Patents by Inventor Benoit Thevenot

Benoit Thevenot has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984684
    Abstract: A three-phase electrical connection system includes a socket, a plug, and a two-part magnetic indexing device with two parts, one being fastened to the socket and the other being integral with the plug. Both parts have an annular yoke and a magnet set comprising three permanent magnets. The yoke comprises ferromagnetic material, an axis of revolution, and at least one revolution support face formed in a plane transverse to the axis of revolution. The face is divided into three distinct annular portions, each of which extends one-hundred and twenty degrees of arc. The three magnets are attached to a distinct annular portion of the yoke and are spaced from one another by a first non-zero angular interval. The magnets all have the same magnetic orientation parallel to the axis of revolution. The magnets of the two part are attracted to each other.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: May 14, 2024
    Assignee: OCCHIUTI & ROHLICEK LLP
    Inventor: Benoît Thevenot
  • Publication number: 20220239037
    Abstract: A three-phase electrical connection system includes a socket, a plug, and a two-part magnetic indexing device with two parts, one being fastened to the socket and the other being integral with the plug. Both parts have an annular yoke and a magnet set comprising three permanent magnets. The yoke comprises ferromagnetic material, an axis of revolution, and at least one revolution support face formed in a plane transverse to the axis of revolution. The face is divided into three distinct annular portions, each of which extends one-hundred and twenty degrees of arc. The three magnets are attached to a distinct annular portion of the yoke and are spaced from one another by a first non-zero angular interval. The magnets all have the same magnetic orientation parallel to the axis of revolution. The magnets of the two part are attracted to each other.
    Type: Application
    Filed: May 7, 2020
    Publication date: July 28, 2022
    Inventor: Benoît Thevenot
  • Patent number: 7387259
    Abstract: A card like object comprises a card body comprising a first face. The first face is at least partially graphically personalized. An antenna is embedded in the card body. The card body is provided with a cavity. The cavity comprises a contact chip. The cavity further comprises a contactless chip, the contactless chip being electrically connected to the antenna with connecting means.
    Type: Grant
    Filed: September 17, 2003
    Date of Patent: June 17, 2008
    Assignee: Axalto S.A.
    Inventor: Benoît Thevenot
  • Publication number: 20060104041
    Abstract: A card like object comprises a card body comprising a first face. The first face is at least partially graphically personalized. An antenna is embedded in the card body. The card body is provided with a cavity. The cavity comprises a contact chip. The cavity further comprises a contactless chip, the contactless chip being electrically connected to the antenna with connecting means.
    Type: Application
    Filed: September 17, 2003
    Publication date: May 18, 2006
    Applicant: AXALTO SA
    Inventor: Benoit Thevenot
  • Publication number: 20060094155
    Abstract: A method of manufacturing a wafer assembly involves a chip wafer onto which a cover wafer is deposited, the chip wafer includes an active face and an inactive face, the active face includes chip elements, the cover wafer being provided with a chip-element-receiving cavity located above a chip element, the method involves the following steps: a cover-wafer-depositing step, in which a cover wafer is deposited on the active face so as to obtain a wafer assembly, the cover wafer being provided with plurality of chip-receiving cavities, a chip-receiving cavity being located above a chip element, the cover wafer being made of an organic material, and a wafer assembly thinning step, in which the inactive face of the chip wafer is thinned.
    Type: Application
    Filed: September 17, 2003
    Publication date: May 4, 2006
    Inventors: Joseph Leibenguth, Beatrice Bonvalot, Benoit Thevenot, Laurent Lemoullec, Frederie Depoutot, Yves Reignoux
  • Patent number: 6779730
    Abstract: An antenna for an integrated circuit card includes a conductive track (2) forming at least one turn and having ends (3) comprising conductive layers forming connection terminals (4), the connection terminals (4) being perforated. An integrated circuit card is provided that includes such an antenna.
    Type: Grant
    Filed: January 3, 2001
    Date of Patent: August 24, 2004
    Assignee: Schlumberger Systemes
    Inventors: Christophe Fletout, Jean-Luc Letournel, Marie-Cécile Brel, Nathalie Dupuis, Norbert Borg, Benoit Thevenot, Mickaël Mande
  • Patent number: 6422472
    Abstract: A contactless memory card that includes a card body (1), an integrated circuit (3) embedded in the card body, and a coupling antenna (4) connected to two contact pads (6) of the integrated circuit. The antenna is made in a spiral pattern, with its turns passing over the flush face (5) of the integrated circuit.
    Type: Grant
    Filed: May 5, 1999
    Date of Patent: July 23, 2002
    Assignee: Schlumberger Systems
    Inventors: Benoît Thevenot, Pascal Billebaud
  • Publication number: 20010011962
    Abstract: An antenna for an integrated circuit card includes a conductive track (2) forming at least one turn and having ends (3) comprising conductive layers forming connection terminals (4), the connection terminals (4) being perforated. An integrated circuit card is provided that includes such an antenna.
    Type: Application
    Filed: January 3, 2001
    Publication date: August 9, 2001
    Inventors: Christophe Fletout, Jean-Luc Letournel, Marie-Cecile Brel, Nathalie Dupuis, Norbert Borg, Benoit Thevenot, Mickael Mande
  • Patent number: 6084303
    Abstract: The printed circuit has connection pads emerging in a face of the integrated circuit, which face is covered in an insulating layer (5) having openings in register with the connection pads, and at least one conductor track (7) extending over the first insulating layer and having one end connected to one of the connection pads of the integrated circuit. A second insulating layer (8) covers the first insulating layer and has openings (9) in register with each conductor track (7) of the first layer and in register with each connection pad that is not connected to a conductor track (7), and it carries at least one repositioning conductor track (10) extending over the second insulating layer (8) having one end connected to a conductor track (7) of the first insulating layer.
    Type: Grant
    Filed: November 6, 1998
    Date of Patent: July 4, 2000
    Assignee: Schlumberger Systems
    Inventors: Jean-Noel Audoux, Benoit Thevenot
  • Patent number: 5847931
    Abstract: An integrated circuit card comprising a card body, an integrated circuit fixed in a cavity of the card body, an antenna extending over a face of the card body and connected to the integrated circuit, and a layer of resin covering the integrated circuit and at least a portion of the card body immediately adjacent to the integrated circuit.
    Type: Grant
    Filed: April 16, 1997
    Date of Patent: December 8, 1998
    Assignee: Solaic
    Inventors: Michel Gaumet, Benoit Thevenot
  • Patent number: 5753901
    Abstract: The chip of an invention for an electronic circuit card comprises a semiconductor microplate having an active face provided with contact pads and on which projections are formed of different heights. The active face of the microplate is coated, at least in part, in a layer of insulating material having a thickness that is greater than or equal to the height of the highest projection, said layer being shaped so as to give free access to the contact pads and having an outer face parallel to the periphery of the active face of the microplate. The layer enables the chip to be implanted in a card body while remaining accurately parallel thereto, which is essential to enable conductive tracks to be made subsequently by silk-screen printing.
    Type: Grant
    Filed: May 24, 1996
    Date of Patent: May 19, 1998
    Assignee: Solaic
    Inventors: Thierry Bitschnau, Benoit Thevenot