Abstract: A method for calibrating an inertial angular sensor, includes the steps of: A for at least two electrical angles (?j) of the vibration wave: A1 applying, via each of the three trim controls CTi, a sinusoidal stiffness disturbance PSi having a disturbance frequency fi, and for each applied disturbance: A11 determining and storing an estimated excitation force Fei to be applied to the resonator in the presence of said disturbance PSi, on the basis of excitation controls determined by the servo controls, B determining, on the basis of the three estimated excitation forces Fei i=1, 2, 3 stored in step A11, three 2×2 matrices M?i, a matrix M?i being representative of the response of the gyrometer to the disturbance PSi, C determining and storing an estimated inverse excitation matrix (formula (A)) and an estimated inverse detection matrix (formula (B)) on the basis of the three matrices M?i determined in step B, an excitation matrix E and a detection matrix D being respectively representative of the effects of the

Abstract: The method for calibrating a micromachined inertial angle sensor (2) comprising a support, at least one vibrating mass movable relative to the support, at least one transducer for exciting vibrating movement of the vibrating mass, at least one transducer for detecting a vibration of the vibrating mass, and at least one electrostatic transducer being capable of applying an adjustable electrostatic stiffness to the vibrating mass, the calibration method comprising the steps of the angle sensor receiving a predetermined vibrational excitation emitted by an excitation device (18) separate from the excitation transducer; the detection transducer measuring the vibration of the vibrating mass to obtain a measurement signal (Sm) from said measurement by the detection transducer; and transforming; determining, adjusting, and applying the electrostatic stiffness.

Abstract: A microelectromechanical system comprising an assembly of layers stacked in a stacking direction comprises an active layer made of single-crystal silicon comprising an active structure, and first and second covers defining a cavity around the active structure, the active layer interposed between the first and second covers, the second cover comprising a single layer made of single-crystal silicon. The assembly comprises a decoupling layer made of single-crystal silicon and comprising: an attaching element fastened to a carrier, a frame encircling the attaching element in the plane of the decoupling layer, and a mechanical decoupling structure connecting the frame and the attaching structure, the mechanical decoupling structure allowing the attaching element to be flexibly joined to the frame. The frame is secured to the silicon layer of the second cover and at most one film of silicon dioxide is interposed between the frame and silicon layer of the second cover.

Abstract: A microelectromechanical system comprising an assembly of layers stacked in a stacking direction comprises an active layer made of single-crystal silicon comprising an active structure, and first and second covers defining a cavity around the active structure, the active layer interposed between the first and second covers, the second cover comprising a single layer made of single-crystal silicon. The assembly comprises a decoupling layer made of single-crystal silicon and comprising: an attaching element fastened to a carrier, a frame encircling the attaching element in the plane of the decoupling layer, and a mechanical decoupling structure connecting the frame and the attaching structure, the mechanical decoupling structure allowing the attaching element to be flexibly joined to the frame. The frame is secured to the silicon layer of the second cover and at most one film of silicon dioxide is interposed between the frame and silicon layer of the second cover.

Abstract: A vibrating inertial sensor is provided, micro machined in a plane thin wafer, allowing the measurement of an angular position or of an angular speed. The sensor comprises two vibrating masses suspended by springs with identical stiffness in X and Y and coupled together by identical stiffness springs in X and Y, and at least excitation transducers and detection transducers disposed on at least one of the masses. The mobile assembly consisting of a vibrating mass and the parts of transducers fastened to this mass has a generally symmetric structure with respect to an axis of symmetry OX and with respect to an axis of symmetry OY.

Abstract: The micro-electro-mechanical system is provided with at least two separate anchoring elements (F1, F2) designed to be bound to a support. A anchoring element (F1, F2) is solidly linked to at least one beam (P1, P2) that can be deformed in bending, and two beams (P1, P2) respectively linked to two distinct anchoring elements (F1, F2) have different directions. A beam has a length L, a thickness e, and a height h, such that the stiffnesses KL in the directions of the length and of the height Kh are large and the stiffness in the direction of the thickness Ke is small.

