Abstract: A non-linear side chain liquid crystal polyorganosiloxane differs from previous side chain liquid crystal polyorganosiloxanes. A method for preparing the non-linear side chain liquid crystal polyorganosiloxane involves hydrosilylation reaction of a SiH rich intermediate with an aliphatically unsaturated mesogenic compound. A liquid crystal composition containing the non-linear side chain liquid crystal polyorganosiloxane is useful in dynamic scattering mode electro-optic device for various applications.

Abstract: A non-linear side chain liquid crystal polyorganosiloxane differs from previous side chain liquid crystal polyorganosiloxanes. A method for preparing the non-linear side chain liquid crystal polyorganosiloxane involves hydrosilylation reaction of a SiH rich intermediate with an aliphatically unsaturated mesogenic compound. A liquid crystal composition containing the non-linear side chain liquid crystal polyorganosiloxane is useful in dynamic scattering mode electro-optic device for various applications.

Abstract: Various embodiments disclosed related to UV-curable silicone composition, cured products thereof, and methods of using the same. Various embodiments provide a shear-thinning UV-curable silicone composition. The composition can include (A) a mercapto-functional polyorganosiloxane having the unit formula [(CH3)3SiO1/2]x[(CH3)2SiO]y[R(CH3)SiO]z wherein x is about 0.01 to about 0.1, y is about 0 to about 0.94, z is about 0.05 to about 0.99, and at each occurrence R is independently a mercapto(C1-30)hydrocarbyl group. The composition can include (B) at least one of (B1) a polyorganosiloxane comprising at least two aliphatic unsaturated carbon-carbon bonds, and (B2) an organic molecule comprising at least two aliphatic unsaturated carbon-carbon bonds; the composition can include (C) a filler. The composition can also include (D) a photoinitiator.

Abstract: Various embodiments disclosed related to UV-curable silicone composition, cured products thereof, and methods of using the same. Various embodiments provide a shear-thinning UV-curable silicone composition. The composition can include (A) a mercapto-functional polyorganosiloxane having the unit formula [(CH3)3SiO1/2]x[(CH3)2SiO]y[R(CH3)SiO]z wherein x is about 0.01 to about 0.1, y is about 0 to about 0.94, z is about 0.05 to about 0.99, and at each occurrence R is independently a mercapto(C1-30)hydrocarbyl group. The composition can include (B) at least one of (B1) a polyorganosiloxane comprising at least two aliphatic unsaturated carbon-carbon bonds, and (B2) an organic molecule comprising at least two aliphatic unsaturated carbon-carbon bonds; the composition can include (C) a filler. The composition can also include (D) a photoinitiator.

Abstract: A silicone composition and more particularly to a silicone composition comprising at least one organosilicon compound having an average of at least two silicon-bonded hydrogen atoms per molecule, at least one silicone resin having the formula (R1R4R5SiO1/2)w(R12SiO2/2)x(R4SiO3/2)y(SiO4/2)z (II), wherein R1 is C1 to C10 hydrocarbyl or C1 to C10 halogen-substituted hydrocarbyl, both free of aliphatic unsaturation, R4 is C2 to C4 alkenyl, R5 is R1 or R4, w is from 0.01 to 0.6, x is from 0 to 0.5, y is from 0.1 to 0.95, z is from 0 to 0.4, and w+x+y+z)=1, and a hydrosilylation catalyst; a silicone adhesive comprising a cured product of the silicone composition, and a coated substrate and a laminated substrate, each comprising the silicone adhesive.

Abstract: Vinylhydrogenpolysiloxanes are provided. The vinylhydrogenpolysiloxanes comprise organopolysiloxanes having at least two silicon-bonded hydrogen atoms and at least two silicon-bonded vinyl groups. As a fraction of the total number of silicon atoms in the vinylhydrogenpolysiloxanes, about 25% to about 90% of the silicon atoms are bonded to a hydrogen atom and about 10% to about 45% are bonded to a vinyl group. The ratio of the number of silicon-bonded hydrogen groups to the number of silicon-bonded vinyl groups is about 1.3 to about 6. Also provided are silicone compositions comprising at least one vinylhydrogenpolysiloxane and a hydrosilylation catalyst; silicone adhesives comprising a cured product of at least one vinylhydrogenpolysiloxane; and laminates comprising at least one such silicone adhesive. When subjected to high temperatures or direct flame, the vinylhydrogenpolysiloxanes form chars that retain adhesion to various substrates.

Abstract: A composition includes: (A) an amide-substituted silicone and (B) a thermally conductive filler. The composition may be used as a thermal interface material for dissipating heat from electronic devices.

Abstract: A siloxane resin having the formula: (HSiO3/2)a(RSiO3/2)b(SiO4/2)c where R is Z, Z(CH2)n or ZO(CH2)n where Z is a phenyl or substituted phenyl group; n has a value of 1 to 6, a has value of 0.01 to 0.7, b has a value of 0.05 to 0.7, c has a value of 0.1 to 0.9 and a+b+c?1. The siloxane resins are useful in anti-reflective coating compositions.

Abstract: A silicone composition comprising at least one organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, a cross-linking agent having an average of at least two aliphatic carbon-carbon double bonds per molecule, and a hydrosilylation catalyst; a silicone adhesive comprising a cured product of at least one oganohydrogenpolysiloxane; and a coated substrate and a laminated substrate, each comprising the silicone adhesive.

Abstract: A siloxane resin having the formula: (HSiO3/2)a(RSiO3/2)b(SiO4/2)c where R is Z, Z(CH2)n or ZO(CH2)n where Z is a phenyl or substituted phenyl group; n has a value of 1 to 6, a has value of 0.01 to 0.7, b has a value of 0.05 to 0.7, c has a value of 0.1 to 0.9 and a+b+c?1. The siloxane resins are useful in anti-reflective coating compositions.

