Patents by Inventor Bertrand Chambion
Bertrand Chambion has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136456Abstract: A photovoltaic device comprising an assembly of several strings of photovoltaic cells, each of the strings being formed by a plurality of cells aligned in a first direction y, the strings being aligned in a second direction x forming a non-zero angle with the first direction and typically orthogonal or substantially orthogonal to the first direction, the assembly of cells including a first string laterally overlapped by a second chain of the plurality of strings, so that a peripheral portion of the second string covers a peripheral portion of the first string, the first string and the second string being electrically insulated via an insulating region interposed between the respective peripheral portions of the first string and of the second string.Type: ApplicationFiled: October 18, 2023Publication date: April 25, 2024Inventors: Romain Soulas, Bertrand Chambion
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Publication number: 20240038915Abstract: An assembly of solar cells is provided with a connection structure arranged opposite and between a peripheral zone of a first solar cell and a second peripheral zone of a second solar cell. The connection structure provides increased mechanical flexibility and includes an oblong conductive portion and a set of conductive blocks distributed over the oblong conductive portion, alternately over a first region of the oblong conductive portion and over a second region of the oblong conductive portion opposite the first region.Type: ApplicationFiled: July 26, 2021Publication date: February 1, 2024Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventor: Bertrand CHAMBION
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Patent number: 11769785Abstract: A process includes providing electronic chips, the chips having been diced beforehand and each including a stack including a matrix-array of pixels, an interconnect layer, first layer, joining the electronic chips to a carrier substrate, so as to leave a spacing region between the chips; forming a redistribution layer having lateral ends extending into each spacing region; forming metal pillars on the lateral ends; moulding a material including first segments, facing the first layers, second segments which are separate from the first segments, and which extend around the metal pillars; the first and second segments being coplanar; applying a heat treatment, the formed material being chosen so that the stack is curved with a convex shape; the second segments remaining coplanar at the end.Type: GrantFiled: October 16, 2020Date of Patent: September 26, 2023Assignee: Commissariat a l'Energie Atomique et aux Energies AlternativesInventors: Bertrand Chambion, Jean-Philippe Colonna
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Patent number: 11424286Abstract: A wafer-level process includes providing a set of electronic chips, including a stack with a set of matrix arrays of pixels, an interconnect layer electrically connected to the set of matrix arrays of pixels, and a first layer, including vias electrically connected to the interconnect layer. The wafer-level process further includes forming metal pillars on the first layer, the pillars being electrically connected to the vias, and forming a material integrally with the first layer, around the metal pillars. The wafer-level process also includes dicing the electronic chips so as to release the thermomechanical stresses to which the stack is subjected. Finally, the wafer-level process includes making the metal pillars coplanar after dicing the electronic chips.Type: GrantFiled: July 24, 2020Date of Patent: August 23, 2022Assignee: Commissariat a l'Energie Atomique et aux Energies AlternativesInventors: Bertrand Chambion, Jean-Philippe Colonna
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Patent number: 11289359Abstract: A method of manufacturing a device includes: —a) a first step for the formation of a temporary structure that comprises electroluminescent structures separated by trenches and comprising an electroluminescent face, the electroluminescent structures being bonded by means of a bond layer on a temporary substrate; b) an assembly step bringing the electroluminescent structures into contact with a host face of a host substrate; and c) a step for removal of the temporary substrate; wherein the bond layer, that comprises an electrically conducting organic polymer material at least partially transparent to light radiation, is at least partly kept after step c) and forms an electrode common to the light emitting faces, with a thickness of more than 20 nm.Type: GrantFiled: December 20, 2018Date of Patent: March 29, 2022Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventor: Bertrand Chambion
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Patent number: 11165005Abstract: The invention relates to a method for producing a first microelectronic chip including a layer of interest having a connection face, intended to be hybridized with a second microelectronic chip. The method including depositing a layer of adhesive on a face of the layer of interest opposite to the first connection face and fastening a handle layer to the layer of adhesive. The method also includes, prior to the steps of depositing the adhesive and fastening the handle layer, defining, on the one hand, a maximum thickness eccmax and a minimum value Eccmin and a maximum value Eccmax of the Young's modulus for the layer of adhesive, and, on the other hand, the minimum thickness ecpmin for the handle layer.Type: GrantFiled: October 16, 2017Date of Patent: November 2, 2021Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventors: Adrien Gasse, David Henry, Bertrand Chambion