Abstract: A vibrating inertial sensor is provided, micro machined in a plane thin wafer, allowing the measurement of an angular position or of an angular speed. The sensor comprises two vibrating masses suspended by springs with identical stiffness in X and Y and coupled together by identical stiffness springs in X and Y, and at least excitation transducers and detection transducers disposed on at least one of the masses. The mobile assembly consisting of a vibrating mass and the parts of transducers fastened to this mass has a generally symmetric structure with respect to an axis of symmetry OX and with respect to an axis of symmetry OY.

Abstract: Vibrating structure gyrometer with at least one tuning fork, produced by micro-machining from a thin plate, the said tuning fork comprising a pair of mobile inertial assemblies (EIM1, EIM2) linked by a coupling assembly (1).

Abstract: Vibrating structure gyrometer with at least one tuning fork, produced by micro-machining from a thin plate, the said tuning fork comprising a pair of mobile inertial assemblies (EIM1, EIM2) linked by a coupling assembly (1). A tuning fork comprises two controlled electrodes (9, 9?) for equilibration of the sense resonator and electrostatic adjustment of the frequency of the sense resonator along the sense axis y which are respectively associated with the two mobile inertial assemblies (EIM1, EIM2) of the said tuning fork, and control means (UCE) adapted for applying two respective continuous electrical voltages V1 and V2 to the said two electrodes (9, 9?) simultaneously satisfying the relations: V 1 2 + V 1 2 = 2 ? ( f y ? ? _ ? ? initial - f y ? ? _ ? ? final ) ? f and V 1 2 - V 2 2 = c y ? ? _ ? ? initial a ? ? ? f .

Abstract: Vibrating structure gyrometer with at least one tuning fork, produced by micro-machining from a thin plate, the said tuning fork comprising a pair of mobile inertial assemblies (EIM1, EIM2) linked by a coupling assembly (1).

Abstract: The micro-electro-mechanical system is provided with at least two separate anchoring elements (F1, F2) designed to be bound to a support. A anchoring element (F1, F2) is solidly linked to at least one beam (P1, P2) that can be deformed in bending, and two beams (P1, P2) respectively linked to two distinct anchoring elements (F1, F2) have different directions. A beam has a length L, a thickness e, and a height h, such that the stiffnesses KL in the directions of the length and of the height Kh are large and the stiffness in the direction of the thickness Ke is small.

Abstract: Vibrating structure gyrometer with at least one tuning fork, produced by micro-machining from a thin plate, the said tuning fork comprising a pair of mobile inertial assemblies (EIM1, EIM2) linked by a coupling assembly (1).

Abstract: Described is a gyroscope with a vibrating structure, produced by micromachining in a thin wafer, which comprises a movable inertial assembly comprising at least one movable mass able to vibrate in the plane of the wafer along a drive axis x and along a sense axis y roughly perpendicular to the x-axis, an interdigital sensor comb and an interdigital drive comb. It furthermore comprises at least one additional interdigital comb, called the quadrature-error compensation comb, connected to the mass and which has two asymmetric air gaps e and ?e, ? being a positive real number, for subjecting the mass to an adjustable electrostatic stiffness due to coupling between the x-axis and the y-axis by applying a variable DC voltage V to this comb, the adjustable stiffness allowing compensation for the quadrature error of the gyroscope.

Abstract: The invention relates to a microgyroscope, that is to say an inertial micromechanical sensor dedicated to the measurement of angular velocities, which is produced by micromachining techniques, and has a novel arrangement of the modules for measuring the movement of the vibrating masses. The gyroscope comprises two symmetrical moving assemblies (30, 50; 30?, 50?) that are coupled by a coupling structure (20, 20?, 22). Each of the two assemblies comprises a moving mass (30) surrounded by a moving intermediate frame (50). The frame (50) is connected to the coupling structure (20, 20?, 22) and can vibrate in two degrees of freedom in orthogonal directions Ox and Oy of the plane of the wafer. The mass (30) is connected, on one side, to the frame and, on the other side, to fixed anchoring regions (34, 36) via linking means (40-46; 52-58) that allow the vibration movement in the Oy direction to be transmitted to the mass without permitting any movement of the mass in the Ox direction.

