Patents by Inventor Bernard P. Stenson

Bernard P. Stenson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140240944
    Abstract: A microelectronic circuit having at least one component adjacent a carrier which is not a semiconductor or sapphire.
    Type: Application
    Filed: February 25, 2013
    Publication date: August 28, 2014
    Applicant: ANALOG DEVICES TECHNOLOGY
    Inventors: Bernard P. Stenson, Michael Morrissey, Seamus A. Lynch
  • Patent number: 7719403
    Abstract: A thin film resistor (5) of an integrated circuit comprises an elongate resistive film (7) extending between electrical contact pads (10,11). A low impedance element (20) overlays and is electrically coupled to a portion of the resistive film (7) in an intermediate portion (22) thereof adjacent a second side edge (17) of the resistive film (7) for conducting current in parallel with the intermediate portion (22), and for reducing current density in the intermediate portion (22). First and second transverse edges (28,29) formed by spaced apart first and second slots (26,27) which extend from a first side edge (16) into the resistive film (7) define with a first side edge (16) of the resistive film (7) and the low impedance element (20) first and second trimmable areas (30,31) in the intermediate portion (22).
    Type: Grant
    Filed: September 4, 2009
    Date of Patent: May 18, 2010
    Assignee: Analog Devices, Inc.
    Inventors: Patrick M. McGuinness, Bernard P. Stenson
  • Publication number: 20090322466
    Abstract: A thin film resistor (5) of an integrated circuit comprises an elongate resistive film (7) extending between electrical contact pads (10,11). A low impedance element (20) overlays and is electrically coupled to a portion of the resistive film (7) in an intermediate portion (22) thereof adjacent a second side edge (17) of the resistive film (7) for conducting current in parallel with the intermediate portion (22), and for reducing current density in the intermediate portion (22). First and second transverse edges (28,29) formed by spaced apart first and second slots (26,27) which extend from a first side edge (16) into the resistive film (7) define with a first side edge (16) of the resistive film (7) and the low impedance element (20) first and second trimmable areas (30,31) in the intermediate portion (22).
    Type: Application
    Filed: September 4, 2009
    Publication date: December 31, 2009
    Applicant: Analog Devices, Inc.
    Inventors: Patrick M. McGuinness, Bernard P. Stenson
  • Patent number: 7598841
    Abstract: A thin film resistor (5) of an integrated circuit comprises an elongate resistive film (7) extending between electrical contact pads (10,11). A low impedance element (20) overlays and is electrically coupled to a portion of the resistive film (7) in an intermediate portion (22) thereof adjacent a second side edge (17) of the resistive film (7) for conducting current in parallel with the intermediate portion (22), and for reducing current density in the intermediate portion (22). First and second transverse edges (28,29) formed by spaced apart first and second slots (26,27) which extend from a first side edge (16) into the resistive film (7) define with a first side edge (16) of the resistive film (7) and the low impedance element (20) first and second trimmable areas (30,31) in the intermediate portion (22).
    Type: Grant
    Filed: September 20, 2005
    Date of Patent: October 6, 2009
    Assignee: Analog Devices, Inc.
    Inventors: Patrick M. McGuinness, Bernard P. Stenson