Abstract: Embodiments include but are not limited to apparatuses and systems including a package having stud bumps for die alignment. A package may include a package substrate, and a plurality of stud bumps coupled to the package substrate. The stud bumps may define a die region of the package substrate in which movement of a die disposed within the die region is restricted prior to attachment of the die to the package substrate, wherein the plurality of stud bumps comprise a profile that is less than a profile of the die when attached to the package substrate. Other embodiments may be described.

Abstract: A multi-source optical module is described that includes an optical circuit positioned on a base. The optical circuit includes a first and a second optical input. A first and a second optical source are positioned on the base relative to the optical circuit. A first lens is positioned between an output of the first optical source and a first input of the optical circuit. A second lens is positioned between an output of the second optical source and a second input of the optical circuit. At least one of the first and the second lenses are positionable so that the output of a respective one of the first and second optical sources and a respective one of the first and the second optical inputs of the optical circuit are aligned.

Abstract: A multi-source optical module is described that includes an optical circuit positioned on a base. The optical circuit includes a first and a second optical input. A first and a second optical source are positioned on the base relative to the optical circuit. A first lens is positioned between an output of the first optical source and a first input of the optical circuit. A second lens is positioned between an output of the second optical source and a second input of the optical circuit. At least one of the first and the second lenses are positionable so that the output of a respective one of the first and second optical sources and a respective one of the first and the second optical inputs of the optical circuit are aligned.

Abstract: A plurality of n light sources are coupled to an optoelectronic module by first coupling a light detector to an optical output port of the optoelectronic module after the module is attached to a carrier member. The plurality of n light sources are sequentially moved adjacent a separate one of a plurality of n optical input ports of the optoelectronic module while pulsing the light source being moved with a low power signal sufficient to prevent failure of the light source. Each light source is permanently affixed adjacent the associated separate one of the n optical input ports when a maximum light intensity signal propagating through the optoelectronic module from that light source is detected by the light detector. A heat dissipating means is attached to a base of the carrier member capable of removing sufficient heat from the n radiation sources and the module to prevent overheating during normal operation thereof.

Abstract: An opto-electronic package includes an enclosed package, a plurality of the electrical contacts extending into the enclosed package, an optical integrated circuit mounted within the package and coupled to the electrical contacts, and optical fibers extending through opposite ends of the package to the optical integrated circuit along a common plane. The package is comprised of a package body and an opposite package lid joined together by solder sealing at an interface substantially at the common plane, and configured to form end pipes around the optical fibers and solder sealed therewith at the opposite ends of the package, to form a hermetically sealed package. This enables the optical fibers to be laid into feedthroughs formed by opposing portions of the package body and the package lid before they are joined together.

Abstract: A plurality of n light sources are coupled to an optoelectronic module by first coupling a light detector to an optical output port of the optoelectronic module after the module is attached to a carrier member. The plurality of n light sources are sequentially moved adjacent a separate one of a plurality of n optical input ports of the optoelectronic module while pulsing the light source being moved with a low power signal sufficient to prevent failure of the light source. Each light source is permanently affixed adjacent the associated separate one of the n optical input ports when a maximum light intensity signal propagating through the optoelectronic module from that light source is detected by the light detector. A heat dissipating means is attached to a base of the carrier member capable of removing sufficient heat from the n radiation sources and the module to prevent overheating during normal operation thereof.

Abstract: An opto-electronic package includes an enclosed package, a plurality of the electrical contacts extending into the enclosed package, an optical integrated circuit mounted within the package and coupled to the electrical contacts, and optical fibers extending through opposite ends of the package to the optical integrated circuit along a common plane. The package is comprised of a package body and an opposite package lid joined together at an interface substantially at the common plane, and configured to form end pipes around the optical fibers at the opposite ends of the package. This enables the optical fibers to be laid into feedthroughs formed by opposing portions of the package body and the package lid before they are joined together, eliminating the need to feed the fibers through opposite apertures in the package body and for a separate subassembly to mount the opposite fibers and the integrated circuit.

Abstract: A plug-in form of connector having two connecting members, one inserted into the other, has pairs of opposed contacts. Each pair of contacts is connected electrically by a pivoted contact lever, which pivots about an axis normal to its length as one connecting member is inserted into the other. This increases contact normal forces from a minimum at initial insertion. A reduction in insertion force is obtained without a reduction in contact normal forces on full insertion.

Abstract: A multiple contact connector having a low profile has a bottom member for attachment to a large circuit board, the bottom member having a plurality of spaced parallel spring cantilever contact members. A top member is attached to an edge of another circuit board, for example a smaller board, the top member having a plurality of spaced parallel contact members having top and bottom legs, the top legs of the contact members making contact with the smaller board circuit pattern and the bottom legs contacting the cantilever contact members of the bottom member. A spring member extends up from the bottom member and snaps over the top member.

Abstract: A multiple contact connector having a low profile has a bottom member for attachment to a large circuit board, the bottom member having a plurality of spaced parallel spring cantilever contact members. A top member is attached to an edge of another circuit board, for example a smaller board, the top member having a plurality of spaced parallel contact members of U shape, the top legs of the contact member making contact with the smaller board circuit pattern and the bottom legs contacting the cantilever contact members of the bottom member. A spring member extends up from the bottom member and snaps over the top member.

Abstract: In the testing of dry circuit contacts, a constant current source is applied to the contacts. The open circuit voltage of the source is set to a predetermined maximum value and then the short circuit current at the contacts measured. If the current value is below a predetermined maximum value, the voltage of the source is increased to bring the short-circuit current to the predetermined value. The voltage drop across the contacts is then measured and the contact resistance calculated. This arrangement makes adjustments to take into account variations in the test circuit, such as different lead lengths and other variables, without subjecting the contacts at any time to an open circuit voltage or short circuit current above maximum values.

Abstract: An enclosure for outdoor cross-connection in telecommunications systems has a rectangular housing on a base. One or more columns are mounted in the housing, each column having a channel shaped back portion and a mounting member hinged at one side to one side of the back portion. Connectors are attached to the mounting member, conveniently by retainers fitting in slots in side walls of the mounting member, latch members holding the retainers in position. Connectors clip into the retainers and can be sealed by sealing compound in the retainers. Cable conductors pass up through the channel shaped back portion, conductors passing through into the mounting members and connected to the rear sides of connectors. Cross-connections are made to the front sides of the connectors.