Patents by Inventor Bernd Sauter

Bernd Sauter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9568107
    Abstract: A mechanical seal has a housing having a collecting space for a coolant/lubricant medium. A sleeve is disposed in the housing. A counter ring is disposed in the housing and fixedly connected to the sleeve. A slide ring is disposed in the housing and interacts with the counter ring. At least one inlet conduit communicating with the collecting space is provided. The at least one inlet conduit is positioned between a radial bottom of the housing and a radial ring segment of the sleeve.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: February 14, 2017
    Assignee: KACO GmbH + Co. KG
    Inventors: Bernd Sauter, Tobias Hoffmann
  • Patent number: 6051498
    Abstract: A method for manufacturing a semiconductor wafer which is coated on one s and provided with a finish has a) the semiconductor wafer being subjected to a first treatment (double-sided finish) which produces a finish on both sides of the semiconductor wafer at the same time; has b) at least one coating being produced on one side of the semiconductor wafer; and has c) the semiconductor wafer being subjected to a second treatment which produces a double-sided finish.
    Type: Grant
    Filed: January 6, 1998
    Date of Patent: April 18, 2000
    Assignee: Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
    Inventors: Georg Pietsch, Bernd Sauter, Ernst Feuchtinger
  • Patent number: 5911461
    Abstract: A carrier for a semiconductor wafer has at least three protrusions on which he edge of the semiconductor wafer is supported so that the semiconductor wafer is positioned essentially horizontal. The carrier does not make contact with the front side and the rear side of the semiconductor wafer. The protrusions are shaped so that the edge of the semiconductor wafer is supported exclusively below an imaginary central plane in the center between the front side and the rear side of the semiconductor wafer. The carrier is preferably used in the treatment of semiconductor wafers at temperatures of at least 200.degree. C.
    Type: Grant
    Filed: June 24, 1997
    Date of Patent: June 15, 1999
    Assignee: Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
    Inventors: Bernd Sauter, Dieter Seifert