Patents by Inventor Bernard M. Dick

Bernard M. Dick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mount component
    Patent number: 4542439
    Abstract: A surface mount component (11) has at least one lead (12) which extends from a body portion (16) of the component (11) along an axis (14) through the component. An outer end portion of the lead (12) is formed into a circuit termination (20) of a shape which, when projected onto a plane perpendicular to the axis, encompasses a projection of the body portion (16) of the component onto the plane.
    Type: Grant
    Filed: June 27, 1984
    Date of Patent: September 17, 1985
    Assignee: AT&T Technologies, Inc.
    Inventor: Bernard M. Dick
  • Leak testing hermetically sealed electronic articles
    Patent number: 4282744
    Abstract: Hermetically sealed electronic articles (11) such as, for example, diodes are leak tested by exposing the articles to a fluid (28) under pressure. The fluid is capable of altering the electrical characteristics of the articles to a value outside of an acceptable range of values upon penetrating through faulty hermetic seals of the articles (11). After such exposure the articles (11) are routinely tested and the articles with values of their characteristics outside the range of acceptable values are identified or discarded. Ethylene glycol is an example of a preferred fluid (28) in that it has conductive properties which significantly increase the reverse bias leakage current of the diodes.
    Type: Grant
    Filed: November 2, 1979
    Date of Patent: August 11, 1981
    Assignee: Western Electric Co., Inc.
    Inventor: Bernard M. Dick