Patents by Inventor Benjamin S. Wong

Benjamin S. Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7630230
    Abstract: An architecture for a semiconductor static random access memory (SRAM) is described. In one example, a first set or group or stage of SRAM banks are coupled to a first data bus formed using bit line pairs, and a second set or group or stage of SRAM banks are coupled to a second data bus formed using other bit line pairs. The number of banks coupled to each bit line pair is determined by the SRAM's operating frequency and size. Each data bus is coupled to a sense amplifier. The output from the sense amplifier is then coupled to the bit line pair of a group of SRAM banks. This adjacent group has staging logic coupled to each SRAM bank to store the output of the SRAM bank until the contents from the first group is placed on the bit line of the adjacent stage of SRAM banks. The output from either the first stage or from one of the SRAM banks in the adjacent stage's SRAM banks, which had been stored in the adjacent stage's staging logic, is driven to the sense amplifier coupled to the adjacent stage.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: December 8, 2009
    Assignee: Cisco Technology, Inc.
    Inventor: Benjamin S. Wong
  • Publication number: 20080144361
    Abstract: An architecture for a semiconductor static random access memory (SRAM) is described. In one example, a first set or group or stage of SRAM banks are coupled to a first data bus formed using bit line pairs, and a second set or group or stage of SRAM banks are coupled to a second data bus formed using other bit line pairs. The number of banks coupled to each bit line pair is determined by the SRAM's operating frequency and size. Each data bus is coupled to a sense amplifier. The output from the sense amplifier is then coupled to the bit line pair of a group of SRAM banks. This adjacent group has staging logic coupled to each SRAM bank to store the output of the SRAM bank until the contents from the first group is placed on the bit line of the adjacent stage of SRAM banks. The output from either the first stage or from one of the SRAM banks in the adjacent stage's SRAM banks, which had been stored in the adjacent stage's staging logic, is driven to the sense amplifier coupled to the adjacent stage.
    Type: Application
    Filed: November 30, 2007
    Publication date: June 19, 2008
    Inventor: Benjamin S. Wong
  • Patent number: 7327597
    Abstract: An architecture for a semiconductor static random access memory (SRAM) is described. In one example, a first set or group or stage of SRAM banks are coupled to a first data bus formed using bit line pairs, and a second set or group or stage of SRAM banks are coupled to a second data bus formed using other bit line pairs. The number of banks coupled to each bit line pair is determined by the SRAM's operating frequency and size. Each data bus is coupled to a sense amplifier. The output from the sense amplifier is then coupled to the bit line pair of a group of SRAM banks. This adjacent group has staging logic coupled to each SRAM bank to store the output of the SRAM bank until the contents from the first group is placed on the bit line of the adjacent stage of SRAM banks. The output from either the first stage or from one of the SRAM banks in the adjacent stage's SRAM banks, which had been stored in the adjacent stage's staging logic, is driven to the sense amplifier coupled to the adjacent stage.
    Type: Grant
    Filed: April 11, 2003
    Date of Patent: February 5, 2008
    Assignee: Cisco Technology, Inc.
    Inventor: Benjamin S. Wong
  • Patent number: 6805947
    Abstract: A method of rendering a surface of a metal substrate substantially acid impervious. The method includes first placing the surface in a field of treatment, then depositing a mixture of a high-temperature resistant polymer particulate such as polyamide particulate and a curable powder adhesive on the surface, and finally subjecting the surface-coated metal substrate to a curing treatment sufficient to cure the powder adhesive and thereby adhere the polymer particulate as a film on the surface. A steel substrate coated in accord with the present methodology is particularly useful as a curing fixture upon which resin-impregnated fiber of polymer composite material is placed to thereby give molded parts made therefrom a desired shape. Production of a part is accomplished by vacuum bagging the composite material to the steel fixture and curing the so-produced part in place on the fixture in an autoclave at an elevated temperature.
    Type: Grant
    Filed: August 2, 2000
    Date of Patent: October 19, 2004
    Assignee: Northrop Grumman Corporation
    Inventors: Jerry Wynn Brimer, Ernie Robert Silva, William K. Oehlert, James A. Kirk, Benjamin S. Wong
  • Patent number: D1027829
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: May 21, 2024
    Assignee: ChargePoint, Inc.
    Inventors: Justin D. Cumming, Peter H. Muller, David Hoenig, Pasquale Romano, Darren Chin-Ho Kim, Benjamin Bylenok, Dennis Michael Heleine, Stephen Eric Sidle, Michal Lekszycki, Aaron Dayton Little, Jacky S. Wong
  • Patent number: D1027830
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: May 21, 2024
    Assignee: ChargePoint, Inc.
    Inventors: Justin D. Cumming, Peter H. Muller, David Hoenig, Pasquale Romano, Darren Chin-Ho Kim, Benjamin Bylenok, Dennis Michael Heleine, Stephen Eric Sidle, Michal Lekszycki, Aaron Dayton Little, Jacky S. Wong
  • Patent number: D1027831
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: May 21, 2024
    Assignee: ChargePoint, Inc.
    Inventors: Justin D. Cumming, Peter H. Muller, David Hoenig, Pasquale Romano, Darren Chin-Ho Kim, Benjamin Bylenok, Dennis Michael Heleine, Stephen Eric Sidle, Michal Lekszycki, Aaron Dayton Little, Jacky S. Wong
  • Patent number: D1027832
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: May 21, 2024
    Assignee: ChargePoint, Inc.
