Patents by Inventor Bernard Li
Bernard Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11642519Abstract: A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a polymer-matrix composite. The polymer-matrix composite includes a polymeric resin having discontinuous conductive fillers provided therein. The discontinuous conductive fillers include one or more of nano-sized metal structures and nano-sized non-metallic conductive structures. The nano-sized non-metallic conductive structures can have a coating formed of one or more metals. The nano-sized non-metallic conductive structures can be formed of carbon. In turn, the nano-sized non-metallic conductive structures can include one or more of carbon nanofibers, carbon filaments, carbon nanotubes, and carbon nanoflakes.Type: GrantFiled: August 9, 2019Date of Patent: May 9, 2023Assignee: MEDTRONIC, INC.Inventors: Bernard Li, Chad Cai, Xingfu Chen
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Patent number: 11278717Abstract: A temporary medical electrical lead includes a connector pin and a single conductor coil. The coil being close-wound and having no turns of the coil distal portion being mechanically coupled together. The coil distal portion translates a force of no greater than 0.1 lbf (0.4 N) when strained 400%.Type: GrantFiled: August 28, 2018Date of Patent: March 22, 2022Assignee: Medtronic, Inc.Inventors: Thomas J. Steigauf, Eric H. Bonde, Phillip C. Falkner, Jeevan M. Prasannakumar, Brian T. Stolz, John Shishilla, Adam J. Rivard, Robert Sandgren, Seth Humphrys, Bernard Li
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Patent number: 10537730Abstract: A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a material that is electrically conductive, where the material is in a wrapped or woven form. The material is selected so as to have an effective combination of small size and high conductive surface area, e.g., as opposed to metal wire or coatings thinner than metal wire. As such, the shield covering exhibits sufficient conductivity in the presence of one or more high frequency electromagnetic fields so that interference to the operation of the conductor assembly is minimized. The material can have a coating formed of one or more metals. The material can include carbon. In turn, the carbon can be formed of one or more of carbon fiber, carbon nanofiber, and single or multi-walled carbon nanotube.Type: GrantFiled: February 14, 2007Date of Patent: January 21, 2020Assignee: MEDTRONIC, INC.Inventors: Bernard Li, Chad Cai, Xingfu Chen
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Publication number: 20190358447Abstract: A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a polymer-matrix composite. The polymer-matrix composite includes a polymeric resin having discontinuous conductive fillers provided therein. The discontinuous conductive fillers include one or more of nano-sized metal structures and nano-sized non-metallic conductive structures. The nano-sized non-metallic conductive structures can have a coating formed of one or more metals. The nano-sized non-metallic conductive structures can be formed of carbon. In turn, the nano-sized non-metallic conductive structures can include one or more of carbon nanofibers, carbon filaments, carbon nanotubes, and carbon nanoflakes.Type: ApplicationFiled: August 9, 2019Publication date: November 28, 2019Inventors: Bernard Li, Chad Cai, Xingfu Chen
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Patent number: 10398893Abstract: A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a polymer-matrix composite. The polymer-matrix composite includes a polymeric resin having discontinuous conductive fillers provided therein. The discontinuous conductive fillers include one or more of nano-sized metal structures and nano-sized non-metallic conductive structures. The nano-sized non-metallic conductive structures can have a coating formed of one or more metals. The nano-sized non-metallic conductive structures can be formed of carbon. In turn, the nano-sized non-metallic conductive structures can include one or more of carbon nanofibers, carbon filaments, carbon nanotubes, and carbon nanoflakes.Type: GrantFiled: May 20, 2015Date of Patent: September 3, 2019Assignee: MEDTRONIC, INC.Inventors: Bernard Li, Chad Cai, Xingfu Chen
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Publication number: 20190060636Abstract: A temporary medical electrical lead includes a connector pin and a single conductor coil. The coil being close-wound and having no turns of the coil distal portion being mechanically coupled together. The coil distal portion translates a force of no greater than 0.1 lbf (0.4 N) when strained 400%.Type: ApplicationFiled: August 28, 2018Publication date: February 28, 2019Inventors: Thomas J. Steigauf, Eric H. Bonde, Phillip C. Falkner, Jeevan M. Prasannakumar, Brian T. Stolz, John Shishilla, Adam J. Rivard, Robert Sandgren, Seth Humphrys, Bernard Li
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Process and material solution to reduce metal ion release for implantable medical device application
Patent number: 9284648Abstract: The invention describes a method and compositions where the presence of cobalt and or nickel have been depleted from the surface layer(s) of a cobalt, chromium, nickel containing alloy.Type: GrantFiled: April 16, 2012Date of Patent: March 15, 2016Assignee: Medtronic, Inc.Inventors: Alan Shi, Bernard Li -
