Patents by Inventor Benoit Besancon
Benoit Besancon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Method for manufacturing a cover for an electronic package and electronic package comprising a cover
Patent number: 11688815Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.Type: GrantFiled: October 27, 2020Date of Patent: June 27, 2023Assignee: STMicroelectronics (Grenoble 2) SASInventors: Karine Saxod, Alexandre Mas, Eric Saugier, Gaetan Lobascio, Benoit Besancon -
Patent number: 11114312Abstract: A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A coating material is injected in the mold cavity around the insert. The coating material is then set to form a substrate that is overmolded around the insert and produce the cover.Type: GrantFiled: April 25, 2019Date of Patent: September 7, 2021Assignee: STMicroelectronics (Grenoble 2) SASInventors: Benoit Besancon, Alexandre Mas, Karine Saxod
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METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE COMPRISING A COVER
Publication number: 20210043780Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.Type: ApplicationFiled: October 27, 2020Publication date: February 11, 2021Applicant: STMicroelectronics (Grenoble 2) SASInventors: Karine SAXOD, Alexandre MAS, Eric SAUGIER, Gaetan LOBASCIO, Benoit BESANCON -
Method for manufacturing a cover for an electronic package and electronic package comprising a cover
Patent number: 10833208Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.Type: GrantFiled: September 25, 2019Date of Patent: November 10, 2020Assignee: STMicroelectronics (Grenoble 2) SASInventors: Karine Saxod, Alexandre Mas, Eric Saugier, Gaetan Lobascio, Benoit Besancon -
METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE COMPRISING A COVER
Publication number: 20200020815Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.Type: ApplicationFiled: September 25, 2019Publication date: January 16, 2020Applicant: STMicroelectronics (Grenoble 2) SASInventors: Karine SAXOD, Alexandre MAS, Eric SAUGIER, Gaetan LOBASCIO, Benoit BESANCON -
Patent number: 10483408Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.Type: GrantFiled: August 29, 2017Date of Patent: November 19, 2019Assignee: STMicroelectronics (Grenoble 2) SASInventors: Karine Saxod, Alexandre Mas, Eric Saugier, Gaetan Lobascio, Benoit Besancon
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Publication number: 20190252212Abstract: A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A coating material is injected in the mold cavity around the insert. The coating material is then set to form a substrate that is overmolded around the insert and produce the cover.Type: ApplicationFiled: April 25, 2019Publication date: August 15, 2019Applicant: STMicroelectronics (Grenoble 2) SASInventors: Benoit BESANCON, Alexandre MAS, Karine SAXOD
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Patent number: 10325784Abstract: A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A coating material is injected in the mold cavity around the insert. The coating material is then set to form a substrate that is overmolded around the insert and produce the cover.Type: GrantFiled: August 24, 2017Date of Patent: June 18, 2019Assignee: STMicroelectronics (Grenoble 2) SASInventors: Benoit Besancon, Alexandre Mas, Karine Saxod
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Patent number: 10186466Abstract: An electronic device includes a carrier substrate with at least one integrated-circuit chip mounted on a front face of the carrier substrate. An encapsulation block on the front face and embedding the integrated-circuit chip has a periphery with corners. The encapsulating block further has, in at least one local zone located in at least one corner and from the front face of the carrier substrate, a smaller thickness than a thickness of the encapsulation block at least in a surrounding zone. The electronic device is manufactured by a process in which the zone of smaller thickness is obtained by molding or by machining.Type: GrantFiled: October 10, 2017Date of Patent: January 22, 2019Assignee: STMicroelectronics (Grenoble 2) SASInventors: Benoit Besancon, Luc Petit
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METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE COMPRISING A COVER
Publication number: 20180190511Abstract: A method for manufacturing a cover for an electronic package includes placing an electrically conductive insert (including an electrical contact surface) inside a cavity of a mold in a position such that the electrical contact surface is in contact with a face of the cavity of the mold. A coating material is injected into said cavity and set so as to produce a substrate that is overmolded around the insert and forms the cover where the electrical contact surface of the overmolded substrate is not covered by the coating material. An electronic package is then formed from a chip mounted on a carrier substrate that is covered by the cover. The electrical contact surface is located above and electrically connected to an electrical connection pad of either the chip or the carrier substrate.Type: ApplicationFiled: August 24, 2017Publication date: July 5, 2018Applicant: STMicroelectronics (Grenoble 2) SASInventors: Alexandre Mas, Benoit Besancon, Karine Saxod -
Publication number: 20180190512Abstract: A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A coating material is injected in the mold cavity around the insert. The coating material is then set to form a substrate that is overmolded around the insert and produce the cover.Type: ApplicationFiled: August 24, 2017Publication date: July 5, 2018Applicant: STMicroelectronics (Grenoble 2) SASInventors: Benoit Besancon, Alexandre Mas, Karine Saxod
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Publication number: 20180190838Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.Type: ApplicationFiled: August 29, 2017Publication date: July 5, 2018Applicant: STMicroelectronics (Grenoble 2) SASInventors: Karine Saxod, Alexandre Mas, Eric Saugier, Gaetan Lobascio, Benoit Besancon
