Abstract: The disclosure is a high-power solid laser in which an emissive array of semiconductor lasers in a first stage pumps a solid YAG-type laser in a second stage. The structure of the emissive array, which is an integrated circuit, includes rods of semiconductor lasers alternating with grooves, the rods and grooves being parallel. The invention involves incrusting the material of the solid laser bars into the grooves between the rods of semiconductor lasers. This material is either placed in hybrid form or deposited to make an integrated structure.

Abstract: The disclosure relates to integrated circuits of lasers, wherein the linear arrays are supplied in series, with a return of current through the substrate. When the substrate is semi-insulating, only the first epitaxially grown layer is conductive. To reduce its electrical resistance, a surface film of the substrate is made conductive by diffusion of a dopant. Application to power semiconductor lasers.

Abstract: The invention applies to a laser integrated circuit comprising at least one row of lasers (30) lying between two reflector strips (28). The lasers (18) are electrically connected in parallel. The light emission along the strip will be more uniform if the electrical current is distributed by two "combs" whose "teeth" are parallel to the laser ribbons (18) and interleaved with them. The terminal metallized area (44) for the first comb is deposited at the bottom of a recess (18) and the terminal metallized areas (45) for the second comb are on the surface of the row. Such a device finds particular application to the power supply for laser integrated circuits.

Abstract: The disclosure concerns an integrated circuit which forms an electronic power device. This integrated circuit has, supported by a substrate, at least one array of lasers and at least one flat bar of reflectors. The reflectors send back the laser beams, emitted parallel to the substrate, perpendicularly to the substrate. The cleaved faces of the lasers are obtained by the sub-etching of the arrays, then through breaking by ultrasound.