Abstract: The invention relates to a gyroscope with a vibrating structure, produced by micromachining in a thin wafer, which comprises a movable inertial assembly (1) comprising at least one movable mass (50) able to vibrate in the plane of the wafer along a drive axis x and along a sense axis y roughly perpendicular to the x-axis, an interdigital sensor comb (90) and an interdigital drive comb (70). It furthermore comprises at least one additional interdigital comb (10a), called the quadrature-error compensation comb, connected to the mass (50) and which has two asymmetric air gaps e and ?e, ? being a positive real number, for subjecting the mass to an adjustable electrostatic stiffness due to coupling between the x-axis and the y-axis by applying a variable DC voltage V to this comb, the adjustable stiffness allowing compensation for the quadrature error of the gyroscope.

Abstract: The invention relates to a microgyroscope, that is to say an inertial micromechanical sensor dedicated to the measurement of angular velocities, which is produced by micromachining techniques, and has a novel arrangement of the modules for measuring the movement of the vibrating masses. The gyroscope comprises two symmetrical moving assemblies (30, 50; 30?, 50?) that are coupled by a coupling structure (20, 20?, 22). Each of the two assemblies comprises a moving mass (30) surrounded by a moving intermediate frame (50). The frame (50) is connected to the coupling structure (20, 20?, 22) and can vibrate in two degrees of freedom in orthogonal directions Ox and Oy of the plane of the wafer. The mass (30) is connected, on one side, to the frame and, on the other side, to fixed anchoring regions (34, 36) via linking means (40-46; 52-58) that allow the vibration movement in the Oy direction to be transmitted to the mass without permitting any movement of the mass in the Ox direction.

Abstract: The invention relates to a gyrometer based on a vibrating structure, produced by micromachining in a thin planar wafer. It comprises four moving assemblies placed at the vertices of a virtual rectangle, each moving assembly being coupled to two moving assemblies located at neighboring vertices via a coupling structure and comprising an inertial first moving element connected to the coupling structure and intended to vibrate in two orthogonal directions in the plane of the wafer, namely an excitation direction and a detection direction, and a second moving element intended to vibrate in the detection direction and connected, on one side, to the first moving element and, on the other side, to anchoring zones via linking means.

Abstract: The invention relates to a gyroscope comprising at least one mass capable of vibrating along an x axis at a resonant excitation frequency Fx capable of vibrating along a y axis perpendicular to the x axis, at a resonant detection frequency Fy, under the effect of a Coriolis force generated by a rotation about a z axis perpendicular to the x and y axes. It includes, connected to the mass or masses, a feedback control loop for controlling the resonant frequency Fy so that Fy is equal or practically equal to Fx throughout the duration of use of the gyroscope.

Abstract: The invention relates to a gyroscope comprising at least one mass capable of vibrating along an x axis at a resonant excitation frequency Fx capable of vibrating along a y axis perpendicular to the x axis, at a resonant detection frequency Fy, under the effect of a Coriolis force generated by a rotation about a z axis perpendicular to the x and y axes. It includes, connected to the mass or masses, a feedback control loop for controlling the resonant frequency Fy so that Fy is equal or practically equal to Fx throughout the duration of use of the gyroscope.

Abstract: The invention relates to a gyrometer based on a vibrating structure, produced by micromachining in a thin planar wafer, including two symmetrical moving assemblies coupled by a coupling structure connecting these two assemblies in order to allow transfer of mechanical vibration energy between them, each moving assembly comprising three moving elements, a first inertial moving element intended to vibrate in two orthogonal directions Ox and Oy in the plane of the wafer, a second moving element intended to vibrate along Oy and connected to the first moving element and to fixed anchoring zones, by first linking means which allow the vibration movement of the first moving element along Oy to be transmitted to the second moving element without permitting movement of the second element along the Ox direction and a third moving element intended to vibrate along Oy and connected to the second moving element and to fixed anchoring zones by second linking means which allow the vibration movement of the second moving ele