Abstract: A silicone composition comprising at least one hydrogenpolysiloxane resin having an average of at least two silicon-bonded hydrogen atoms per molecule, a cross-linking agent having an average of at least two aliphatic carbon-carbon double bonds per molecule, and a hydrosilylation catalyst; a silicone adhesive comprising a cured product of at least one hydrogen-polysiloxane resin; and a coated substrate and a laminated substrate, each comprising the silicone adhesive.

Abstract: Herein we disclose a composition, comprising a siloxane resin having the formula (HSiO3/2)a. (SiO4/2)b(HSiX3/2)c(SiX4/2)d, wherein each X is independently —O—, —OH, or —O—(CH2)m—Zn, wherein each m is independently an integer from 1 to about 5, Z is an 5 aromatic moiety, and each n is independently an integer from 1 to about 6; 0<a<1, 0<b<1, 0<c<1, 0<d<1, and a+b+c+d=1. We also disclose methods for preparing the siloxane resin composition and a method of preparing an anti-reflective coating on a substrate, wherein the anti-reflective coating is derived from the siloxane resin composition.

Abstract: A composition includes: (A) an amide-substituted silicone and (B) a thermally conductive filler. The composition may be used as a thermal interface material for dissipating heat from electronic devices.

Abstract: A siloxane resin having the formula: (HSiO3/2)a(RSiO3/2)b(SiO4/2)c where R is Z, Z(CH2)n or ZO(CH2)n where Z is a phenyl or substituted phenyl group; n has a value of 1 to 6, a has value of 0.01 to 0.7, b has a value of 0.05 to 0.7, c has a value of 0.1 to 0.9 and a+b+c?1. The siloxane resins are useful in anti-reflective coating compositions.

Abstract: Herein we disclose a composition, comprising a siloxane resin having the formula (HsiO3/2)a. (SiO4/2)b(HSiX3/2)c(SiX4/2)d, wherein each X is independently —O—, —OH, or —O—(CH2)m?Zn, wherein each m is independently an integer from 1 to about 5, Z is an 5 aromatic moiety, and each n is independently an integer from 1 to about 6; 0<a<1, 0<b<1, 0<c<1, 0<d<1, and a+b+c+d=1. We also disclose methods for preparing the siloxane resin composition and a method of preparing an anti-reflective coating on a substrate, wherein the anti-reflective coating is derived from the siloxane resin composition.

Abstract: Herein is disclosed a resin solution, comprising (a) about 0.1 solids wt % to about 50 solids wt % of an organosiloxane resin comprising the formula (RSiO3/2)x(R′SiO3/2)y, wherein R is selected from the group consisting of C4-C24 alkyl, C4-C24 alkenyl, C4-C24 alkoxy, C8-C24 alkenoxy, and C4-C24 substituted hydrocarbon; R′ is selected from the group consisting of —H, C1-C4 unsubstituted hydrocarbon, and C1-C4 substituted hydrocarbon; x is from about 5 mole % to about 75 mole %; y is from about 10 mole % to about 95 mole %; and x+y is at least about 40 mole %; and (b) about 50 solids wt % to about 99.9 solids wt % of a resin comprising at least about 90 mole % of the formula HSiO3/2.

Abstract: Herein is disclosed a resin solution, comprising (a) about 0.1 solids wt % to about 50 solids wt % of an organosiloxane resin comprising the formula (RSiO3/2)x(R′SiO3/2)y, wherein R is selected from the group consisting of C4-C24 alkyl, C4-C24 alkenyl, C4-C24 alkoxy, C8-C24 alkenoxy, and C4-C24 substituted hydrocarbon; R′ is selected from the group consisting of —H, C1-C4 unsubstituted hydrocarbon, and C1-C4 substituted hydrocarbon; x is from about 5 mole % to about 75 mole %; y is from about 10 mole % to about 95 mole %; and x+y is at least about 40 mole %; and (b) about 50 solids wt % to about 99.9 solids wt % of a resin comprising at least about 90 mole % of the formula HSiO3/2.

Abstract: Silicone resins having the general formula (R1SiO3/2)x(HSiO3/2)y where R1 is an alkyl group having 8 to 24 carbon atoms; x has a value of 0.05 to 0.7; y has a value of 0.3 to 0.95 and x+y =1. The resins are used to form porous ceramic materials and porous thin films on semiconductor devices.

Abstract: Silicone resins having the general formula (R1SiO3/2)x(HSiO3/2)y where R1 is an alkyl group having 8 to 24 carbon atoms; x has a value of 0.05 to 0.7; y has a value of 0.3 to 0.95 and x+y=1. The resins are used to form porous ceramic materials and porous thin films on semiconductor devices.

Abstract: Nanoporous silicone resins and silicone resin films having low dielectric constants and a method for preparing such nanoporous silicone resins. The silicone resin comprises the reaction product of a mixture comprising (A) 15-70 mol % of a tetraalkoxysilane described by formula Si(OR1)4,  where each R1 is an independently selected alkyl group comprising 1 to about 6 carbon atoms, (B) 12 to 60 mol % of a hydrosilane described by formula HSiX3,  where each X is an independently selected hydrolyzable substituent, (C) 15 to 70 mole percent of an organotrialkoxysilane described by formula R2Si(OR3)3,  where R2 is a hydrocarbon group comprising about 8 to 24 carbon atoms or a substituted hydrocarbon group comprising a hydrocarbon chain having about 8 to 24 carbon atoms and each R3 is an independently selected alkyl group comprising 1 to about 6 carbon atoms; in the presence of (D) water, (E) hydrolysis catalyst, and (F) organic solvent for the reaction product.