Abstract: A device for semi-automatic dismantling of a modular component which is soldered and attached to a substrate forming a printed circuit. The component to be dismantled is placed under a hot gas source while a force member applies a resilient thrust, the force member comprising a needle arranged to be placed at the base of the component. The needle is slightly bent to apply a biasing force before controlling the ejection of the hot gas to cause melting of the solder at the ends of the connecting pieces and melting of the adhesive layer by which the component is attached to the substrate.

Abstract: The surface of a substrate, particularly a multi-layer substrate, is wired y an apparatus including a tool carrier and a substrate carrier. The substrate carrier is positioned in a substantially horizontal plane so it is situated opposite the tool carrier. The substrate carrier is displaced relative to the tool carrier in the horizontal plane, i.e., relative to the vertical plane. A heating element and an electric wire dispenser are carried by the tool carrier. The dispenser includes a wire outlet orifice situated close to an end of the heating element. The heating element is longitudinally translated within a sleeve having an axis directed toward the substrate carrier. A rotary support carrying the dispenser is rotatable around the sleeve axis to enable the wire outlet orifice to be positioned with respect to the end of the heating element as a function of the relative displacement between the substrate carrier and tool carrier.