Patents by Inventor Bernhard Rebhan
Bernhard Rebhan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10163681Abstract: A method for bonding of a first solid substrate to a second solid substrate which contains a first material with the following steps, especially the following sequence: formation or application of a function layer which contains a second material to the second solid substrate, making contact of the first solid substrate with the second solid substrate on the function layer, pressing together the solid substrates for forming a permanent bond between the first and second solid substrate, at least partially reinforced by solid diffusion and/or phase transformation of the first material with the second material, an increase of volume on the function layer being caused.Type: GrantFiled: August 30, 2011Date of Patent: December 25, 2018Assignee: EV Group E. Thallner GmbHInventors: Klaus Martinschitz, Markus Wimplinger, Bernhard Rebhan, Kurt Hingerl
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Patent number: 9947638Abstract: A method and corresponding device for permanent bonding of a first layer of a first substrate to a second layer of a second substrate on a bond interface, characterized in that a dislocation density of a dislocation of the first and/or second layer is increased at least in the region of the bond interface before and/or during the bonding.Type: GrantFiled: April 22, 2015Date of Patent: April 17, 2018Assignee: EV Group E. Thallner GmbHInventors: Markus Wimplinger, Bernhard Rebhan
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Patent number: 9640510Abstract: A method for bonding of a first, at least partially metallic contact surface of a first substrate to a second, at least partially metallic contact surface of a second substrate, with the following steps, especially the following progression: application of a sacrificial layer which is at least partially, especially predominantly soluble in the material of at least one of the contact surfaces to at least one of the contact surfaces, bonding of the contact surfaces with at least partial solution of the sacrificial layer in at least one of the contact surfaces.Type: GrantFiled: July 5, 2013Date of Patent: May 2, 2017Assignee: EV GROUP E. THALLNER GMBHInventor: Bernhard Rebhan
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Publication number: 20170053892Abstract: A method and corresponding device for permanent bonding of a first layer of a first substrate to a second layer of a second substrate on a bond interface, characterized in that a dislocation density of a dislocation of the first and/or second layer is increased at least in the region of the bond interface before and/or during the boding.Type: ApplicationFiled: April 22, 2015Publication date: February 23, 2017Applicant: EV Group E. Thallner GmbHInventors: Markus Wimplinger, Bernhard Rebhan
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Patent number: 9500541Abstract: A method and a device for determining the pressure distribution for bonding of a first substrate to a second substrate, with the following steps, especially with the following sequence: placing a measurement layer between a first tool for holding the first substrate and an opposite second tool which is aligned to the first tool for bonding of the substrate, deformation of the measurement layer by bringing the tools closer to one another, measurement of the deformation of the measurement layer and computation of the pressure distribution.Type: GrantFiled: June 6, 2011Date of Patent: November 22, 2016Assignee: EV Group E. Thallner GmbHInventors: Bernhard Rebhan, Markus Wimplinger, Jürgen Burggraf
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Patent number: 9443820Abstract: A device for bonding of one bond side of a first substrate to one bond side of a second substrate, the device having one module group with a common working space which can be closed especially gastight to the environment, at least one bond module is connected in a sealed manner to the working space, and a movement apparatus for moving the first and second substrate in the working space. The module group has a reduction module which is connected, in a sealed manner to the working space for reducing the bond sides.Type: GrantFiled: May 30, 2012Date of Patent: September 13, 2016Assignee: EV GROUP E. THALLNER GMBHInventor: Bernhard Rebhan
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Patent number: 9358765Abstract: A method for coating of a first substrate with a first diffusion bond layer by deposition of a first material which forms the first diffusion bond layer on a first surface of the first substrate such that the first diffusion bond layer forms a grain surface with an average grain diameter H parallel to the first surface smaller than 1 ?m. The invention further relates to a method for bonding of a first substrate which has been coated as described above to a second substrate which has a second diffusion bond layer, the method of the bonding comprising the following steps: bring a first diffusion bond layer of a first substrate into contact with a second diffusion bond layer of a second substrate, pressing the substrates together to form a permanent metal diffusion bond between the first and second substrates.Type: GrantFiled: September 28, 2012Date of Patent: June 7, 2016Assignee: EV GROUP E. THALLNER GMBHInventors: Markus Wimplinger, Bernhard Rebhan