    Inventors: Justin D. Cumming, Peter H. Muller, David Hoenig, Pasquale Romano, Darren Chin-Ho Kim, Benjamin Bylenok, Dennis Michael Heleine, Stephen Eric Sidle, Michal Lekszycki, Aaron Dayton Little, Jacky S. Wong
  • Patent number: D1027833
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: May 21, 2024
    Assignee: ChargePoint, Inc.
    Inventors: Justin D. Cumming, Peter H. Muller, David Hoenig, Pasquale Romano, Darren Chin-Ho Kim, Benjamin Bylenok, Dennis Michael Heleine, Stephen Eric Sidle, Michal Lekszycki, Aaron Dayton Little, Jacky S. Wong
  • Patent number: D1027834
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: May 21, 2024
    Assignee: ChargePoint, Inc.
    Inventors: Justin D. Cumming, Peter H. Muller, David Hoenig, Pasquale Romano, Darren Chin-Ho Kim, Benjamin Bylenok, Dennis Michael Heleine, Stephen Eric Sidle, Michal Lekszycki, Aaron Dayton Little, Jacky S. Wong
  • Patent number: D1027835
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: May 21, 2024
    Assignee: ChargePoint, Inc.
    Inventors: Justin D. Cumming, Peter H. Muller, David Hoenig, Pasquale Romano, Darren Chin-Ho Kim, Benjamin Bylenok, Dennis Michael Heleine, Stephen Eric Sidle, Michal Lekszycki, Aaron Dayton Little, Jacky S. Wong
  • Patent number: D1027836
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: May 21, 2024
    Assignee: ChargePoint, Inc.
    Inventors: Justin D. Cumming, Peter H. Muller, David Hoenig, Pasquale Romano, Darren Chin-Ho Kim, Benjamin Bylenok, Dennis Michael Heleine, Stephen Eric Sidle, Michal Lekszycki, Aaron Dayton Little, Jacky S. Wong
  • Patent number: D1027837
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: May 21, 2024
    Assignee: ChargePoint, Inc.
    Inventors: Justin D. Cumming, Peter H. Muller, David Hoenig, Pasquale Romano, Darren Chin-Ho Kim, Benjamin Bylenok, Dennis Michael Heleine, Stephen Eric Sidle, Michal Lekszycki, Aaron Dayton Little, Jacky S. Wong
  • Patent number: D1027838
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: May 21, 2024
    Assignee: ChargePoint, Inc.
    Inventors: Justin D. Cumming, Peter H. Muller, David Hoenig, Pasquale Romano, Darren Chin-Ho Kim, Benjamin Bylenok, Dennis Michael Heleine, Stephen Eric Sidle, Michal Lekszycki, Aaron Dayton Little, Jacky S. Wong
  • Patent number: D1027839
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: May 21, 2024
    Assignee: ChargePoint, Inc.
    Inventors: Justin D. Cumming, Peter H. Muller, David Hoenig, Pasquale Romano, Darren Chin-Ho Kim, Benjamin Bylenok, Dennis Michael Heleine, Stephen Eric Sidle, Michal Lekszycki, Aaron Dayton Little, Jacky S. Wong
  • Patent number: D1027840
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: May 21, 2024
    Assignee: ChargePoint, Inc.
    Inventors: Justin D. Cumming, Peter H. Muller, David Hoenig, Pasquale Romano, Darren Chin-Ho Kim, Benjamin Bylenok, Dennis Michael Heleine, Stephen Eric Sidle, Michal Lekszycki, Aaron Dayton Little, Jacky S. Wong
  • Patent number: D1027841
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: May 21, 2024
    Assignee: ChargePoint, Inc.
    Inventors: Justin D. Cumming, Peter H. Muller, David Hoenig, Pasquale Romano, Darren Chin-Ho Kim, Benjamin Bylenok, Dennis Michael Heleine, Stephen Eric Sidle, Michal Lekszycki, Aaron Dayton Little, Jacky S. Wong
  • Patent number: D1027842
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: May 21, 2024
    Assignee: ChargePoint, Inc.
    Inventors: Justin D. Cumming, Peter H. Muller, David Hoenig, Pasquale Romano, Darren Chin-Ho Kim, Benjamin Bylenok, Dennis Michael Heleine, Stephen Eric Sidle, Michal Lekszycki, Aaron Dayton Little, Jacky S. Wong
  • Patent number: D1027843
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: May 21, 2024
    Assignee: ChargePoint, Inc.
    Inventors: Justin D. Cumming, Peter H. Muller, David Hoenig, Pasquale Romano, Darren Chin-Ho Kim, Benjamin Bylenok, Dennis Michael Heleine, Stephen Eric Sidle, Michal Lekszycki, Aaron Dayton Little, Jacky S. Wong
  • Patent number: D1027844
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: May 21, 2024
    Assignee: ChargePoint, Inc.
    Inventors: Justin D. Cumming, Peter H. Muller, David Hoenig, Pasquale Romano, Darren Chin-Ho Kim, Benjamin Bylenok, Dennis Michael Heleine, Stephen Eric Sidle, Michal Lekszycki, Aaron Dayton Little, Jacky S. Wong