Publication number: 20150258335Abstract: A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a polymer-matrix composite. The polymer-matrix composite includes a polymeric resin having discontinuous conductive fillers provided therein. The discontinuous conductive fillers include one or more of nano-sized metal structures and nano-sized non-metallic conductive structures. The nano-sized non-metallic conductive structures can have a coating formed of one or more metals. The nano-sized non-metallic conductive structures can be formed of carbon. In turn, the nano-sized non-metallic conductive structures can include one or more of carbon nanofibers, carbon filaments, carbon nanotubes, and carbon nanoflakes.Type: ApplicationFiled: May 20, 2015Publication date: September 17, 2015Inventors: Bernard Li, Chad Cai, Xingfu Chen
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Patent number: 9044593Abstract: A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a polymer-matrix composite. The polymer-matrix composite includes a polymeric resin having discontinuous conductive fillers provided therein. The discontinuous conductive fillers include one or more of nano-sized metal structures and nano-sized non-metallic conductive structures. The nano-sized non-metallic conductive structures can have a coating formed of one or more metals. The nano-sized non-metallic conductive structures can be formed of carbon. In turn, the nano-sized non-metallic conductive structures can include one or more of carbon nanofibers, carbon filaments, carbon nanotubes, and carbon nanoflakes.Type: GrantFiled: February 14, 2007Date of Patent: June 2, 2015Assignee: MEDTRONIC, INC.Inventors: Bernard Li, Chad Cai, Xingfu Chen
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Patent number: 8805537Abstract: Described herein is a device configured to be implanted into a live human or animal. The device includes an electrically non-conductive frame; one or more electrical components disposed in the electrically non-conductive frame; and a self-supporting film. The self-supporting film forms a hermetical seal with the electrically non-conductive frame. The self-supporting film and the frame enclose the electrical components. The device is configured to be implanted into a live human or animal. Also described herein is a method of making a device configured to be implanted into a live human or animal. The method includes providing an electrically non-conductive frame comprising one or more feedthroughs, openings and a cavity; disposing electrical components within the cavity; optionally filling the cavity with a material to embed the electrical components in the material; and sealing the openings by applying a self-supporting film to the one or more openings.Type: GrantFiled: March 13, 2013Date of Patent: August 12, 2014Assignee: Medtronic, Inc.Inventors: Peng Cong, Bernard Li
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PROCESS AND MATERIAL SOLUTION TO REDUCE METAL ION RELEASE FOR IMPLANTABLE MEDICAL DEVICE APPLICATION
Publication number: 20120273090Abstract: The invention describes a method and compositions where the presence of cobalt and or nickel have been depleted from the surface layer(s) of a cobalt, chromium, nickel containing alloy.Type: ApplicationFiled: April 16, 2012Publication date: November 1, 2012Inventors: Alan Shi, Bernard Li -
Patent number: 7801613Abstract: The housing of an implantable medical device is made of a titanium alloy that provides improved electrical performance, mechanical strength, and reduced MRI heating. The titanium alloy housing includes portions formed by metal injection molding and welded together. Wall thickness of at least a portion of one major face of the housing is reduced by chemical etching a metal injected molded housing portion.Type: GrantFiled: April 26, 2007Date of Patent: September 21, 2010Assignee: Medtronic, Inc.Inventors: Bernard Li, Reginald D. Robinson, John E. Kast
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Publication number: 20080269829Abstract: The housing of an implantable medical device is made of a titanium alloy that provides improved electrical performance, mechanical strength, and reduced MRI heating. The titanium alloy housing includes portions formed by metal injection molding and welded together. Wall thickness of at least a portion of one major face of the housing is reduced by chemical etching a metal injected molded housing portion.Type: ApplicationFiled: April 26, 2007Publication date: October 30, 2008Applicant: Medtronic, Inc.Inventors: Bernard Li, Reginald D. Robinson, John E. Kast
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Publication number: 20080195186Abstract: A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a material that is electrically conductive, where the material is in a wrapped or woven form. The material is selected so as to have an effective combination of small size and high conductive surface area, e.g., as opposed to metal wire or coatings thinner than metal wire. As such, the shield covering exhibits sufficient conductivity in the presence of one or more high frequency electromagnetic fields so that interference to the operation of the conductor assembly is minimized. The material can have a coating formed of one or more metals. The material can include carbon. In turn, the carbon can be formed of one or more of carbon fiber, carbon nanofiber, and single or multi-walled carbon nanotube.Type: ApplicationFiled: February 14, 2007Publication date: August 14, 2008Inventors: Bernard Li, Chad Cai, Xingfu Chen
