Abstract: In some implementations, an apparatus includes a substrate having a top surface and a bottom surface, a first array of connectors on the bottom surface of the substrate, a semiconductor device disposed on the top surface of the substrate, and a stiffener having a connection portion that extends along at least a portion of a side edge of the substrate. A bottom surface of the connection portion may be coplanar with the bottom surface of the substrate. The apparatus may include a second array of connectors on the bottom surface of the connection portion.

Abstract: A substrate structure may include a substrate that includes a set of conductive pads formed below a surface of the substrate. The substrate structure may include a set of conductive layer portions formed over the set of conductive pads, wherein a particular conductive layer portion, of the set of conductive layer portions, extends from a corresponding particular conductive pad, of the set of conductive pads, to at least the surface of the substrate.

Abstract: A method includes positioning an integrated circuit package in a coining apparatus having a fixture and a pressing plate. The integrated circuit package includes a substrate, an integrated circuit device disposed on a top surface of the substrate, and a plurality of solder balls disposed on a bottom surface of the integrated circuit package. The fixture includes a support structure and a cavity. The cavity receives the integrated circuit device while the support structure supports portions of a top surface of the integrated circuit package. The pressing plate is pressed against two or more of the solder balls, coining the two or more solder balls until each solder ball has a desired coined surface profile.