Patents by Inventor Bert Ripper

Bert Ripper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tool and method for the abrasive machining of a substantially planar surface
    Patent number: 6439987
    Abstract: A tool and method are provided for the abrasive machining of a substantially planar surface. The tool has a base body and a plurality of elements which are mounted on the base body and form a planar coating which is used as a working coating during machining of the surface.
    Type: Grant
    Filed: June 23, 2000
    Date of Patent: August 27, 2002
    Assignee: Wacker-Siltronic Gesellschaft für Halbleitermaterialien AG
    Inventors: Bert Ripper, Hubert Grubmüller
  • Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece
    Patent number: 6295977
    Abstract: A method is for simultaneously cutting off a multiplicity of wafers from a hard, brittle workpiece which has a longitudinal axis and a peripheral surface. The workpiece is guided, by means of a translational relative movement, directed perpendicular to the longitudinal axis, between the workpiece and a wire web of a wire saw with the aid of a feed device, through the wire web which is formed by a sawing wire. The workpiece is rotated about the longitudinal axis while the wafers are being cut off. There is also a wire saw which is suitable for carrying out the method and has a device for holding and for rotating the workpiece about the longitudinal axis.
    Type: Grant
    Filed: November 4, 1999
    Date of Patent: October 2, 2001
    Assignees: Wacker Chemie GmbH, Wacker Siltronic Gesellschaft für Halbleitermaterialien AG
    Inventors: Bert Ripper, Christian Andrae, Karl Egglhuber, Holger Lundt, Helmut Kölker, Jochen Greim
  • Method for achieving a wear performance which is as linear as possible and tool having a wear performance which is as linear as possible
    Patent number: 6129609
    Abstract: Material removing machining is for wafer shaped workpieces, in particular semiconductor wafers. There is a method for achieving a wear performance which is as linear as possible for a tool which has an essentially planar working surface for the material removing machining of wafer shaped workpieces. The tool has a wear performance which is as linear as possible. There are also a method and a device for measuring a wear profile on an essentially planar working surface for the material removing machining of wafer shaped workpieces. There is also a carrier which is used for the two-sided material removing machining of wafer shaped workpieces.
    Type: Grant
    Filed: November 3, 1998
    Date of Patent: October 10, 2000
    Assignee: Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
    Inventors: Bert Ripper, Robert Hofmann, Peter Lehfeld, Holger Lundt