Patents by Inventor Bhulinder Sethi

Bhulinder Sethi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND APPARATUS FOR THERMAL MANAGEMENT OF COMPUTER MEMORY MODULES
    Publication number: 20100296240
    Abstract: A heat spreader and method for thermal management of a computer memory module by promoting natural convection cooling of the memory module. The heat spreader includes a frame surrounding a planar body adapted to be mounted to a memory module of a computer, and a grid defined in the planar body by a plurality of uniformly distributed perforations. The perforations extend through the planar body to allow natural convention between an interior space beneath the planar body and an exterior space above the planar body.
    Type: Application
    Filed: May 20, 2010
    Publication date: November 25, 2010
    Applicant: OCZ TECHNOLOGY GROUP, INC.
    Inventors: Franz Michael Schuette, Ryan M. Petersen, Eric L. Nelson, Bhulinder Sethi
  • Method and apparatus for thermal management of computer memory modules
    Patent number: 7738252
    Abstract: A heat spreader and method for thermal management of a computer memory module by promoting natural convection cooling of the memory module. The heat spreader includes a frame surrounding a planar body adapted to be mounted to a memory module of a computer, and a grid defined in the planar body by a plurality of uniformly distributed perforations. The perforations extend through the planar body to allow natural convention between an interior space beneath the planar body and an exterior space above the planar body.
    Type: Grant
    Filed: January 9, 2007
    Date of Patent: June 15, 2010
    Assignee: OCZ Technology, Group, Inc.
    Inventors: Franz Michael Schuette, Ryan M. Petersen, Eric L. Nelson, Bhulinder Sethi
  • METHOD AND APPARATUS FOR THERMAL MANAGEMENT OF COMPUTER MEMORY MODULES
    Publication number: 20070159789
    Abstract: A heat spreader and method for thermal management of a computer memory module by promoting natural convection cooling of the memory module. The heat spreader includes a frame surrounding a planar body adapted to be mounted to a memory module of a computer, and a grid defined in the planar body by a plurality of uniformly distributed perforations. The perforations extend through the planar body to allow natural convention between an interior space beneath the planar body and an exterior space above the planar body.
    Type: Application
    Filed: January 9, 2007
    Publication date: July 12, 2007
    Applicant: OCZ TECHNOLOGY GROUP, INC.
    Inventors: Franz Schuette, Ryan Petersen, Eric Nelson, Bhulinder Sethi