Abstract: In a method for reversible assembly of a semiconductor electronic flip-chip device to an electrical interconnecting substrate, a filled thermoplastic adhesive is interposed between an active face of the flip-chip device and a bond site on the substrate. Electrical connection is established between the flip-chip device and the substrate and, generally simultaneously, adhesive bonding between them is established via viscous flow of the filled thermoplastic adhesive above its glass transition temperature, followed by cooling of the adhesive. The adhesive can be reheated to free the flip-chip device of its adhesive bond to the substrate. The filled thermoplastic adhesive includes a low expansion filler in a binder matrix. In accordance with one aspect of the invention, the binder matrix is poly(aryl ether ketone) having the chemical formula ##STR1## where n is from 5 to 150 and R is selected from suitable divalent moieties.