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Patent number: 10991738Abstract: A method for producing curved electronic circuits is provided, including placing adhesive elements between electronic chips and curved bearing surfaces, with the chips disposed between the surfaces and a flexible film, and such that the chips, the elements, and the surfaces are arranged in a single volume to be depressurised towards an environment outside the volume, the volume including empty spaces between the chips and the surfaces, the spaces being in fluid communication with each other within the volume; establishing a pressure difference between an inside and an outside of the volume such that the film applies a pressure on and collectively deforms the chips in accordance with the surfaces; and stopping the establishing of the pressure difference, the chips being collectively maintained against the surfaces by the elements such that a shape of each of the chips conforms to a corresponding shape of each of the surfaces.Type: GrantFiled: November 2, 2018Date of Patent: April 27, 2021Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventors: Bertrand Chambion, Stephane Caplet
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Publication number: 20210118940Abstract: A process includes providing electronic chips, the chips having been diced beforehand and each including a stack including a matrix-array of pixels, an interconnect layer, first layer, joining the electronic chips to a carrier substrate, so as to leave a spacing region between the chips; forming a redistribution layer having lateral ends extending into each spacing region; forming metal pillars on the lateral ends; moulding a material including first segments, facing the first layers, second segments which are separate from the first segments, and which extend around the metal pillars; the first and second segments being coplanar; applying a heat treatment, the formed material being chosen so that the stack is curved with a convex shape; the second segments remaining coplanar at the end.Type: ApplicationFiled: October 16, 2020Publication date: April 22, 2021Applicant: Commissariat a l'Energie Atomique et aux Energies AlternativesInventors: Bertrand CHAMBION, Jean-Philippe COLONNA
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Publication number: 20210090933Abstract: A method of manufacturing a device includes:—a) a first step for the formation of a temporary structure that comprises electroluminescent structures separated by trenches and comprising an electroluminescent face, the electroluminescent structures being bonded by means of a bond layer on a temporary substrate; b) an assembly step bringing the electroluminescent structures into contact with a host face of a host substrate; and c) a step for removal of the temporary substrate; wherein the bond layer, that comprises an electrically conducting organic polymer material at least partially transparent to light radiation, is at least partly kept after step c) and forms an electrode common to the light emitting faces, with a thickness of more than 20 nm.Type: ApplicationFiled: December 20, 2018Publication date: March 25, 2021Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventor: Bertrand CHAMBION
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Publication number: 20210028222Abstract: A wafer-level process includes providing a set of electronic chips, including a stack with a set of matrix arrays of pixels, an interconnect layer electrically connected to the set of matrix arrays of pixels, and a first layer, including vias electrically connected to the interconnect layer. The wafer-level process further includes forming metal pillars on the first layer, the pillars being electrically connected to the vias, and forming a material integrally with the first layer, around the metal pillars. The wafer-level process also includes dicing the electronic chips so as to release the thermomechanical stresses to which the stack is subjected. Finally, the wafer-level process includes making the metal pillars coplanar after dicing the electronic chips.Type: ApplicationFiled: July 24, 2020Publication date: January 28, 2021Applicant: Commissariat a l'Energie Atomique et aux Energies AlternativesInventors: Bertrand Chambion, Jean-Philippe Colonna
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Patent number: 10845405Abstract: An electronic circuit including: an electronic component, a conductive armature surrounding the electronic component, an electrical insulator between the electronic component and the conductive armature, a device configured to measure current passing through the armature or voltage on the armature or on the electronic component, and a defect determination device configured to determine a defect in the electrical insulator based on the measured current or voltage.Type: GrantFiled: December 15, 2016Date of Patent: November 24, 2020Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventor: Bertrand Chambion
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Patent number: 10820407Abstract: An electronic structure includes a plurality of electronic devices arranged in the form of a matrix array including a first number of rows, the electronic devices of each row being connected in series, the matrix array further including a plurality of switches, the rows of the matrix array being distributed in a second number of groups intended to be connected in series by the switches, the groups connected in series being supplied with an electrical supply current, at least one of the groups including at least two rows connected in parallel so as to distribute the supply current between the at least two rows.Type: GrantFiled: December 22, 2017Date of Patent: October 27, 2020Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventor: Bertrand Chambion
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Patent number: 10658420Abstract: A method for producing a plurality of curved electronic circuits includes: producing a support including a plurality of membranes made from at least one material having a rigidity of more than around 100 MPa, each intended for being part of one of the electronic circuits and having a radius of curvature R between about 15 mm and 500 mm; applying a force to one of the main surfaces of each of the membranes, so that the membrane deforms resiliently and has a substantially planar shape when exposed to the force; rigidly connecting at least one electronic component to each of the membranes; and removing the force applied to one of the main faces of each of the membranes so that each of the membranes retrieves its original radius of curvature R and curves the electronic component according to this radius of curvature R.Type: GrantFiled: January 17, 2018Date of Patent: May 19, 2020Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventors: Bertrand Chambion, Emmanuel Hugot