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Publication number: 20080195187Abstract: A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a polymer-matrix composite. The polymer-matrix composite includes a polymeric resin having discontinuous conductive fillers provided therein. The discontinuous conductive fillers include one or more of nano-sized metal structures and nano-sized non-metallic conductive structures. The nano-sized non-metallic conductive structures can have a coating formed of one or more metals. The nano-sized non-metallic conductive structures can be formed of carbon. In turn, the nano-sized non-metallic conductive structures can include one or more of carbon nanofibers, carbon filaments, carbon nanotubes, and carbon nanoflakes.Type: ApplicationFiled: February 14, 2007Publication date: August 14, 2008Inventors: Bernard Li, Chad Cai, Xingfu Chen
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Publication number: 20070251289Abstract: A method includes applying a constant force to at least a portion of a component configured for use in a medical device and while the constant force is applied, subjecting the component to a temperature above ambient temperature for an amount of time sufficient to-improve the flatness of the component.Type: ApplicationFiled: April 28, 2006Publication date: November 1, 2007Inventor: Bernard Li
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Publication number: 20050013539Abstract: An optical coupling system having an integrated micro lens system for achieving high coupling efficiency between an optoelectronic element and an optical medium such as an optical fiber. The system may have a posts formed on the wafer incorporating the optoelectronic elements. The posts may have micro lenses formed on them. The posts with their respective micro lenses may be situated over respective optoelectronic elements. A window may be formed over the wafer components that may include micro lenses, posts and optoelectronic elements. The window may be part of the package that hermetically seals these components. An optical fiber or an array of fibers may be positioned proximate to the window for the receiving or transmitting of light. The optical coupling system may instead have an aspherical lens situated between the optoelectronic component and optical fiber. The fiber may be in contact with the near lens surface.Type: ApplicationFiled: July 17, 2003Publication date: January 20, 2005Inventors: Bo Chen, Bernard Li
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Publication number: 20050013553Abstract: An optical coupling system having a split sleeve with a metallized strip adhered to a housing barrel at one end. The sleeve may be smaller than an optical fiber ferrule. The sleeve may have spring-like flexibility and be stretched open at the slit sufficiently to permit insertion of the ferrule in the sleeve. The sleeve may be made of zirconia. The ferrule may be held by the sleeve's spring-like contraction around the ferrule. Attached at the other end of the barrel may be an optoelectronic element such as a vertical cavity surface emitting laser. An optical fiber end of the ferrule may be aligned with the laser. Since the ferrule may be held firmly by the sleeve attached to the coupling barrel, there would be virtually no movement or wiggle of the fiber end relative to the laser and thus the alignment may be maintained.Type: ApplicationFiled: July 16, 2003Publication date: January 20, 2005Inventors: Raymond Blasingame, James Lee, Bernard Li
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Publication number: 20050014390Abstract: Methods and devices for handling wafers during wafer processing are provided. One embodiment includes an apparatus for holding a wafer. The holding apparatus includes a pocket for receiving a wafer, and may include a mechanism allowing for the wafer to be secured within the pocket. Methods are also included for preparing a wafer for fabrication processes by the use of a wafer holding apparatus. These methods may include applying a layer of photoresist to the surface of a wafer.Type: ApplicationFiled: July 18, 2003Publication date: January 20, 2005Inventor: Bernard Li
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Publication number: 20050013542Abstract: A coupler for coupling light between an optoelectronic element and an optical fiber. The coupler has a fiber stop that is made of a material that has an index of refraction that effectively matches the index of refraction of the optical fiber being coupled to the optoelectronic element. The fiber stop may be flat or rounded. It may be a discrete or molded part of the coupler assembly. The end of the fiber being stopped may be flat or rounded.Type: ApplicationFiled: July 16, 2003Publication date: January 20, 2005Inventors: Raymond Blasingame, Bo Chen, James Guenter, James Lee, Bernard Li, James Orenstein