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Publication number: 20180033710Abstract: An electronic device includes a carrier substrate with at least one integrated-circuit chip mounted on a front face of the carrier substrate. An encapsulation block on the front face and embedding the integrated-circuit chip has a periphery with corners. The encapsulating block further has, in at least one local zone located in at least one corner and from the front face of the carrier substrate, a smaller thickness than a thickness of the encapsulation block at least in a surrounding zone. The electronic device is manufactured by a process in which the zone of smaller thickness is obtained by molding or by machining.Type: ApplicationFiled: October 10, 2017Publication date: February 1, 2018Applicant: STMicroelectronics (Grenoble 2) SASInventors: Benoit Besancon, Luc Petit
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Patent number: 9870947Abstract: Electronic devices are manufactured using a collective (wafer-scale) fabrication process. Electronic chips are mounted onto one face of a collective substrate wafer. A collective flexible sheet made of a heat-conductive material comprising a layer containing pyrolytic graphite is fixed to extend over a collective region extending over the electronic chips and over the collective substrate wafer between the electronic chips. The collective flexible sheet is then compressed. A dicing operation is then carried out in order to obtain electronic devices each including an electronic chip, a portion of the collective plate and a portion of the collective flexible sheet.Type: GrantFiled: June 26, 2017Date of Patent: January 16, 2018Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics SA, Commissariat A L'Energie Atomique et aux Energies AlternativesInventors: Didier Campos, Benoit Besancon, Perceval Coudrain, Jean-Philippe Colonna
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Publication number: 20180005889Abstract: Electronic devices are manufactured using a collective (wafer-scale) fabrication process. Electronic chips are mounted onto one face of a collective substrate wafer. A collective flexible sheet made of a heat-conductive material comprising a layer containing pyrolytic graphite is fixed to extend over a collective region extending over the electronic chips and over the collective substrate wafer between the electronic chips. The collective flexible sheet is then compressed. A dicing operation is then carried out in order to obtain electronic devices each including an electronic chip, a portion of the collective plate and a portion of the collective flexible sheet.Type: ApplicationFiled: June 26, 2017Publication date: January 4, 2018Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics SA, Commissariat A L'Energie Atomique et aux Energies AlternativesInventors: Didier Campos, Benoit Besancon, Perceval Coudrain, Jean-Philippe Colonna
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Publication number: 20170345805Abstract: Disclosed herein is an electronic device including a substrate having a conductive area formed thereon. A first molding level is stacked on the substrate. A die is formed on the substrate and within the first molding level. A second molding level is stacked on the first molding level. At least one passive component is within the second molding level. A conductive structure extends between the second molding level and the substrate and electrically couples the at least one passive component to the conductive area.Type: ApplicationFiled: May 27, 2016Publication date: November 30, 2017Applicant: STMicroelectronics (Grenoble 2) SASInventors: Norbert Chevrier, Benoit Besancon, Jean-Michel Riviere
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Patent number: 9818664Abstract: An electronic device includes a carrier substrate with at least one electronic-circuit chip mounted on a front face of the carrier substrate. An encapsulation block on the front face and embedding the electronic-circuit chip has a periphery with corners. The encapsulating block further has, in at least one local zone located in at least one corner and from the front face of the carrier substrate, a smaller thickness than a thickness of the encapsulation block at least in a surrounding zone. The electronic device is manufactured by a process in which the zone of smaller thickness is obtained by molding or by machining.Type: GrantFiled: August 18, 2016Date of Patent: November 14, 2017Assignee: STMicroelectronics (Grenoble 2) SASInventors: Benoit Besancon, Luc Petit
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Publication number: 20170317059Abstract: An electronic device includes a first support platelet and a second support platelet that is disposed opposite and at a distance from the first support platelet. At least one first electronic chip is mounted on the first support platelet on a side facing the second support platelet. A second electronic chip is mounted on the second support platelet on a side facing the first support platelet. A heat sink that includes at least one interposition plate is interposed between the first and second electronic chips.Type: ApplicationFiled: November 30, 2016Publication date: November 2, 2017Applicant: STMicroelectronics (Grenoble 2) SASInventors: Benoit Besancon, Norbert Chevrier, Jean-Michel Riviere
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Publication number: 20170250119Abstract: An electronic device includes a carrier substrate with at least one electronic-circuit chip mounted on a front face of the carrier substrate. An encapsulation block on the front face and embedding the electronic-circuit chip has a periphery with corners. The encapsulating block further has, in at least one local zone located in at least one corner and from the front face of the carrier substrate, a smaller thickness than a thickness of the encapsulation block at least in a surrounding zone. The electronic device is manufactured by a process in which the zone of smaller thickness is obtained by molding or by machining.Type: ApplicationFiled: August 18, 2016Publication date: August 31, 2017Applicant: STMicroelectronics (Grenoble 2) SASInventors: Benoit Besancon, Luc Petit
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Publication number: 20170127567Abstract: An electronic device includes a support plate with an integrated circuit chip fixed onto the support plate. A heat sink is mounted to the support plate. An electrical connection wire is provided with one end electrically connected to the heat sink and another end electrically connected to an electrical contact provided on the support plate.Type: ApplicationFiled: April 18, 2016Publication date: May 4, 2017Applicant: STMicroelectronics (Grenoble 2) SASInventors: Benoit Besancon, Agnes Baffert, Karine Saxod