Patents by Inventor Bernd Boer

Bernd Boer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8808475
    Abstract: Disclosed is a creep-resistant low-expansion iron-nickel alloy that is provided with increased mechanical resistance and contains 40 to 43 wt. % of Ni, a maximum of 0.1 wt. % of C, 2.0 to 3.5 wt. % of Ti, 0.1 to 1.5 wt. % of Al, 0.1 to 1.0 wt. % of Nb, 0.005 to 0.8 wt. % of Mn, 0.005 to 0.6 wt. % of Si, a maximum of 0.5 wt. % of Co, the remainder being composed of Fe and production-related impurities. Said alloy has a mean coefficient of thermal expansion <5×10<?6>/K in the temperature range of 20 to 200 DEG C.
    Type: Grant
    Filed: January 26, 2007
    Date of Patent: August 19, 2014
    Assignee: Outokumpu VDM GmbH
    Inventors: Bodo Gehrmann, Bernd Boer
  • Publication number: 20100175847
    Abstract: Use of an iron-nickel-cobalt alloy in CFC mould construction comprising (in % by mass) Ni from 30 to 35%, Co from 3 to 6%, Al from 0.001 to 0.1%, Mn from 0.005 to 0.5%, Si from 0.005 to 0.5%, C max. 0.1%, balance Fe and constituents resulting from production, with the alloy having a mean coefficient of thermal expansion in the temperature range from 20 to 200 DEG C of <2.0 OE10<?6>/K.
    Type: Application
    Filed: January 26, 2007
    Publication date: July 15, 2010
    Inventors: Bodo Gehrmann, Bernd Boer
  • Publication number: 20090047167
    Abstract: Disclosed is a creep-resistant low-expansion iron-nickel alloy that is provided with increased mechanical resistance and contains 40 to 43 wt. % of Ni, a maximum of 0.1 wt. % of C, 2.0 to 3.5 wt. % of Ti, 0.1 to 1.5 wt. % of Al, 0.1 to 1.0 wt. % of Nb, 0.005 to 0.8 wt. % of Mn, 0.005 to 0.6 wt. % of Si, a maximum of 0.5 wt. % of Co, the remainder being composed of Fe and production-related impurities. Said alloy has a mean coefficient of thermal expansion <5×10<?6>/K in the temperature range of 20 to 200 DEG C.
    Type: Application
    Filed: January 26, 2007
    Publication date: February 19, 2009
    Inventors: Bodo Gehrmann, Bernd Boer