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Publication number: 20160071817Abstract: A method for bonding of a first, at least partially metallic contact surface of a first substrate to a second, at least partially metallic contact surface of a second substrate, with the following steps, especially the following progression: application of a sacrificial layer which is at least partially, especially predominantly soluble in the material of at least one of the contact surfaces to at least one of the contact surfaces, bonding of the contact surfaces with at least partial solution of the sacrificial layer in at least one of the contact surfaces.Type: ApplicationFiled: July 5, 2013Publication date: March 10, 2016Applicant: EV GROUP E. THALLNER GMBHInventor: Bernhard Rebhan
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Publication number: 20150224755Abstract: A method for coating of a first substrate with a first diffusion bond layer by deposition of a first material which forms the first diffusion bond layer on a first surface of the first substrate such that the first diffusion bond layer forms a grain surface with an average grain diameter H parallel to the first surface smaller than 1 ?m. The invention further relates to a method for bonding of a first substrate which has been coated as described above to a second substrate which has a second diffusion bond layer, the method of the bonding comprising the following steps: bring a first diffusion bond layer of a first substrate into contact with a second diffusion bond layer of a second substrate, pressing the substrates together to form a permanent metal diffusion bond between the first and second substrates.Type: ApplicationFiled: September 28, 2012Publication date: August 13, 2015Applicant: EV GROUP E. THALLNER GMBHInventors: Markus Wimplinger, Bernhard Rebhan
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Patent number: 9067363Abstract: A method for bonding a first bond surface of a first solid substrate consisting of a first material to a second bond surface of a second solid substrate consisting of a second material. The method including the steps of: working one of the first and/or second bond surfaces with a cutting tool at a speed vs that is below a critical speed vk and at a temperature Ts that exceeds a critical temperature Tk, down to a surface roughness O that is less than 1 ?m; bringing the first solid substrate into contact with the second solid substrate at the bond surfaces, and exposing the solid substrates that are in contact to temperature in order to form a permanent bond that is at least primarily produced by recrystallization at the bond surfaces.Type: GrantFiled: January 23, 2012Date of Patent: June 30, 2015Assignee: EV Group E. Thallner GmbHInventors: Klaus Martinschitz, Markus Wimplinger, Bernhard Rebhan
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Publication number: 20150069115Abstract: A device for bonding of one bond side of a first substrate to one bond side of a second substrate, the device having one module group with a common working space which can be closed especially gastight to the environment, at least one bond module is connected in a sealed manner to the working space, and a movement apparatus for moving the first and second substrate in the working space, The module group has a reduction module which is connected, in a sealed manner to the working space for reducing the bond sides.Type: ApplicationFiled: May 30, 2012Publication date: March 12, 2015Applicant: EV GROUP E. THALLNER GMBHInventor: Bernhard Rebhan
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Publication number: 20140196842Abstract: A method for bonding a first bond surface of a first solid substrate consisting of a first material to a second bond surface of a second solid substrate consisting of a second material, said method comprising the steps of: working one of the first and/or second bond surfaces with a cutting tool at a speed vs that is below a critical speed vk and at a temperature Ts that exceeds a critical temperature Tk, down to a surface roughness O that is less than 1 ?m; bringing the first solid substrate into contact with the second solid substrate at the bond surfaces, and exposing the solid substrates that are in contact to temperature in order to form a permanent bond that is at least primarily produced by recrystallization at the bond surfaces.Type: ApplicationFiled: January 23, 2012Publication date: July 17, 2014Inventors: Klaus Martinschitz, Markus Wimplinger, Bernhard Rebhan
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Publication number: 20140154867Abstract: A method for bonding of a first solid substrate to a second solid substrate which contains a first material with the following steps, especially the following sequence: formation or application of a function layer which contains a second material to the second solid substrate, making contact of the first solid substrate with the second solid substrate on the function layer, pressing together the solid substrates for forming a permanent bond between the first and second solid substrate, at least partially reinforced by solid diffusion and/or phase transformation of the first material with the second material, an increase of volume on the function layer being caused.Type: ApplicationFiled: August 30, 2011Publication date: June 5, 2014Inventors: Klaus Martinschitz, Markus Wimplinger, Bernhard Rebhan, Kurt Hingerl
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Publication number: 20140102221Abstract: A method and a device for determining the pressure distribution for bonding of a first substrate to a second substrate, with the following steps, especially with the following sequence: placing a measurement layer between a first tool for holding the first substrate and an opposite second tool which is aligned to the first tool for bonding of the substrate, deformation of the measurement layer by bringing the tools closer to one another, measurement of the deformation of the measurement layer and computation of the pressure distribution.Type: ApplicationFiled: June 6, 2011Publication date: April 17, 2014Inventors: Bernhard Rebhan, Markus Wimplinger, Jürgen Burggraf