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Patent number: 10593588Abstract: An electronic circuit including a semiconducting or conducting substrate having first and second opposite surfaces and at least first and second non-parallel electrically insulating trenches that extend from the first surface in the substrate, define at least one portion of the substrate and join at a junction, the portion of the substrate including a protrusion that extends to the junction.Type: GrantFiled: December 21, 2016Date of Patent: March 17, 2020Assignees: Aledia, Commissariat à l'Énergie Atomique et aux Énergies AlternativesInventors: Fabienne Goutaudier, Thomas Lacave, Vincent Beix, Stephan Borel, Bertrand Chambion, Brigitte Soulier
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Publication number: 20200058837Abstract: The invention relates to a method for producing a first microelectronic chip including a layer of interest having a connection face, intended to be hybridized with a second microelectronic chip. The method including depositing a layer of adhesive on a face of the layer of interest opposite to the first connection face and fastening a handle layer to the layer of adhesive. The method also includes, prior to the steps of depositing the adhesive and fastening the handle layer, defining, on the one hand, a maximum thickness eccmax and a minimum value Eccmin and a maximum value Eccmax of the Young's modulus for the layer of adhesive, and, on the other hand, the minimum thickness ecpmin for the handle layer.Type: ApplicationFiled: October 16, 2017Publication date: February 20, 2020Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventors: Adrien GASSE, David HENRY, Bertrand CHAMBION
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Publication number: 20200035864Abstract: The invention relates to a light-emitting device (100) comprising: at least one light-emitting structure (110) comprising a first side and a second side that are essentially parallel; a first electrode (160, 170) making contact, via a contact area, with either one of the first and second sides, the device being characterized in that the first electrode (160, 170) is shaped so as to cause a decrease in, from a first region and in the direction of at least one second region of the contact area, a current density that is liable to flow through the light-emitting structure (110).Type: ApplicationFiled: December 18, 2017Publication date: January 30, 2020Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventors: Bertrand CHAMBION, Adrien GASSE, Marion VOLPERT
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Publication number: 20190371854Abstract: A method for producing a plurality of curved electronic circuits includes: producing a support including a plurality of membranes made from at least one material having a rigidity of more than around 100 MPa, each intended for being part of one of the electronic circuits and having a radius of curvature R between about 15 mm and 500 mm; applying a force to one of the main surfaces of each of the membranes, so that the membrane deforms resiliently and has a substantially planar shape when exposed to the force; rigidly connecting at least one electronic component to each of the membranes; and removing the force applied to one of the main faces of each of the membranes so that each of the membranes retrieves its original radius of curvature R and curves the electronic component according to this radius of curvature R.Type: ApplicationFiled: January 17, 2018Publication date: December 5, 2019Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventors: Bertrand CHAMBION, Emmanuel HUGOT
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Publication number: 20190369157Abstract: An electronic circuit including: an electronic component, a conductive armature surrounding the electronic component, an electrical insulator between the electronic component and the conductive armature, a device configured to measure current passing through the armature or voltage on the armature or on the electronic component, and a defect determination device configured to determine a defect in the electrical insulator based on the measured current or voltage.Type: ApplicationFiled: December 15, 2016Publication date: December 5, 2019Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventor: Bertrand CHAMBION
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Patent number: 10483188Abstract: This method comprises the steps of: a) forming a set of first trenches on the first surface of the wafer; b) forming a set of second trenches on the second surface of the wafer, at least partially facing the first trenches; c) filling the first trenches with a first material having a CTE ?1; d) filling the second trenches with a second material having a CTE ?2, and verifying ?2>?0 or ?2<?0 depending on whether the first material verifies ?1>?0 or ?1<?0.Type: GrantFiled: December 14, 2016Date of Patent: November 19, 2019Assignee: COMMISSARIAT À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventors: Abdenacer Ait-Mani, Bertrand Chambion
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Publication number: 20190342987Abstract: An electronic structure includes a plurality of electronic devices arranged in the form of a matrix array including a first number of rows, the electronic devices of each row being connected in series, the matrix array further including a plurality of switches, the rows of the matrix array being distributed in a second number of groups intended to be connected in series by the switches, the groups connected in series being supplied with an electrical supply current, at least one of the groups including at least two rows connected in parallel so as to distribute the supply current between the at least two rows.Type: ApplicationFiled: December 22, 2017Publication date: November 7, 2019Inventor: Bertrand CHAMBION