer to polish the substrate. The polishing component is selected from the group consisting of an abrasive, a polishing pad, or a combination thereof, and the oxidizing agent is selected from the group consisting of bromates, bromites, hypobromites, chlorates, chlorites, hypochlorites, perchlorates, iodates, hypoiodites, periodates, peroxyacetic acid, organo-halo-oxy compounds, salts thereof, and combinations thereof. The chemical-mechanical polishing system has a pH of about 9 or less, and the oxidizing agent does not produce a substantial amount of elemental halogen.Type: GrantFiled: June 30, 2003Date of Patent: January 9, 2007Assignee: Cabot Microelectronics CorporationInventors: Francesco De Rege Thesauro, Vlasta Brusic, Benjamin P. Bayer
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Patent number: 7161247Abstract: The invention provides a polishing composition and a method of chemically-mechanically polishing a substrate comprising a noble metal, the polishing composition comprising (a) an oxidizing agent that oxidizes a noble metal, (b) an anion selected from the group consisting of sulfate, borate, nitrate, and phosphate, and (c) a liquid carrier. The invention further provides a polishing composition and a method of chemically-mechanically polishing a substrate comprising ruthenium, the polishing composition comprising (a) an oxidizing agent that oxidizes ruthenium above the +4 oxidation state, (b) a polishing additive selected from the group consisting of metal sequestering polymers, metal chelators, organic thiols, compounds that reduce ruthenium tetraoxide, lactones, and ?-hydroxycarbonyl compounds.Type: GrantFiled: July 28, 2004Date of Patent: January 9, 2007Assignee: Cabot Microelectronics CorporationInventors: Francesco De Rege Thesauro, Vlasta Brusic, Christopher C. Thompson, Benjamin P. Bayer
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Patent number: 7097541Abstract: The invention provides a method of polishing a substrate comprising a noble metal comprising (i) contacting the substrate with a CMP system and (ii) abrading at least a portion of the substrate to polish the substrate. The CMP system comprises an abrasive and/or polishing pad, a liquid carrier, and a sulfonic acid compound.Type: GrantFiled: February 27, 2003Date of Patent: August 29, 2006Assignee: Cabot Microelectronics CorporationInventors: Francesco DeRege Thesauro, Vlasta Brusic, Benjamin P. Bayer
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Publication number: 20040266196Abstract: The invention provides a method of polishing a substrate comprising (i) contacting a substrate comprising a noble metal layer with a chemical-mechanical polishing system comprising (a) a polishing component, (b) an oxidizing agent, and (c) a liquid carrier, and (ii) abrading at least a portion of the noble metal layer to polish the substrate. The polishing component is selected from the group consisting of an abrasive, a polishing pad, or a combination thereof, and the oxidizing agent is selected from the group consisting of bromates, bromites, hypobromites, chlorates, chlorites, hypochlorites, perchlorates, iodates, hypoiodites, periodates, peroxyacetic acid, organo-halo-oxy compounds, salts thereof, and combinations thereof. The chemical-mechanical polishing system has a pH of about 9 or less, and the oxidizing agent does not produce a substantial amount of elemental halogen.Type: ApplicationFiled: June 30, 2003Publication date: December 30, 2004Applicant: Cabot Microelectronics CorporationInventors: Francesco De Rege Thesauro, Vlasta Brusic, Benjamin P. Bayer
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Publication number: 20030181142Abstract: The invention provides a method of polishing a substrate comprising a noble metal comprising (i) contacting the substrate with a CMP system and (ii) abrading at least a portion of the substrate to polish the substrate. The CMP system comprises an abrasive and/or polishing pad, a liquid carrier, and a sulfonic acid compound.Type: ApplicationFiled: February 27, 2003Publication date: September 25, 2003Applicant: Cabot Microelectronics CorporationInventors: Francesco De Rege Thesauro, Vlasta Brusic, Benjamin P. Bayer