Abstract: The invention relates to a cooler for use as a heat sink for electrical components or circuits consisting of several cooler layers which are joined flat to one another, which are stacked on top of one another, which form between channels through which coolant flows and which each discharge into at least one first collection space for supply of the coolant and into a second collection space for draining the coolant, the collection spaces being formed by openings in the cooler layers and the cooling channels by structuring at least one area of the coolant layers with openings, the area being between the openings.

Abstract: A microcooler with channels through which coolant flows. The channels are formed by individual cooler layers having a region which is structured in the manner of a screen and having a plurality of openings with edge lines closed and with material bridges or material regions remaining between these openings. None of the openings on any of the cooler layers form a continuous channel which extends from a collection space for feed of the coolant to a collection space for drainage of the coolant. The individual breaches, and the material bridges or material regions, provided between them are offset from cooler layer to cooler layer such that flow of the coolant through the cooler is possible only with continuous changing of the layers. Using the breaches within the cooler results in a highly branched labyrinth through which coolant flows.