Patents by Inventor Benjiman WHITE

Benjiman WHITE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Forming layers of build material of a three-dimensional printing system
    Patent number: 11383445
    Abstract: According to one aspect, there is provided a method of forming a layer of build material on a build platform of a three-dimensional printing system. The method comprises obtaining characteristics of a build volume to be processed, determining characteristics of a volume of build material to be used to form the layer, forming an intermediate volume of build material having the determined characteristics, and spreading the intermediate volume of build material over the build platform to form the layer.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: July 12, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: William E. Hertling, Benjiman White, Mike Whitmarsh
  • 3D PRINTER AND BUILD MODULE
    Publication number: 20210206068
    Abstract: According to one example, there is provided a method of operating a three-dimensional printer. The method comprises determining a size of a build chamber in which to generate a three-dimensional object, configuring a configurable build module to provide a build chamber of the determined size, and generating the three-dimensional object in the configured build chamber.
    Type: Application
    Filed: April 20, 2017
    Publication date: July 8, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: William E. HERTLING, Benjiman WHITE, Mike WHITMARSH
  • FORMING LAYERS OF BUILD MATERIAL
    Publication number: 20210197480
    Abstract: According to one aspect, there is provided a method of forming a layer of build material on a build platform of a three-dimensional printing system. The method comprises obtaining characteristics of a build volume to be processed, determining characteristics of a volume of build material to be used to form the layer, forming an intermediate volume of build material having the determined characteristics, and spreading the intermediate volume of build material over the build platform to form the layer.
    Type: Application
    Filed: April 4, 2017
    Publication date: July 1, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: William E. HERTLING, Benjiman WHITE, Mike WHITMARSH
  • Computing devices with movable input/output connectors
    Patent number: 10540313
    Abstract: Example implementations relate to computing devices with movable input/output (I/O) connectors. For example, a computing device may include a chassis of the computing device and an I/O connector to connect an I/O device to the computing device. The I/O connector may be movable about an axis relative to the chassis by at least 180 degrees such that the I/O connector is accessible from multiple sides of the chassis.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: January 21, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Shih Chuan Huang, Yu Cheng Wu, Chih Sheng Liao, Hsin Wen Hsu, Benjiman White, William E. Hertling, Mike Whitmarsh
  • Signaling print substances
    Patent number: 10112715
    Abstract: An example unmanned aerial vehicle includes an electromagnetic radiation (EMR) sensor. The EMR sensor detects a signal indicative of a substance to print. The unmanned aerial vehicle also includes a nozzle to eject the substance based on a location at which the signal is detected.
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: October 30, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Mike Whitmarsh, Benjiman White, William E. Hertling
  • COMPUTING DEVICES WITH MOVABLE INPUT/OUTPUT CONNECTORS
    Publication number: 20180276168
    Abstract: Example implementations relate to computing devices with movable input/output (I/O) connectors. For example, a computing device may include a chassis of the computing device and an I/O connector to connect an I/O device to the computing device. The I/O connector may be movable about an axis relative to the chassis by at least 180 degrees such that the I/O connector is accessible from multiple sides of the chassis.
    Type: Application
    Filed: December 11, 2015
    Publication date: September 27, 2018
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Shih Chuan HUANG, Yu Cheng WU, Chih Sheng LIAO, Hsin Wen HSU, Benjiman WHITE, William E. HERTLING, Mike WHITMARSH
  • SIGNALING PRINT SUBSTANCES
    Publication number: 20170305550
    Abstract: An example unmanned aerial vehicle includes an electromagnetic radiation (EMR) sensor. The EMR sensor detects a signal indicative of a substance to print. The unmanned aerial vehicle also includes a nozzle to eject the substance based on a location at which the signal is detected.
    Type: Application
    Filed: April 26, 2016
    Publication date: October 26, 2017
    Inventors: Mike WHITMARSH, Benjiman WHITE, William E. HERTLING
  • SIGNALING PRINT LOCATIONS
    Publication number: 20170305549
    Abstract: An example unmanned aerial vehicle includes an electromagnetic radiation (EMR) sensor. The EMR sensor detects a signal indicative of a direction of emission of the signal. The unmanned aerial vehicle also includes a nozzle to eject the substance based on the direction of emission.
    Type: Application
    Filed: April 26, 2016
    Publication date: October 26, 2017
    Inventors: William E. Hertling, Benjiman WHITE, Mike WHITMARSH